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1.发明申请METHODS OF REACTIVE COMPOSITE JOINING WITH MINIMAL ESCAPE OF JOINING MATERIAL 审中-公开反应性复合材料接合与接合材料最小切割方法
公开(公告)号：WO2007127931A2
公开(公告)日：2007-11-08
申请号：PCT/US2007/067653
申请日：2007-04-27
Applicant: REACTIVE NANOTECHNOLOGIES, INC. , VAN HEERDEN, David, P. , RUDE, Timothy, Ryan , NEWSON, Jesse, E. , HE, Zhaojuan , BESNOIN, Etienne , VINCENT, Ramzi , WEIHS, Timothy, P.
Inventor： VAN HEERDEN, David, P. , RUDE, Timothy, Ryan , NEWSON, Jesse, E. , HE, Zhaojuan , BESNOIN, Etienne , VINCENT, Ramzi , WEIHS, Timothy, P.
IPC: H01L23/48
CPC classification number: H01L24/29 , B23K1/0006 , H01L24/16 , H01L24/32 , H01L24/83 , H01L2224/16 , H01L2224/27013 , H01L2224/29101 , H01L2224/29111 , H01L2224/73253 , H01L2224/83051 , H01L2224/838 , H01L2924/00013 , H01L2924/01013 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/1579 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2224/29099
Abstract: The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.
Abstract translation: 本发明人已经观察到，在反应性复合物接合的一些应用中，熔融接合材料的一部分通过接合区域的边缘逸出。 这种逃逸不仅浪费昂贵的材料（例如金或铟），而且还减少了接合区域的最佳厚度。 在某些应用中，这种逃生也存在短路或甚至火灾的风险。 在本发明中，采取两种途径来防止熔融接合材料的逸出对周围环境的损害。 首先，可以通过使用屏障，水坝或类似手段在接头附近捕获或容纳熔融材料来防止逃逸。 其次，通过调节接头内的参数，例如焊料组成，接合压力或RCM厚度，可以减少泄漏。
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公开(公告)号：WO2008079461A3
公开(公告)日：2008-10-09
申请号：PCT/US2007077723
申请日：2007-09-06
Applicant: REACTIVE NANOTECHNOLOGIES INC , DUCKHAM ALAN , WEIHS TIMOTHY P , NEWSON JESSE , LEVIN JONATHAN , VALLIAPPAN SOMASUNDARAM
Inventor： DUCKHAM ALAN , WEIHS TIMOTHY P , NEWSON JESSE , LEVIN JONATHAN , VALLIAPPAN SOMASUNDARAM
IPC: B32B15/00
CPC classification number: B23K1/0006 , B23K1/19 , B23K20/165 , B23K2203/16 , B23K2203/172 , C23C14/3414 , C23C24/04 , C23C28/321 , C23C28/345 , H05K3/3463 , H05K3/3494 , H05K2203/0405 , H05K2203/1163 , Y10T428/12493
Abstract: A process and apparatus for the reactive multilayer joining of components utilizing metallization techniques to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.
Abstract translation: 一种利用金属化技术对部件进行反应性多层连接以将难以湿润的材料和温度敏感材料粘合以产生连接产品的方法和装置。
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公开(公告)号：WO2008079461A2
公开(公告)日：2008-07-03
申请号：PCT/US2007/077723
申请日：2007-09-06
Applicant: REACTIVE NANOTECHNOLOGIES, INC. , DUCKHAM, Alan , WEIHS, Timothy, P. , NEWSON, Jesse , LEVIN, Jonathan , VALLIAPPAN, Somasundaram
Inventor： DUCKHAM, Alan , WEIHS, Timothy, P. , NEWSON, Jesse , LEVIN, Jonathan , VALLIAPPAN, Somasundaram
CPC classification number: B23K1/0006 , B23K1/19 , B23K20/165 , B23K2203/16 , B23K2203/172 , C23C14/3414 , C23C24/04 , C23C28/321 , C23C28/345 , H05K3/3463 , H05K3/3494 , H05K2203/0405 , H05K2203/1163 , Y10T428/12493
Abstract: A process and apparatus for the reactive multilayer joining of components utilizing metallization techniques to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.
