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    FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING
    3.
    发明申请
    FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING 审中-公开
    翻转芯片与小钝化层开口互连

    公开(公告)号：WO2008001282A3

    公开(公告)日：2008-02-21

    申请号：PCT/IB2007052389

    申请日：2007-06-20

    Applicant: KONINKL PHILIPS ELECTRONICS NV ,  SUDOL WOJTEK

    Inventor： SUDOL WOJTEK

    IPC: H01L23/485 ,  A61B8/12

    CPC classification number: H01L24/10 ,  A61B8/12 ,  A61B8/4488 ,  H01L24/13 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: A flip-chip electrical coupling (100, 200, 300) is formed between first and second electrical components (110, 180; 410, 480). The coupling (100, 200, 300) includes a bump (240, 340) and a contact pad (315). The first electrical component (110, 210, 310, 410) includes the contact pad (315) electrically coupled to the first electrical component (110, 210, 310, 410) and a passivation layer (130, 230, 330) overlying the first electrical component (110, 210, 310, 410) and the contact pad (315). The passivation layer (130, 230, 330) is arranged having an opening (120, 220, 320) positioned over the contact pad (315). A bump (240, 340) is positioned overlying the opening (120, 220, 320) and substantially overlying the passivation layer (130, 230, 330). The bump (240, 340) is formed to be in electrical contact with the contact pad (315). The bump (240, 340) is arranged to couple the first and second electrical components (110, 180; 410, 480) during the flip-chip coupling process.

    Abstract translation: 在第一和第二电部件（110,180; 410,480）之间形成倒装芯片电耦合（100,200,300）。 耦合器（100,200,300）包括凸块（240,340）和接触垫（315）。 第一电部件（110,210,310,410）包括电联接到第一电部件（110,210,310,410）的接触垫（315）和覆盖第一电部件（110,210,310,410）的钝化层（130,230,330） 电部件（110,210,310,410）和接触垫（315）。 钝化层（130,230,330）被布置为具有定位在接触焊盘（315）上方的开口（120,220,320）。 凸块（240,340）位于开口（120,220,320）上并且基本上覆盖钝化层（130,230,330）。 凸块（240,340）形成为与接触焊盘（315）电接触。 凸块（240,340）被布置为在倒装芯片耦合处理期间耦合第一和第二电部件（110,180; 410,480）。

    ACOUSTIC IMAGING APPARATUS WITH HANDS-FREE CONTROL
    4.
    发明申请
    ACOUSTIC IMAGING APPARATUS WITH HANDS-FREE CONTROL 审中-公开
    具有免提控制的声学成像设备

    公开(公告)号：WO2010018532A3

    公开(公告)日：2010-06-24

    申请号：PCT/IB2009053515

    申请日：2009-08-10

    Applicant: KONINKL PHILIPS ELECTRONICS NV ,  SUDOL WOJTEK

    Inventor： SUDOL WOJTEK

    IPC: A61B8/00 ,  G06K9/00 ,  H01H3/14

    CPC classification number: G06F3/011 ,  A61B8/00 ,  A61B8/461 ,  A61B8/467 ,  G06F3/012 ,  G06F3/0334

    Abstract: An acoustic imaging apparatus (100, 200, 300, 400) includes an acoustic probe (110) adapted to receive an acoustic signal, an acoustic signal processor (120) adapted to receive and process the acoustic signal from the acoustic probe, a display (130) for displaying images in response to the processed acoustic signal, and a non-manual control device (160, 160a, 160b, 160c). The acoustic imaging apparatus (100, 200, 300, 400) is adapted to control at least one of the acoustic probe (110), the acoustic signal processor (120) and the display 9130) in response to at least one signal from the non-manual control device (160, 160a, 160b, 160c). The non-manual control device (160, 160a, 160b, 160c) is either operated by a human foot, or mounted on a human head and operated by movement of the human head.

