公开(公告)号：WO2013032725A3

公开(公告)日：2013-04-25

申请号：PCT/US2012051183

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

Inventor： PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

IPC: H01L23/053 ,  B81C1/00 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L25/065 ,  H01L25/10 ,  H01L27/146 ,  H01L31/048 ,  H05K3/42

CPC classification number: H01L23/10 ,  B81B7/007 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L23/053 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）设备的玻璃封装的系统，方法和设备。 在一个方面，玻璃封装可以包括玻璃基板，盖玻璃以及封装在玻璃基板和盖玻璃之间的一个或多个装置。 可以用诸如环氧树脂的粘合剂或金属结合环将覆盖玻璃结合到玻璃基板。 玻璃封装还可以包括一个或多个装置与封装外部之间的一个或多个信号传输路径。 在一些实施方式中，包括EMS和/或IC装置的玻璃封装被配置为通过表面安装技术直接附接到印刷电路板（PCB）或其他集成基板。

公开(公告)号：WO2013032725A2

公开(公告)日：2013-03-07

申请号：PCT/US2012/051183

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  PETERSEN, Kurt Edward ,  SHENOY, Ravindra V. ,  BLACK, Justin Phelps ,  BURNS, David William ,  GANAPATHI, Srinivasan Kodaganallur ,  STEPHANOU, Philip Jason ,  BUCHAN, Nicholas, Ian

Inventor： PETERSEN, Kurt Edward ,  SHENOY, Ravindra V. ,  BLACK, Justin Phelps ,  BURNS, David William ,  GANAPATHI, Srinivasan Kodaganallur ,  STEPHANOU, Philip Jason ,  BUCHAN, Nicholas, Ian

IPC: H01L23/053 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L25/065 ,  H01L25/10 ,  H01L27/146 ,  H01L31/048 ,  H05K3/42 ,  B81C1/00

CPC classification number: H01L23/10 ,  B81B7/007 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L23/053 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。 覆盖玻璃可以用诸如环氧树脂或金属粘结环的粘合剂结合到玻璃基板上。 玻璃包装还可以包括在一个或多个装置和包装外部之间的一个或多个信号传输路径。 在一些实施方案中，包括EMS和/或IC器件的玻璃封装被配置为通过表面贴装技术直接附接到印刷电路板（PCB）或其它集成基板。

公开(公告)号：WO2005069914A2

公开(公告)日：2005-08-04

申请号：PCT/US2005001551

申请日：2005-01-18

Applicant: FORMFACTOR INC ,  SHINDE MAKARAND S ,  LARDER RICHARD A ,  COOPER TIMOTHY E ,  SHENOY RAVINDRA V ,  ELDRIDGE BENJAMIN N

Inventor： SHINDE MAKARAND S ,  LARDER RICHARD A ,  COOPER TIMOTHY E ,  SHENOY RAVINDRA V ,  ELDRIDGE BENJAMIN N

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2889 ,  G01R1/07378

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface

Abstract translation: 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探针负载; 和/或（5）高刚性界面

公开(公告)号：WO2005069914A3

公开(公告)日：2005-08-04

申请号：PCT/US2005/001551

申请日：2005-01-18

Applicant: FORMFACTOR, INC. ,  SHINDE, Makarand, S. ,  LARDER, Richard, A. ,  COOPER, Timothy, E. ,  SHENOY, Ravindra, V. ,  ELDRIDGE, Benjamin, N.

Inventor： SHINDE, Makarand, S. ,  LARDER, Richard, A. ,  COOPER, Timothy, E. ,  SHENOY, Ravindra, V. ,  ELDRIDGE, Benjamin, N.

IPC: G01R31/02

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface

公开(公告)号：WO2013032728A3

公开(公告)日：2013-07-25

申请号：PCT/US2012051216

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

Inventor： PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

IPC: B81B7/00

CPC classification number: B81B7/0067 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0109 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  Y10T29/5313 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）设备的玻璃封装的系统，方法和设备。 在一个方面中，玻璃封装件可以包括玻璃基板，覆盖玻璃，封装在玻璃基板与盖玻璃之间的一个或多个器件，以及被配置成附接到柔性连接器并且与封装器件电连通的接合焊盘。 在一些实施方式中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的电部件，例如集成电路（IC）器件或PCB。

公开(公告)号：WO2013032726A3

公开(公告)日：2013-04-25

申请号：PCT/US2012051196

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

Inventor： PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

IPC: H01L23/053 ,  B81C1/00 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L25/065 ,  H01L25/10 ,  H01L27/146 ,  H01L31/048 ,  H05K3/42