Abstract translation: 用于使用金属化技术的部件的反应性多层接合方法和装置，以将难以湿的材料和温度敏感的材料粘合以产生连接的产品。
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Patent Agency Ranking4.发明申请METHOD FOR FABRICATING LARGE DIMENSION BONDS USING REACTIVE MULTILAYER JOINING 审中-公开使用反应多层接合制作大尺寸的方法
公开(公告)号：WO2007123530A1
公开(公告)日：2007-11-01
申请号：PCT/US2006/015387
申请日：2006-04-25
Applicant: REACTIVE NANOTECHNOLOGIES, INC , DUCKHAM, Alan , NEWSON, Jesse, E. , BROWN, Michael, V. , RUDE, Timothy, Ryan , KNIO, Omar, M. , HEIAN, Ellen, M. , SUBRAMANIAN, Jai, S.
Inventor： DUCKHAM, Alan , NEWSON, Jesse, E. , BROWN, Michael, V. , RUDE, Timothy, Ryan , KNIO, Omar, M. , HEIAN, Ellen, M. , SUBRAMANIAN, Jai, S.
CPC classification number: B23K20/16 , B23K20/165 , B23K2203/10 , B23K2203/12 , B23K2203/14 , C06B45/14
Abstract: A method for joining component bodies (10A, 10B) of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets (12) of reactive composite materials between the bodies and adjacent sheets of fusible material (14A, 14B). The contiguous sheets (12) of the reactive composite material are operatively connected by an ignitable bridging material (22) so that an igniting reaction in one sheet (12) will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets (12) of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material (14A, 14B) and forming a bond between the component bodies (10A, 10B).
Abstract translation: 一种用于通过在本体和相邻的可熔材料片（14A，14B）之间设置多个基本上邻接的反应性复合材料片（12），从而在大尺寸的接合区域上接合材料的组分体（10A，10B）的方法。 反应性复合材料的邻接片材（12）通过可点燃的桥接材料（22）可操作地连接，使得一片（12）中的点燃反应将在另一片材中引起点燃反应。 施加均匀的压力和一个或多个邻接的反应性复合材料片（12）的点燃引起放热热反应传播通过接合区域，熔化任何相邻的可熔材料片（14A，14B）并形成 组件主体（10A，10B）之间的连接。
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5.发明申请METHODS AND DEVICE FOR CONTROLLING PRESSURE THROUGH A COMPLIANT ELEMENT IN REACTIVE MULTILAYER JOINING AND RESULTING PRODUCT JOINED ACCORDING TO THIS METHOD 审中-公开通过合适的元件控制压力的方法和装置在反应性多层接合中和根据该方法接合的结果产物
公开(公告)号：WO2005046921A1
公开(公告)日：2005-05-26
申请号：PCT/US2004/036490
申请日：2004-11-03
Applicant: REACTIVE NANOTECHNOLOGIES, INC. , VAN HEERDEN, David , NEWSON, Jesse , RUDE, Timothy , KNIO, Omar, M. , WEIHS, Timothy, P.
Inventor： VAN HEERDEN, David , NEWSON, Jesse , RUDE, Timothy , KNIO, Omar, M. , WEIHS, Timothy, P.
IPC: B23K1/00
CPC classification number: B23K35/007 , B23K1/0006 , B23K1/0008 , B23K1/19 , B23K3/087 , B23K35/001 , B23K35/0238 , B23K35/0272 , B23K35/34 , C06B45/14
Abstract: The invention includes a method of joining two components (102 103). The Method includes providing at least two components (102, 103) to be joined, a reactive multilayer foil (101), and a compliant element (2), placing the reactive multilayer foil (101) between the at least two components (102, 103), applying pressure on the two components (102, 103) in contact with the reactive multilayer foil (101) via the compliant element (2), and initiating a chemical transformation of the reactive multilayer foil (101) so as to physically join the at least two components (102, 103). The invention also includes two components (102, 103) joined using the aforementioned method.
