公开(公告)号：WO01013416A1

公开(公告)日：2001-02-22

申请号：PCT/US2000/040626

申请日：2000-08-09

IPC分类号： B24B37/04 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  C25D5/00 ,  C25D5/02 ,  C25D5/06 ,  C25D5/22 ,  C25D7/12 ,  C25D17/14 ,  C25F7/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/321 ,  H01L21/768 ,  H01L23/532 ,  H01L23/522

CPC分类号： H01L23/53238 ,  B24B37/042 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  C25D5/00 ,  C25D5/02 ,  C25D5/06 ,  C25D5/22 ,  C25D5/50 ,  C25D7/123 ,  C25D17/14 ,  C25D21/02 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/6715 ,  H01L21/76838 ,  H01L21/76877 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film (18b, 18c) while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a "proximity" plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a "cold worked" manner. In this manner, energy stored in the cold worked regions (19b, 19c) of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.

摘要翻译： 本发明提供了一种用于将导电材料电镀到基底上的方法和装置，并且还在电镀衬底时修饰导电膜（18b，18c）的物理性能。 本发明还提供了一种方法和装置，其以“接近”电镀方式在工件表面上平板化导电材料，同时衬垫型材料或其它固定特征以“冷加工”方式与工件表面接触。 以这种方式，存储在镀层的冷加工区域（19b，19c）中的能量用于加速和增强微结构回收和生长。 因此，在较低的退火温度和较短的退火时间下，在镀覆材料中获得大的晶粒尺寸。

公开(公告)号：WO01009410A1

公开(公告)日：2001-02-08

申请号：PCT/GB2000/002917

申请日：2000-07-28

IPC分类号： C25D7/06 ,  C23C26/00 ,  C23G5/00 ,  C25D5/00 ,  C25F1/00 ,  C25F7/00 ,  C23C4/00

CPC分类号： C25F1/00 ,  C23C26/00 ,  C25D5/00 ,  C25D5/003 ,  C25D5/06

摘要： A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterised in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapour phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium. Apparatus for carrying out the process is also disclosed and in particular an anode assembly (1) which comprises a perforated anode plate (2) which is in communication with a chamber (4) adapted to receive a flow of a liquid electrolyte, means to supply the liquid electrolyte to the said chamber and means (7) to convert the liquid electrolyte received in the said chamber into a foam.

摘要翻译： 一种用于通过布置表面以形成其中阳极（1）保持在超过30V的DC电压和电弧放电（电等离子体）的电解池的阴极来清洁导电表面的方法 ）通过适当地调整操作参数而建立在工件的表面上，其特征在于阳极和阴极之间的工作间隙填充有由包括气体/气相的泡沫（9）组成的导电介质和 液相。 该方法可以适用于通过在导电介质中包括形成涂层所需的种类的离子同时涂覆金属表面。 还公开了用于进行该方法的装置，特别是阳极组件（1），其包括穿孔阳极板（2），其与适于接收液体电解质流动的腔室（4）连通， 所述室内的液体电解质和将所述室中接收的液体电解质转化为泡沫的装置（7）。

公开(公告)号：WO0033356A2

公开(公告)日：2000-06-08

申请号：PCT/US9928106

申请日：1999-11-24

申请人： ACM RES INC ,  WANG HUI ,  GUTMAN FELIX ,  NUCH VOHA

发明人： WANG HUI ,  GUTMAN FELIX ,  NUCH VOHA

IPC分类号： C25D7/12 ,  C25D17/06 ,  C25D17/08 ,  C25D21/10 ,  C25F7/00 ,  H01L21/288 ,  H01L21/3063 ,  H01L21/321 ,  H01L21/687 ,  H01L

CPC分类号： H01L21/68721 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/68785 ,  H01L21/68792

摘要： A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.

