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公开(公告)号：CN101454898A
公开(公告)日：2009-06-10
申请号：CN200780019026.9
申请日：2007-05-25
申请人： NXP股份有限公司
发明人： 克里斯·维兰德
CPC分类号： C22C1/1036 , B22F2998/00 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/73 , H01L2223/6611 , H01L2224/32225 , H01L2224/43 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45186 , H01L2224/45198 , H01L2224/45244 , H01L2224/45386 , H01L2224/45387 , H01L2224/45565 , H01L2224/4557 , H01L2224/45572 , H01L2224/456 , H01L2224/45644 , H01L2224/45647 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , Y10S505/704 , Y10S505/74 , Y10S505/813 , Y10T428/12056 , Y10T428/2942 , Y10T428/2949 , B22F5/12 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01049 , H01L2924/01006
摘要： 使用多种方法实现用于集成电路的接合线。使用如下方法制造一种合成接合线以供在集成电路中使用。将导电材料熔化并且与尺寸小于100微米的粒子的材料混合，以产生混合物。使用混合物来制成合成接合线。还提供了一种具有内芯以及外层的合成线，其中外层具有比内芯更高的传导率。将外层设计为比承载AC信号的工作频率上的趋肤深度更厚。
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公开(公告)号：CN101454898B
公开(公告)日：2011-11-02
申请号：CN200780019026.9
申请日：2007-05-25
申请人： 台湾积体电路制造股份有限公司
发明人： 克里斯·维兰德
CPC分类号： C22C1/1036 , B22F2998/00 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/73 , H01L2223/6611 , H01L2224/32225 , H01L2224/43 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45186 , H01L2224/45198 , H01L2224/45244 , H01L2224/45386 , H01L2224/45387 , H01L2224/45565 , H01L2224/4557 , H01L2224/45572 , H01L2224/456 , H01L2224/45644 , H01L2224/45647 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , Y10S505/704 , Y10S505/74 , Y10S505/813 , Y10T428/12056 , Y10T428/2942 , Y10T428/2949 , B22F5/12 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01049 , H01L2924/01006
摘要： 使用多种方法实现用于集成电路的接合线。使用如下方法制造一种合成接合线以供在集成电路中使用。将导电材料熔化并且与尺寸小于100微米的粒子的材料混合，以产生混合物。使用混合物来制成合成接合线。还提供了一种具有内芯以及外层的合成线，其中外层具有比内芯更高的传导率。将外层设计为比承载AC信号的工作频率上的趋肤深度更厚。
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公开(公告)号：CN103928418B
公开(公告)日：2017-06-13
申请号：CN201410012444.7
申请日：2014-01-10
申请人： 英飞凌科技股份有限公司
CPC分类号： H01L24/45 , B32B15/01 , H01B1/02 , H01B1/023 , H01L24/48 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45028 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45169 , H01L2224/45171 , H01L2224/45173 , H01L2224/45176 , H01L2224/45178 , H01L2224/4518 , H01L2224/45181 , H01L2224/45184 , H01L2224/45218 , H01L2224/45223 , H01L2224/45224 , H01L2224/45238 , H01L2224/45239 , H01L2224/45244 , H01L2224/45247 , H01L2224/45255 , H01L2224/4526 , H01L2224/45264 , H01L2224/45269 , H01L2224/45271 , H01L2224/45273 , H01L2224/45276 , H01L2224/45278 , H01L2224/4528 , H01L2224/45281 , H01L2224/45284 , H01L2224/4556 , H01L2224/45565 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45638 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/4566 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/4568 , H01L2224/45681 , H01L2224/4847 , H01L2924/00011 , H01L2924/01004 , H01L2924/00 , H01L2924/00014 , H01L2924/01201 , H01L2924/01049 , H01L2924/01005 , H01L2924/01039
摘要： 本发明涉及一种键合引线（1）包括由第一材料制成的一根或多根单丝（10‑17），该一根或多根单丝嵌入到由第二材料制成的基体（20）中。该单丝（10‑17）中的每一根在1013.25hPa的压力下具有第一熔融温度。该基体（20）在1013.25hPa的压力下具有第二熔融温度。该第一熔融温度比该第二熔融温度高出至少450℃。
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公开(公告)号：CN103928418A
公开(公告)日：2014-07-16
申请号：CN201410012444.7
申请日：2014-01-10
申请人： 英飞凌科技股份有限公司
CPC分类号： H01L24/45 , B32B15/01 , H01B1/02 , H01B1/023 , H01L24/48 , H01L24/85 , H01L2224/45014 , H01L2224/45015 , H01L2224/45028 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45169 , H01L2224/45171 , H01L2224/45173 , H01L2224/45176 , H01L2224/45178 , H01L2224/4518 , H01L2224/45181 , H01L2224/45184 , H01L2224/45218 , H01L2224/45223 , H01L2224/45224 , H01L2224/45238 , H01L2224/45239 , H01L2224/45244 , H01L2224/45247 , H01L2224/45255 , H01L2224/4526 , H01L2224/45264 , H01L2224/45269 , H01L2224/45271 , H01L2224/45273 , H01L2224/45276 , H01L2224/45278 , H01L2224/4528 , H01L2224/45281 , H01L2224/45284 , H01L2224/4556 , H01L2224/45565 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45638 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/4566 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/4568 , H01L2224/45681 , H01L2224/4847 , H01L2924/00011 , H01L2924/01004 , H01L2924/00 , H01L2924/00014 , H01L2924/01201 , H01L2924/01049 , H01L2924/01005 , H01L2924/01039
摘要： 本发明涉及一种键合引线（1）包括由第一材料制成的一根或多根单丝（10-17），该一根或多根单丝嵌入到由第二材料制成的基体（20）中。该单丝（10-17）中的每一根在1013.25hPa的压力下具有第一熔融温度。该基体（20）在1013.25hPa的压力下具有第二熔融温度。该第一熔融温度比该第二熔融温度高出至少450℃。
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