摘要:
An injection compression molding system includes a mold having a fixed first half and a displaceable second half. The second half is initially positioned with a cavity between the mold halves having a first clearance sized to receive a molten material puddle shot injected by an injection molding device without the puddle shot filling the cavity. A displacement device acts during or immediately after puddle shot injection, displacing the second mold half toward the first mold half creating a second clearance less than the first clearance. The second clearance defines a finished part thickness whereby displacement of the second mold half to the second clearance compresses the puddle shot so that the puddle shot fills the cavity and forms a finished part between the mold halves. Total time to inject and compress the puddle shot is less than or equal to 1.0 seconds.
摘要:
A method of manufacturing a semiconductor device sealed with silicone rubber, characterized by 1) placing an unsealed semiconductor device into a mold, 2) thereafter filling in spaces between the mold and the semiconductor device with a sealing silicone rubber composition, and 3) subjecting the composition to compression molding. By the utilization of this method, a sealed semiconductor device is free of voids, and a thickness of a sealing silicone rubber can be controlled.
摘要:
La présente invention concerne un support de garniture comprenant une pluralité de plages conductrices (12) associées à un plot d'adressage commun (18) et à des moyens de sélection d'au moins une plage à garnir par voie électrochimique parmi la pluralité de plages. Conformément à l'invention, les moyens de sélection comportent des moyens (20) de décalage d'une tension de polarisation, connectés entre le plot d'adressage commun et au moins une plage adresser. Application à la garniture de plages conductrices.
摘要翻译:包装支撑件技术领域本发明涉及包括多个部件的包装支撑件。 与之相关联的导电垫(12) 一个公共的寻址焊盘(18)和& 用于选择至少一个范围的装置; 电化学装饰在多用途&ute&ute&&&parmi parmi parmi parmi parmi parmi parmi parmi parmi parmi parmi parmi 的海滩。 按照 本发明中,选择装置包括连接在公共寻址焊盘和至少一个寻址焊盘之间的用于匀化偏置电压的装置(20)。 应用à 导电垫。 p>
摘要:
The invention concerns a method for making integrated circuit chips, characterised in that it comprises a step which consists in selectively coating an adhesive reinforcing material (13) over the whole active surface of a wafer of integrated circuits before separating the chips (10) excluding the contact pads (11) of each chip (10), The selective coating may be carried out before or after forming the bosses (12) on the contact pads (11), by screen printing or material spraying.
摘要:
Described is a machine (1) for packaging mattresses (100) comprising first movement means (2) configured to move a mattress being processed (3) along a first movement path (P1) and in a first feed direction (V1) and second movement means (8) configured to move a functional layer (9) along a second movement path (P2) and in a second feed direction (V2). The second movement path (P2) is located at least partly above the first movement path (P1) until leading into it at a placement station (10), wherein the functional layer (9) is placed on the mattress being processed (3). Means for applying adhesive material (5) are positioned along the first movement path (P1) and detection means (11) are configured and programmed to detect the position and preferably the dimensions of the mattress being processed (3) and/or of the functional layer (9). The control unit (12) is programmed to receive a detection signal (S1) indicating the position and preferably the dimensions detected and to generate a control signal (S2) of the first and/or second movement means (2, 8).
摘要:
Der Kalander (100) für die Herstellung und/oder Bearbeitung dünner Folien umfasst zwei an zwei Lagerstellen rotierbar in einem Gestell (1) gelagerten Walzen (2, 102, 202; 3, 103, 203) mit jeweils einem den arbeitenden Walzenumfang (13, 13‘) bildenden, hohlzylindrischen Walzenkörper (112, 37), wobei die beiden Walzenumfänge (13, 13‘) zwischen sich einen Walzenspalt (42) bilden und zumindest die eine Walze (2) derart ausgestaltet ist, dass sie mittels eines Wärmeaustauschmediums kühlbar ist, wobei der Walzenkörper (12) dieser Walze (2) hohlzylindrisch ausgebildet ist und die Walze (2, 102) einen Träger (23, 123) umfasst, der an einem Ende aus dem Walzenkörper (12, 112) herausgeführt ist und an dem Gestell drehfest sowie in dem Walzenkörper eine Rotation desselben um die Walzenachse S1 erlaubend gelagert ist, wobei die Lagerung des Querhaupts (23, 123) in dem Walzenkörper (12, 112) in Längsrichtung gesehen zwischen den zwei Lagerstellen (8, 9) erfolgt und wobei Mittel zur Reduzierung von in Betrieb des Kalanders (100) auftretenden Profilfehlern vorgesehen sind.
摘要:
The invention relates to a coating support comprising numerous conductive tracks (12) which are associated with a shared addressing contact (18) and with means of selecting at least one track from said numerous tracks, which is to be electrochemically coated. According to the invention, the aforementioned selection means comprise means (20) of shifting a polarisation voltage, which are connected between the shared addressing contact and at least one track to be addressed. The invention can be used to coat conductive tracks.