公开(公告)号：WO2008073485A3

公开(公告)日：2008-06-19

申请号：PCT/US2007/025452

申请日：2007-12-12

Applicant: QUANTUM LEAP PACKAGING, INC.

Inventor： ZIMMERMAN, Michael, A. ,  SMITH, Keith ,  SHVERDIN, Jacob

IPC: H01L21/00

Abstract: A plastic package for an image sensor comprises a plastic body molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. An interfacial layer is formed on the surfaces of the leadframe composing of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The curic oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

公开(公告)号：WO2008060490A2

公开(公告)日：2008-05-22

申请号：PCT/US2007/023689

申请日：2007-11-09

Applicant: QUANTUM LEAP PACKAGING, INC.

Inventor： ZIMMERMAN, Michael, A.

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An LED package which employs a high temperature plastic or polymeric material which is compatible with widely used gold-tin eutectic solder and which can replace the higher cost ceramic used in conventional LED packages. The novel LED package has a high thermal conductivity substrate, a high reflectivity for visible light and/or UV light, and good aging properties. The high temperature material is a high temperature liquid crystal polymer (LCP) having a melting temperature greater than about 34O°C and has small filler particles near the surface, the particles having a refractive index greater than about 2.0, and a size range of about 0.2 to 0.3 microns. For an LED package which is reflective to UV light, a UV stabilizer can be included in the plastic material to improve reflectivity in the ultraviolet spectrum and to protect from UV degradation of the plastic material which can be caused by UV light emitted by some LEDs.

Abstract translation: 一种LED封装，采用与广泛使用的金锡共晶焊料兼容的高温塑料或聚合材料，可替代传统LED封装中使用的高成本陶瓷。 该新颖的LED封装具有高导热性的基底，可见光和/或紫外光的高反射率和良好的老化性能。 高温材料是熔点高于约340℃的高温液晶聚合物（LCP），表面附近具有较小的填料颗粒，该颗粒的折射率大于约2.0，尺寸范围约为 0.2〜0.3微米。 对于反射紫外光的LED封装，可以在塑料材料中包含UV稳定剂，以提高紫外光谱的反射率，并防止由某些LED发出的UV光引起的塑料材料的UV降解。

公开(公告)号：WO2008060447A2

公开(公告)日：2008-05-22

申请号：PCT/US2007/023590

申请日：2007-11-09

Applicant: QUANTUM LEAP PACKAGING, INC.

Inventor： ZIMMERMAN, Michael, A.

IPC: H01L23/48

CPC classification number: H01L23/142 ,  H01L21/4803 ,  H01L23/047 ,  H01L23/10 ,  H01L23/4924 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29183 ,  H01L2224/32245 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83805 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device. In addition, the package provides the combination of copper flange and polymeric dielectric with a TCE close to copper, which results in a low stress structure of improved reliability and conductivity.

Abstract translation: 在铜法兰和管芯附着之间具有延展层的微电路封装。 韧性层吸收安装在凸缘上的凸缘和半导体器件之间的应力，并且可以显着减小施加到半导体器件的应力。 此外，该封装还提供了铜法兰和聚合物电介质的组合，以及与铜接近的TCE，从而产生低应力结构，从而提高了可靠性和导电性。