Abstract translation: 本发明包括一种连接两个部件（102 103）的方法。 该方法包括提供要连接的至少两个组件（102,103），反应性多层箔（101）和柔顺元件（2），将反应性多层箔（101）放置在至少两个组件（102,103） 103），通过柔性元件（2）对与反应性多层箔（101）接触的两个部件（102,103）施加压力，并且启动反应性多层箔（101）的化学转化，以物理连接 所述至少两个部件（102,103）。 本发明还包括使用上述方法连接的两个部件（102,103）。
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公开(公告)号：WO2009002852A3
公开(公告)日：2008-12-31
申请号：PCT/US2008/067695
申请日：2008-06-20
Applicant: REACTIVE NANOTECHNOLOGIES, INC. , WEIHS, Timothy, P. , DUCKHAM, Alan , NEWSON, Jesse, E. , LUNKING, David
Inventor： WEIHS, Timothy, P. , DUCKHAM, Alan , NEWSON, Jesse, E. , LUNKING, David
Abstract: A method for bonding components with a reactive multilayer foil, wherein during bonding, the components are held at a temperature or temperature gradient chosen to reduce thermal stress in the resulting bonded product.
Abstract translation: 一种用于将组件与反应性多层箔粘合的方法，其中在粘合期间，所述组件保持在选定的温度或温度梯度下以降低所得粘合产品中的热应力。
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公开(公告)号：WO2009002852A2
公开(公告)日：2008-12-31
申请号：PCT/US2008067695
申请日：2008-06-20
Applicant: REACTIVE NANOTECHNOLOGIES INC , WEIHS TIMOTHY P , DUCKHAM ALAN , NEWSON JESSE E , LUNKING DAVID
Inventor： WEIHS TIMOTHY P , DUCKHAM ALAN , NEWSON JESSE E , LUNKING DAVID
CPC classification number: C23C14/3407 , Y10T428/12493
Abstract: A method for bonding components with a reactive multilayer foil, wherein during bonding, the components are held at a temperature or temperature gradient chosen to reduce thermal stress in the resulting bonded product.
Abstract translation: 用于将组分与反应性多层箔结合的方法，其中在粘合期间，将组分保持在选择的温度或温度梯度以降低所得结合产物中的热应力。
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8.发明申请METHODS OF REACTIVE COMPOSITE JOINING WITH MINIMAL ESCAPE OF JOINING MATERIAL 审中-公开反应性复合材料接合与接合材料最小切割方法
公开(公告)号：WO2007127931A3
公开(公告)日：2008-03-13
申请号：PCT/US2007067653
申请日：2007-04-27
Applicant: REACTIVE NANOTECHNOLOGIES INC , VAN HEERDEN DAVID P , RUDE TIMOTHY RYAN , NEWSON JESSE E , HE ZHAOJUAN , BESNOIN ETIENNE , VINCENT RAMZI , WEIHS TIMOTHY P
Inventor： VAN HEERDEN DAVID P , RUDE TIMOTHY RYAN , NEWSON JESSE E , HE ZHAOJUAN , BESNOIN ETIENNE , VINCENT RAMZI , WEIHS TIMOTHY P
IPC: B23K31/00
CPC classification number: H01L24/29 , B23K1/0006 , H01L24/16 , H01L24/32 , H01L24/83 , H01L2224/16 , H01L2224/27013 , H01L2224/29101 , H01L2224/29111 , H01L2224/73253 , H01L2224/83051 , H01L2224/838 , H01L2924/00013 , H01L2924/01013 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/1579 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2224/29099
Abstract: The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.
Abstract translation: 本发明人已经观察到，在反应性复合物接合的一些应用中，熔融接合材料的一部分通过接合区域的边缘逸出。 这种逃逸不仅浪费昂贵的材料（例如金或铟），而且还减少了接合区域的最佳厚度。 在某些应用中，这种逃生也存在短路或甚至火灾的风险。 在本发明中，采取两种途径来防止熔融接合材料的逸出对周围环境的损害。 首先，可以通过使用屏障，水坝或类似手段在接头附近捕获或容纳熔融材料来防止逃逸。 其次，通过调节接头内的参数，例如焊料组成，接合压力或RCM厚度，可以减少泄漏。
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