公开(公告)号：WO0025564A3

公开(公告)日：2000-08-10

申请号：PCT/JP9905893

申请日：1999-10-25

申请人： MATSUSHITA ELECTRIC IND CO LTD ,  NAKAO OSAMU ,  YOSHIDA NORIAKI ,  TAKEDA TAKESHI

发明人： NAKAO OSAMU ,  YOSHIDA NORIAKI ,  TAKEDA TAKESHI

IPC分类号： H05K13/04

CPC分类号： H05K13/0408 ,  H05K13/0413 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： The component handling tool (14) is moved linearly up and down on a moving mechanism (11) by feedback control of a linear motor (16) for performing pickup and mounting actions of components (3). The linear motor is controlled to effect a downward movement of the component handling tool for bringing the component handling tool or the component held thereby closer to the component or to a mounting object, and upon detecting changes in control information when contact is made with the component or the mounting object, control of the linear motor is switched to a pressing operation, whereby the holding or mounting of the component in a prescribed pressed condition is accomplished.

摘要翻译： 通过线性马达（16）的反馈控制，部件处理工具（14）在移动机构（11）上线性地上下移动，以执行部件（3）的拾取和安装动作。 控制线性马达以实现部件操作工具的向下运动，以使部件操纵工具或被保持的部件更靠近部件或安装对象，并且当检测到与部件接触时控制信息的变化 或安装对象时，线性电动机的控制被切换到按压操作，从而实现了在规定的按压条件下保持或安装部件。

公开(公告)号：WO2007043639A9

公开(公告)日：2007-05-31

申请号：PCT/JP2006320437

申请日：2006-10-13

申请人： FUJIKURA LTD ,  OKAMOTO MASAHIRO ,  ITOU SHOUJI ,  NAKAO OSAMU ,  SUZUKI TAKANAO ,  OKUDE SATOSHI

发明人： OKAMOTO MASAHIRO ,  ITOU SHOUJI ,  NAKAO OSAMU ,  SUZUKI TAKANAO ,  OKUDE SATOSHI

IPC分类号： H05K3/46 ,  H01L23/12

CPC分类号： H05K1/186 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/0058 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A printed wiring board is provided with a base material, which has at least one wiring and is composed of an adhesive insulating base material and a conductive layer formed on one plane of the insulating base material; a penetrating electrode which is connected to the conductive layer, penetrates the insulating base material and is composed of a conductive paste; and an IC chip having a rewiring section. An IC chip is embedded in an interlayer adhesive material of the base material having the wiring, by connecting the rewiring section with the penetrating electrode. A supporting substrate is arranged on a plane opposite to the rewiring section of the IC chip through the adhesive layer, and the rewiring section and the base material having the wiring constitute a rewiring layer. Therefore, the multilayer printed wiring board having fine components mounted thereon is provided by simple process without increasing the cost and deteriorating the yield.

摘要翻译： 印刷电路板设置有基材，该基材具有至少一个布线，并且由粘合绝缘基材和形成在绝缘基材的一个平面上的导电层构成; 连接到导电层的穿透电极穿透绝缘基材并由导电膏组成; 以及具有重新布线部分的IC芯片。 通过将再布线部与贯通电极连接，将IC芯片嵌入到具有布线的基材的层间粘合材料中。 支撑基板通过粘合剂层布置在与IC芯片的重新布线部分相对的平面上，并且具有布线的重新布线部分和基材构成重新布线层。 因此，通过简单的工艺提供具有安装在其上的精细部件的多层印刷线路板，而不会增加成本并降低成品率。