    Abstract translation: 声学成像装置（100,200,300,400）包括适于接收声学信号的声学探针（110），适于接收和处理来自声学探针的声学信号的声学信号处理器（120），显示器 130），用于响应于处理后的声信号显示图像;以及非手动控制装置（160,160a，160b，160c）。 声学成像设备（100,200,300,400）适于响应于来自非声学探测器（110），声学信号处理器（120）和显示器9130的至少一个信号来控制声学探测器 - 手动控制装置（160,160a，160b，160c）。 非手动控制装置（160,160a，160b，160c）或者由人脚操作，或者安装在人的头部上并且通过人体头部的移动来操作。

    ULTRASOUND TRANSDUCER FEATURING A PITCH INDEPENDENT INTERPOSER AND METHOD OF MAKING THE SAME
    5.
    发明申请
    ULTRASOUND TRANSDUCER FEATURING A PITCH INDEPENDENT INTERPOSER AND METHOD OF MAKING THE SAME 审中-公开
    具有间距独立插入器的超声换能器及其制造方法

    公开(公告)号：WO2008012748A3

    公开(公告)日：2008-03-27

    申请号：PCT/IB2007052905

    申请日：2007-07-20

    Applicant: KONINKL PHILIPS ELECTRONICS NV ,  WEEKAMP JOHANNUS W ,  PETERS SAMUEL R ,  DAVIDSEN RICHARD E ,  SUDOL WOJTEK

    Inventor： WEEKAMP JOHANNUS W ,  PETERS SAMUEL R ,  DAVIDSEN RICHARD E ,  SUDOL WOJTEK

    IPC: B06B1/06

    CPC classification number: H01L25/16 ,  H01L2924/0002 ,  H04R1/06 ,  H04R2217/03 ,  Y10T29/42 ,  Y10T29/49005 ,  H01L2924/00

    Abstract: An ultrasound transducer 10 comprises an application specific integrated circuit (ASIC) 14, an array of acoustic elements 20, and a pitch independent interposer 12. The ASIC 14 includes a plurality of contact pads 16 on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements 22 of the array 20 are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer 12 features a plurality of conductive elements 26 separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch. The pitch independent interposer 26 is electrically coupled (i) on a first side to the ASIC via a first subset of the plurality of conductive elements and (ii) on a second side to the array of acoustic elements via a second subset of the plurality of conductive elements, wherein one or more of the plurality of conductive elements 26 electrically couples a contact pad 16 of the ASIC 14 with a corresponding acoustic element 22 of the array 20 of acoustic elements.

    Abstract translation: 超声波换能器10包括专用集成电路（ASIC）14，声学元件20的阵列和不依赖于音高的中介层12. ASIC 14包括ASIC的表面上的多个接触垫16，其与相邻的 以第一音调播放。 阵列20的声学元件22与相邻的声学元件分开第二间距。 另外，独立于节距的内插器12具有多个导电元件26，导电元件26以与第一间距和第二间距不同的第三间距与相邻的导电元件分开。 不依赖于音调的内插器26经由多个导电元件的第一子集在第一侧上与ASIC耦合，并且（ii）在第二侧上经由多个传导元件的第二子集与声学元件阵列电耦合 导电元件，其中多个导电元件26中的一个或多个导电元件26将ASIC 14的接触垫16与声学元件阵列20的对应声学元件22电耦合。

    REDISTRIBUTION INTERCONNECT FOR MICROBEAMFORMER(S) AND A MEDICAL ULTRASOUND SYSTEM
    6.
    发明申请
    REDISTRIBUTION INTERCONNECT FOR MICROBEAMFORMER(S) AND A MEDICAL ULTRASOUND SYSTEM 审中-公开
    微生物与医疗超声系统的重新分配互连

    公开(公告)号：WO2006075283A2

    公开(公告)日：2006-07-20

    申请号：PCT/IB2006050078

    申请日：2006-01-09

    Applicant: KONINKL PHILIPS ELECTRONICS NV ,  DAVIDSEN RICHARD ,  ROBINSON ANDREW L ,  SUDOL WOJTEK

    Inventor： DAVIDSEN RICHARD ,  ROBINSON ANDREW L ,  SUDOL WOJTEK

    CPC classification number: H01L41/08 ,  B06B1/0622 ,  G01S7/5208 ,  G01S15/8925 ,  Y10T29/49005

    Abstract: An ultrasound transducer includes one or more microbeamformer integrated circuit chips, an array of acoustic elements, and a redistribution interconnect coupled via conductive elements between the one or more integrated circuit chips and the array of acoustic elements. The one or more microbeamformer integrated circuit chips each include a plurality of bond pads separated from adjacent ones thereof by a first pitch set. The acoustic elements of the array are separated from adjacent ones thereof by a second pitch set, the second pitch set being different from the first pitch set. In addition, the redistribution interconnect couples on a first side of the redistribution interconnect to the one or more microbeamformer integrated circuit chips via conductive elements. The redistribution interconnect couples on a second side to the array of transducer elements via conductive elements. The redistribution interconnect provides an interconnection between the bond pads of the one or more microbeamformer integrated circuit chips with the first pitch set with corresponding ones of the acoustic elements of the array with the second pitch set.

