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    METHODS AND APPARATUS FOR THE EVALUATION AND IMPROVEMENT OF MECHANICAL AND THERMAL PROPERTIES OF CNT/CNF ARRAYS
    3.
    发明申请
    METHODS AND APPARATUS FOR THE EVALUATION AND IMPROVEMENT OF MECHANICAL AND THERMAL PROPERTIES OF CNT/CNF ARRAYS 审中-公开
    CNT / CNF阵列的机械和热性能评价与改进方法与装置

    公开(公告)号：WO2008111989A1

    公开(公告)日：2008-09-18

    申请号：PCT/US2007/070899

    申请日：2007-06-11

    Applicant: NANOCONDUCTION, INC. ,  SUHIR, Ephraim ,  XU, Yan ,  ZHANG, Yi

    Inventor： SUHIR, Ephraim ,  XU, Yan ,  ZHANG, Yi

    IPC: G01D1/00

    CPC classification number: G01N3/08 ,  B82Y30/00 ,  G01N2203/028 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/14

    Abstract: A method and apparatus for the evaluation and improvement of the mechanical and thermal properties of carbon-nanotube (CNT) and carbon nanofiber (CNF) arrays grown on a substrate is disclosed. The Young's modulus of a CNT/CNF material is measured by applying an axial compressive force on the CNT/CNF array and measuring the applied forces and the induced displacements. Also disclosed are the evaluation of the nonlinear stress-strain relationship of the CNT/CNF material, increasing of the Young's modulus and decreasing the thermal resistance by application of a compressive load, the application of rapid thermal annealing to improve the quality of the CNT/CNF material and to reduce the interfacial thermal resistance, improvement of the bonding strength of the CNT/CNF array to a substrate, evaluation of the bonding strength of the CNT/CNF array to a substrate, evaluation of the shearing force at failure, and an analytical stress model that enables one to predict the interfacial shearing stress from, the measured force.

    Abstract translation: 公开了一种用于评价和改善在衬底上生长的碳纳米管（CNT）和碳纳米纤维（CNF）阵列的机械和热性质的方法和装置。 CNT / CNF材料的杨氏模量通过在CNT / CNF阵列上施加轴向压力并测量所施加的力和诱发的位移来测量。 还公开了CNT / CNF材料的非线性应力 - 应变关系的评估，通过施加压缩载荷提高杨氏模量和降低热阻，应用快速热退火来提高CNT / CNF材料并降低界面热阻，改善CNT / CNF阵列与基片的结合强度，评估CNT / CNF阵列与基片的接合强度，评估破坏时的剪切力，以及 分析应力模型，可以从测量的力量预测界面剪切应力。

    TEST DEVICE FOR APPLYING AND MEASURING CONTACT PRESSURE ON WIRES
    6.
    发明申请
    TEST DEVICE FOR APPLYING AND MEASURING CONTACT PRESSURE ON WIRES 审中-公开

    公开(公告)号：WO2007022431A3

    公开(公告)日：2007-02-22

    申请号：PCT/US2006/032378

    申请日：2006-08-17

    Applicant: NANOCONDUCTION, INC. ,  SUHIR, Ephraim

    Inventor： SUHIR, Ephraim

    IPC: G01R31/02 ,  F28F7/00

    Abstract: The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems, An apparatus for taking advantage of the characteristics of wires in packaging of a device, such as a semiconductor device, is disclosed, as well as a test device for identifying the accurate contact pressure required in same. Methods for the prediction of such a behavior for pre-buckling, buckling, and post-buckling conditions in wires, carbon nanotubes (CNTs), and similar wire-grid-array (WGA) structures, for example are also disclosed.

    IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS
    7.
    发明申请
    IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS 审中-公开

    公开(公告)号：WO2006130816A3

    公开(公告)日：2006-12-07

    申请号：PCT/US2006/021421

    申请日：2006-05-31

    Applicant: NANOCONDUCTION INC. ,  DANGELO, Carlos ,  PADMAKUMAR, Bala

    Inventor： DANGELO, Carlos ,  PADMAKUMAR, Bala

    IPC: H01L23/42

    Abstract: An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of having formed thereon a plurality of transistors. A plurality of structures within the substrate contain a solid heat conductive media comprising carbon nanotubes and/or a metal, such as copper. At least some of the plurality of structures extend from the back side of the substrate into the substrate. In some embodiments, the carbon nanotubes are formed within the substrate using a catalyst.

    IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS
    8.
    发明申请
    IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS 审中-公开
    用于从集成电路中去除热的芯片结构和方法

    公开(公告)号：WO2006130816A2

    公开(公告)日：2006-12-07

    申请号：PCT/US2006021421

    申请日：2006-05-31

    Applicant: NANOCONDUCTION INC ,  DANGELO CARLOS ,  PADMAKUMAR BALA

    Inventor： DANGELO CARLOS ,  PADMAKUMAR BALA

    CPC classification number: H01L23/373 ,  H01L23/3677 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of having formed thereon a plurality of transistors. A plurality of structures within the substrate contain a solid heat conductive media comprising carbon nanotubes and/or a metal, such as copper. At least some of the plurality of structures extend from the back side of the substrate into the substrate. In some embodiments, the carbon nanotubes are formed within the substrate using a catalyst.

    Abstract translation: 公开了一种用于从集成电路中去除热量的片上系统和方法。 一个实施例是具有前侧和后侧的基板。 基板的前侧能够在其上形成有多个晶体管。 衬底内的多个结构包含包含碳纳米管和/或诸如铜的金属的固体导热介质。 多个结构中的至少一些从衬底的背面延伸到衬底中。 在一些实施方案中，使用催化剂在基材内形成碳纳米管。

    AN INTEGRATED CIRCUIT MICRO-COOLER USING SELF-ASSEMBLED NANO STRUCTURES
    9.
    发明申请
    AN INTEGRATED CIRCUIT MICRO-COOLER USING SELF-ASSEMBLED NANO STRUCTURES 审中-公开

    公开(公告)号：WO2005041256A3

    公开(公告)日：2005-05-06

    申请号：PCT/US2004/027449

    申请日：2004-08-25

    Applicant: NANOCONDUCTION, INC. ,  DANGELO, Carlos

    Inventor： DANGELO, Carlos

    IPC: H01L21/461

    Abstract: Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.

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