摘要翻译： 用于在晶片的电镀和/或电解抛光期间保持晶片的晶片卡盘组件包括用于接收晶片的晶片卡盘。 晶片卡盘组件还包括用于在第一和第二位置之间移动晶片卡盘的致动器组件。 当处于第一位置时，打开晶片卡盘。 当处于第二位置时，晶片卡盘关闭。

公开(公告)号：WO00017422A1

公开(公告)日：2000-03-30

申请号：PCT/US1999/021526

申请日：1999-09-17

IPC分类号： B08B7/00 ,  C25F1/00 ,  C25F7/00 ,  H05K3/26 ,  B23H3/00 ,  B23H5/00 ,  C25F5/00

CPC分类号： C25F1/00 ,  C25F7/00 ,  H05K3/26

摘要： A method and apparatus for cleaning conductive bodies (22) using a basic aqueous disodium phosphate and sodium bicarbonate electrolyte (16). The outside surfaces of a metallic body (22) is cleaned by placing the body (22) in contact with the electrolyte (16) and flowing DC current from an anode (18) to the body (22), which forms a cathode. The body (22) may be immersed in the electrolyte (16) or the electrolyte may be sprayed onto the body.

摘要翻译： 一种使用碱性磷酸二钠和碳酸氢钠电解质（16）清洁导电体（22）的方法和装置。 通过将主体（22）与电解质（16）接触并将直流电流从阳极（18）流动到形成阴极的主体（22）来清洁金属体（22）的外表面。 主体（22）可以浸入电解质（16）中，或者可以将电解质喷涂到主体上。

公开(公告)号：WO00015880A1

公开(公告)日：2000-03-23

申请号：PCT/EP1999/006451

申请日：1999-09-02

IPC分类号： C23C22/34 ,  C23C22/50 ,  C25F1/06 ,  C25F7/00

CPC分类号： C25F1/06

摘要： Process for electolytic pickling of stainless steel of the ferritic, martensitic, austenitic and duplex series, as well as superaustenitic and superferritic steels, Ni or Ni/Cr-based super alloys, and titanium and its alloys, carried out using an electrolytic pickling solution containing: H2SO4 in a concentration of from 20 to 140 g/l and Fe ions in a concentration of from 15 to 80 g/l, the Fe ions being in a quantity corresponding to a Fe /Fe ratio > 1 and preferably > 3.

摘要翻译： 铁素体，马氏体，奥氏体和双相系列不锈钢的电解酸洗工艺，以及超高辉铁矿和超铁素体钢，Ni或Ni / Cr基超级合金以及钛及其合金的使用电解酸洗液 ：浓度为20〜140g / l的H 2 SO 4和浓度为15〜80g / l的Fe 3+离子，Fe 2+离子的量相当于Fe 3+ > / Fe 2+比> 1，优选> 3。

公开(公告)号：WO99046431A1

公开(公告)日：1999-09-16

申请号：PCT/EP1999/001381

申请日：1999-03-05

IPC分类号： A61B17/06 ,  C25F3/16 ,  C25F7/00 ,  B21G1/00

CPC分类号： C25F7/00 ,  A61B17/06066 ,  C25F3/16

摘要： In a process for the electrolytic polishing of surgical needles, a plurality of unfinished needles, which are arranged side by side and are secured to at least one web (6, 7) in their end-regions lying opposite the needle tips, are moved with the help of the web (6, 7) through an acid-containing polishing bath (22) which is electrically connected to an electrode. The web (6, 7) is guided above the polishing bath (22). The unfinished needles dip at least with the needle tips into the polishing bath (22). Above the polishing bath (22) and alongside the web (6, 7), a metal ribbon (40) connected as a counter-electrode provides an electrical connection with the unfinished needles.

摘要翻译： 在外科手术针的电解抛光过程中，将多个未完成的针并排布置并固定在其位于与针尖相对的端部区域中的至少一个腹板（6,7）上，并与 通过与电极电连接的含酸抛光浴（22）来帮助网（6,7）。 网（6,7）被引导到抛光槽（22）的上方。 未完成的针至少用针尖浸入抛光槽（22）中。 在抛光槽（22）上方并且与网（6,7）一起，作为对电极连接的金属带（40）提供与未完成的针的电连接。

公开(公告)号：WO99016936A1

公开(公告)日：1999-04-08

申请号：PCT/US1998/000126

申请日：1998-01-06

IPC分类号： C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D21/06 ,  C25F1/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/677 ,  C25F7/00

CPC分类号： H01L21/67126 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001 ,  H01L21/6719 ,  H01L21/6723 ,  H01L21/67259 ,  H01L21/67769 ,  H01L21/67781

摘要： A system for electroplating a semiconductor wafer which comprises a first electrode in electrical contact with the semiconductor wafer (55) and a second electrode. The first electrode and semiconductor wafer (55) form a cathode. The second electrode forms an anode (100). A reaction cup (205) defines a processing chamber (75). An external electrode (235) is disposed exterior to the reaction cup and positioned for contacting solution exiting the reaction cup. A power supply (255) system is connected to supply to the first and second electrodes and is further connected to render the first electrode an anode and the external electrode a cathode.