CPC classification number: H01L23/053 ,  B81B2201/047 ,  B81C1/0023 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14609 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）设备的玻璃封装的系统，方法和设备。 在一个方面，制造玻璃封装包括将覆盖玻璃面板接合到玻璃基板面板，并且将接合面板分割以形成单独的玻璃封装，每个玻璃封装包括一个或多个封装装置和一个或多个信号传输路径。 另一方面，玻璃封装件可以包括玻璃基板，盖玻璃以及封装在玻璃基板和盖玻璃之间的一个或多个装置。

公开(公告)号：WO2013032726A2

公开(公告)日：2013-03-07

申请号：PCT/US2012/051196

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  PETERSEN, Kurt, Edward ,  SHENOY, Ravindra, V. ,  BLACK, Justin, Phelps ,  BURNS, David, William ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason ,  BUCHAN, Nicholas, Ian

Inventor： PETERSEN, Kurt, Edward ,  SHENOY, Ravindra, V. ,  BLACK, Justin, Phelps ,  BURNS, David, William ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason ,  BUCHAN, Nicholas, Ian

IPC: H01L23/053

CPC classification number: H01L23/053 ,  B81B2201/047 ,  B81C1/0023 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14609 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，制造玻璃封装包括将盖玻璃面板接合到玻璃基板面板，以及将接合的面板分开以形成各自包括一个或多个封装装置和一个或多个信号传输路径的单独的玻璃封装。 在另一方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。

公开(公告)号：WO2012040063A1

公开(公告)日：2012-03-29

申请号：PCT/US2011/052017

申请日：2011-09-16

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  BLACK, Justin, Phelps ,  SHENOY, Ravindra, V. ,  GOUSEV, Evgeni, Petrovich ,  HADJICHRISTOS, Aristotele ,  MYERS, Thomas, Andrew ,  KIM, Jonghae ,  VELEZ, Mario, Francisco ,  LAN, Je-Hsiung, Jeffrey ,  LO, Chi, Shun

Inventor： BLACK, Justin, Phelps ,  SHENOY, Ravindra, V. ,  GOUSEV, Evgeni, Petrovich ,  HADJICHRISTOS, Aristotele ,  MYERS, Thomas, Andrew ,  KIM, Jonghae ,  VELEZ, Mario, Francisco ,  LAN, Je-Hsiung, Jeffrey ,  LO, Chi, Shun

IPC: H01L21/56 ,  G02B26/00

CPC classification number: G02B26/001 ,  H01L21/565 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.

Abstract translation: 本公开提供了用于组合沉积在第一衬底上的器件与形成在第二衬底（例如半导体衬底或玻璃衬底）上的集成电路的系统，方法和装置。 第一基板可以是玻璃基板。 第一衬底可以包括导电通孔。 功率组合器电路可以沉积在第一衬底的第一侧上。 功率组合器电路可以包括沉积在第一衬底的至少第一侧上的无源器件。 集成电路可以包括设置在功率合成器电路上并被配置为与功率组合器电路电连接的功率放大器电路，以形成功率放大系统。 导电通孔可以包括被配置为用于传导来自功率放大系统的热的热通孔和/或配置用于功率放大系统和第一衬底的第二侧上的导体之间的电连接的互连通孔。

公开(公告)号：WO2013036480A3

公开(公告)日：2013-09-26

申请号：PCT/US2012053661

申请日：2012-09-04

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  SHENOY RAVINDRA V ,  MIGNARD MARC MAURICE ,  KOTHARI MANISH ,  CHUI CLARENCE

Inventor： SHENOY RAVINDRA V ,  MIGNARD MARC MAURICE ,  KOTHARI MANISH ,  CHUI CLARENCE

IPC: B81C1/00

CPC classification number: H01L24/09 ,  B81C1/00238 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/89 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.

Abstract translation: 本公开提供了用于制造具有安装在显示装置封装内的电子部件的显示装置的系统，方法和装置。 在一个方面，电子部件通过在保持显示装置的基板和背板的密封件下面的垫片连接到显示装置的外部。 在另一方面，电子部件还连接到显示装置内的机电装置，以及连接到显示装置外部的焊盘。

公开(公告)号：WO2013036480A2

公开(公告)日：2013-03-14

申请号：PCT/US2012/053661

申请日：2012-09-04

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  SHENOY, Ravindra V. ,  MIGNARD, Marc Maurice ,  KOTHARI, Manish ,  CHUI, Clarence

Inventor： SHENOY, Ravindra V. ,  MIGNARD, Marc Maurice ,  KOTHARI, Manish ,  CHUI, Clarence

IPC: B81B7/00

CPC classification number: H01L24/09 ,  B81C1/00238 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/89 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.

Abstract translation: 本公开提供了用于制造具有安装在显示装置封装内的电子部件的显示装置的系统，方法和装置。 在一个方面，电子部件通过在保持显示装置的基板和背板的密封件下面的垫片连接到显示装置的外部。 在另一方面，电子部件还连接到显示装置内的机电装置，以及连接到显示装置外部的焊盘。