公开(公告)号：WO2008057770A3

公开(公告)日：2008-05-15

申请号：PCT/US2007/082423

申请日：2007-10-24

Applicant: UNISEM (MAURITIUS) HOLDINGS LIMITED ,  UNISEM (SUNNYVALE), INC. ,  RAMOS, Mary, Jean ,  SUBAGIO, Anang ,  SIMPORIOS GUIRIT, Lynn ,  SAN ANTONIO, Romarico, Santos

Inventor： RAMOS, Mary, Jean ,  SUBAGIO, Anang ,  SIMPORIOS GUIRIT, Lynn ,  SAN ANTONIO, Romarico, Santos

IPC: H01L23/495 ,  H01L21/48

Abstract: A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.

公开(公告)号：WO2008057770A9

公开(公告)日：2008-08-21

申请号：PCT/US2007082423

申请日：2007-10-24

Applicant: UNISEM MAURITIUS HOLDINGS LTD ,  UNISEM SUNNYVALE INC ,  RAMOS MARY JEAN ,  SUBAGIO ANANG ,  SIMPORIOS GUIRIT LYNN ,  SAN ANTONIO ROMARICO SANTOS

Inventor： RAMOS MARY JEAN ,  SUBAGIO ANANG ,  SIMPORIOS GUIRIT LYNN ,  SAN ANTONIO ROMARICO SANTOS

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/3107 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/371 ,  H01L2224/37139 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48711 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48811 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2075

Abstract: A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.

Abstract translation: 一种制造引线框架的方法和具有接近芯片级封装引线计数的部分图案化引线框架封装的方法，其中该方法有助于更好地自动化生产线，并提高由其产生的封装的质量和可靠性。 制造工艺步骤的主要部分是在一侧形成为网状引线框架的部分图案化的金属条进行的，使得网状引线框架也是刚性机械地和坚固的，以在没有变形或变形的情况下执行 芯片级和封装级别的芯片连接和引线键合工艺。 金属引线框架的底侧被图案化以隔离芯片焊盘，并且只有在包括芯片和电线在内的前侧之后，用密封剂气密地密封引线接合触点。 所得的封装电隔离使得能够进行条带测试和可靠的分割。

公开(公告)号：WO2008057770A2

公开(公告)日：2008-05-15

申请号：PCT/US2007082423

申请日：2007-10-24

Applicant: UNISEM MAURITIUS HOLDINGS LTD ,  UNISEM SUNNYVALE INC ,  RAMOS MARY JEAN ,  SUBAGIO ANANG ,  SIMPORIOS GUIRIT LYNN ,  SAN ANTONIO ROMARICO SANTOS

Inventor： RAMOS MARY JEAN ,  SUBAGIO ANANG ,  SIMPORIOS GUIRIT LYNN ,  SAN ANTONIO ROMARICO SANTOS

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/3107 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/371 ,  H01L2224/37139 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48711 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48811 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2075

Abstract: A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.