Abstract:
The present invention provides a horizontally depleted Metal Semiconductor Field Effect Transistor (MESFET). A drain region, a source region, and a channel region are formed in the device layer such that the drain region and the source region are spaced apart from one another and the channel region extends between the drain region and the source region. First and second gate contacts are formed in the device layer on either side of the channel region, and as such, the first and second gate contacts will also reside between opposing portions of the source and drain regions. With this configuration, voltages applied to the first and second gate contacts effectively control vertical depletion regions, which form on either side of the channel region.
Abstract:
The present invention provides a horizontally depleted Metal Semiconductor Field Effect Transistor (MESFET). A drain region, a source region, and a channel region are formed in the device layer such that the drain region and the source region are spaced apart from one another and the channel region extends between the drain region and the source region. First and second gate contacts are formed in the device layer on either side of the channel region, and as such, the first and second gate contacts will also reside between opposing portions of the source and drain regions. With this configuration, voltages applied to the first and second gate contacts effectively control vertical depletion regions, which form on either side of the channel region.
Abstract:
A junction field-effect transistor (JFET) with a gate region that includes two separate subregions having material of different conductivity types and/or a Schottky junction that substantially suppresses gate current when the gate junction is forward-biased, as well as complementary circuits that incorporate such JFET devices. According to an aspect of the present invention, there is a junction field effect transistor (JFET) that includes a channel region and a gate region. The gate region includes a first gate sub-region and a second gate sub-region. The first gate sub-region forms a junction with the channel region. The second gate sub-region forms a junction with the first gate sub-region. The channel region and the second gate sub-region include material of a first conductivity type. The first gate sub-region includes material of a second conductivity type different from the first conductivity type.
Abstract:
Cette structure comporte un substrat (1) de type n, présentant une face inférieure (10) et une face supérieure (11), un drain (D) en contact avec la face inférieure (10) du substrat (1), une première région semi-conductrice (2), de type n, présentant une surface supérieure (21) munie d'une zone de contact (210), une source (S) en contact avec la zone de contact (210), une deuxième région semi-conductrice (3), de type p, agencée à l'intérieur de la première région semi-conductrice (2) et délimitant un premier et un second canal de conduction (C1, C2) entre le drain et la source, et est remarquable en ce qu'elle comporte une première et une seconde grille (G1, G2) métalliques présentant chacune une portion (40, 71) en contact avec la première région semi-conductrice (2) de manière à former une jonction de type Schottky.
Abstract:
Wide bandgap semiconductor devices including normally-off VJFET integrated power switches are described. The power switches can be implemented monolithically or hybridly, and may be integrated with a control circuit built in a single-or multi-chip wide bandgap power semiconductor module. The devices can be used in high-power, temperature -tolerant and radiation-resistant electronics components. Methods of making the devices are also described.
Abstract:
A field effect transistor (28) having a gate voltage swing in the transistor channel (40) varying as a function of position between the drain (32) and the source (30). The gate voltage swing in the transistor channel (40) may be made to vary as a function of position by making the threshold voltage a function of position. Alternatively, a split-gate device (48) may be used by applying a voltage between the gates (70, 72). In both cases, the electric field near the source (50, 30) is raised to accelerate the electrons thereby decreasing electron transit time.
Abstract:
A high-speed heterostructure planar integrated circuit includes a planar photodetector (30) together with a transistor (either a Modulation-Doped-0 Field Effect Transistor 50 or a lateral p-n-p bipolar transistor 120). The planar photodetector (30) includes a bottom confinement layer (12) of a wide bandgap material, a heavily doped first conductivity-type buried layer (14) over the bottom confinement layer, a relatively undoped higher index of refraction layer (16) overlying the buried layer (14), a top confinement layer (18) of wider bandgap material which has a lower index of refraction, a first vertical contact region (32) of first conductivity type which extends downward to make electrical contact with the buried layer, and a second contact region (34) of second conductivity type spaced laterally from the first contact region (32) and extending through the top confinement layer (18) and a portion of the undoped layer (16). As a result of the difference in refractive indices of undoped versus doped regions and in wide gap versus narrow gap material, light directed into one end of the photodetector (30) is confined both laterally and vertically to the undoped layer (16) where it is absorbed. Charge separation occurs with first conductivity carriers being collected at the first contact region (32) and the buried layer (14), and second conductivity carriers being collected at the second contact region.
Abstract:
A structure having first and second electrical conductors disposed on a surface of the structure and a bridging conductor connected between the first electrical conductor and the second electrical conductor with portions disposed over the surface of the structure. The bridging conductor includes a plurality of stacked, multi-metal layers, each one of the multi -metal layers having: an electrically conductive layer; and a pair of barrier metal layers, the electrically conductive layer being disposed between and in direct contact with the pair of barrier metal layers.
Abstract:
Wide bandgap semiconductor devices including normally-off VJFET integrated power switches are described. The power switches can be implemented monolithically or hybridly, and may be integrated with a control circuit built in a single-or multi-chip wide bandgap power semiconductor module. The devices can be used in high-power, temperature -tolerant and radiation-resistant electronics components. Methods of making the devices are also described.