    Abstract translation: 超声换能器包括一个或多个微波束形成器集成电路芯片，声学元件阵列，以及通过一个或多个集成电路芯片和声学元件阵列之间的导电元件耦合的再分配互连。 所述一个或多个微波束形成器集成电路芯片各自包括通过第一间距集合与其相邻的接合焊盘分离的多个接合焊盘。 阵列的声学元件与其相邻的声学元件分离第二间距组，第二音调组与第一音高组不同。 此外，再分配互连通过导电元件将再分配互连的第一侧耦合到一个或多个微波束形成器集成电路芯片。 再分配互连通过导电元件将第二侧耦合到换能器元件阵列。 再分配互连提供了一个或多个微波束形成器集成电路芯片的接合焊盘与第一间距集合之间的互连，其中阵列的相应的声学元件具有第二间距集合。

    COMPOSITE ACOUSTIC BACKING WITH HIGH THERMAL CONDUCTIVITY FOR ULTRASOUND TRANSDUCER ARRAY
    7.
    发明申请
    COMPOSITE ACOUSTIC BACKING WITH HIGH THERMAL CONDUCTIVITY FOR ULTRASOUND TRANSDUCER ARRAY 审中-公开
    用于超声换能器阵列的具有高导热率的复合声学背衬

    公开(公告)号：WO2012123906A3

    公开(公告)日：2012-11-15

    申请号：PCT/IB2012051205

    申请日：2012-03-14

    Applicant: KONINKL PHILIPS ELECTRONICS NV ,  DAVIDSEN RICHARD EDWARD ,  SUDOL WOJTEK

    Inventor： DAVIDSEN RICHARD EDWARD ,  SUDOL WOJTEK

    IPC: G10K11/00 ,  B06B1/06

    CPC classification number: A61B8/4494 ,  A61B8/4483 ,  B06B1/0629 ,  G10K11/002

    Abstract: A backing block for an ultrasonic transducer array stack of an ultrasound probe is formed as a composite structure of material of high thermal conductivity in which is embedded a structure of acoustic dampening material. In a constructed embodiment the composite structure is formed from a block of thermally conductive graphite in which a plurality of cylindrical holes are formed which are filled with acoustic dampening material. The holes are angled in relation to the Z-axis direction from the rear of the transducer stack so that reverberation energy traveling in that direction will encounter acoustic dampening material. The graphite around the holes is effective to conduct heat to the rear of the probe and away from the transducer stack and its ASIC.

    Abstract translation: 用于超声波探头的超声波换能器阵列堆叠的支撑块形成为其中嵌入消声材料结构的高导热性材料的复合结构。 在构造的实施例中，复合结构由导热石墨块形成，其中形成有填充有消声材料的多个圆柱形孔。 这些孔相对于从换能器堆叠后面的Z轴方向倾斜，以便在该方向上传播的混响能量将遇到消声材料。 孔周围的石墨可有效地将热量传导到探头的后部，并远离换能器叠层和ASIC。

    2D ULTRASOUND TRANSDUCER FOR RADIAL APPLICATION AND METHOD
    8.
    发明申请
    2D ULTRASOUND TRANSDUCER FOR RADIAL APPLICATION AND METHOD 审中-公开
    用于径向应用和方法的二维超声波传感器

    公开(公告)号：WO2007046064A3

    公开(公告)日：2007-11-22

    申请号：PCT/IB2006053842

    申请日：2006-10-18

    Applicant: KONINKL PHILIPS ELECTRONICS NV ,  SUDOL WOJTEK

    Inventor： SUDOL WOJTEK

    IPC: B06B1/06

    CPC classification number: B06B1/0633 ,  A61B8/483

    Abstract: The present invention relates to an apparatus and a method for obtaining a 3D image in radial applications, typically endorectal imaging where the object of interrogation is the rectal wall, in particular, the present invention is related a two dimensional (2D) acoustic array transducer that is wrapped around a cylindrically shaped probe so that the 2D array is capable of steering the beam radially and axially to obtain a precise 3D data acquisition of the object of interrogation.

    Abstract translation: 本发明涉及用于在径向应用中获得3D图像的装置和方法，通常是询问对象是直肠壁的直肠内成像，特别是本发明涉及二维（2D）声阵列换能器 缠绕在圆柱形探针上，使得2D阵列能够径向和轴向地转向光束，以获得询问对象的精确3D数据采集。

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