摘要翻译： 一种用于电镀半导体晶片的系统，其包括与半导体晶片（55）电接触的第一电极和第二电极。 第一电极和半导体晶片（55）形成阴极。 第二电极形成阳极（100）。 反应杯（205）限定处理室（75）。 外部电极（235）设置在反应杯的外部并且定位成使离开反应杯的溶液接触。 电源（255）系统被连接以供应到第一和第二电极，并进一步连接以使第一电极成为阳极，外部电极成为阴极。

公开(公告)号：WO99013135A1

公开(公告)日：1999-03-18

申请号：PCT/GB1998/002633

申请日：1998-09-04

IPC分类号： G21C19/34 ,  B65D21/00 ,  B65D83/00 ,  C22B34/14 ,  C25D5/18 ,  C25D17/26 ,  G21C19/46 ,  C25F5/00 ,  C25F7/00 ,  C25F1/16 ,  G21F9/28 ,  C25C7/00

CPC分类号： C25D17/26 ,  C22B34/14 ,  C25D5/18 ,  G21C19/46 ,  Y02W30/883

摘要： Electrochemical dissolution, especially of nuclear fuel pins, is performed using a substrate container in the form of a perforate stepped truncated pyramid. The polarity of the electrodes may be reversed during an initial stage of the process, to activate the fuel pins.

摘要翻译： 电化学溶解，特别是核燃料销的电化学溶解是使用穿孔台阶截棱锥形式的基底容器进行的。 在该过程的初始阶段，电极的极性可以反转，以激活燃料销。

公开(公告)号：WO2023085527A1

公开(公告)日：2023-05-19

申请号：PCT/KR2022/004613

申请日：2022-03-31

申请人： 서울대학교 산학협력단

发明人： 차석원 ,  최인원 ,  류상봉 ,  정원엽 ,  김양재

IPC分类号： C25B13/02 ,  C25B9/77 ,  C25B1/04 ,  C23F17/00 ,  C25F3/24 ,  C25F7/00 ,  C23C14/02 ,  C23C14/16 ,  C25B9/23 ,  C25B13/08

摘要： 본 발명은 분리판 제작방법에 관한 것으로서, 본 발명에 따른 분리판 제작방법은 고분자전해질 수전해 장치에 사용되는 분리판 제작방법에 있어서, 스테인리스 스틸을 이용하여 형상을 가공하는 형상 가공 단계, 가공된 형상 표면을 연마하는 연마 단계 및 내부식성이 높은 물질로 연마면을 코팅하는 코팅 단계를 포함하는 것을 특징으로 한다.

公开(公告)号：WO2022195132A1

公开(公告)日：2022-09-22

申请号：PCT/EP2022/057390

申请日：2022-03-21

申请人： C-TECH INNOVATION LIMITED ,  NATIONAL NUCLEAR LABORATORY LIMITED

发明人： BELL, Robert ,  COLLINS, John ,  O'BRIEN, Luke

IPC分类号： C25F3/16 ,  C25F7/00 ,  G21F9/00

摘要： Electrolytic interior surface treatment apparatus (100) for the electrolytic treatment of an internal surface (102) of a metallic pipe (1) includes at least two oppositely polarised electrodes (3, 4). The apparatus (100) includes: an electrically insulating centralisation arrangement (106) to keep, in use, the electrodes (3, 4) centred within the pipe (1); and an electrically insulating flexible connection arrangement (104) located between the two electrodes (3, 4) to permit movement of one electrode relative to the other. The centralisation arrangement (106) includes a plurality of spaced apart centralisation devices (5, 6). Each centralisation device (5, 6) includes an electrically insulating mounting (7) for mounting the respective centralisation device (5, 6) to the apparatus (100). Each centralisation device (5, 6) includes a plurality of flexible elements (108), each of which is fixed to the mounting (7) and extends outwardly from the mounting (7).