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公开(公告)号：CN104412724A
公开(公告)日：2015-03-11
申请号：CN201380033809.8
申请日：2013-02-21
申请人： 松下知识产权经营株式会社
CPC分类号： H05K1/097 , G02F1/1303 , G06K19/07718 , G06K19/07745 , H01L21/4853 , H01L23/145 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/75 , H01L24/81 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0652 , H01L2223/6677 , H01L2224/11312 , H01L2224/1132 , H01L2224/13008 , H01L2224/13016 , H01L2224/13019 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/13301 , H01L2224/13311 , H01L2224/13318 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13364 , H01L2224/13369 , H01L2224/1339 , H01L2224/1349 , H01L2224/13644 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17106 , H01L2224/73204 , H01L2224/7526 , H01L2224/75262 , H01L2224/7565 , H01L2224/75651 , H01L2224/75702 , H01L2224/7598 , H01L2224/81127 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8159 , H01L2224/81601 , H01L2224/81611 , H01L2224/81618 , H01L2224/81624 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/81657 , H01L2224/8166 , H01L2224/81664 , H01L2224/81669 , H01L2224/81815 , H01L2224/8184 , H01L2224/81871 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/19105 , H05K1/0274 , H05K1/0313 , H05K1/181 , H05K3/12 , H05K3/321 , H05K2201/0108 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/00012 , H01L2924/01048 , H01L2224/81 , H01L2224/11 , H01L2924/00
摘要： 电子部件安装构造体包含基板；形成于基板表面上的、以Cu等高熔点金属为主体的导电性配线图案；将导电性配线图案的端子接合位置内包、搭载于所述基板表面的搭载位置上、具有外部端子的电子部件。外部端子在端子接合位置处以埋入到导电性配线图案的内部的状态与导电性配线图案相连接。因此，与仅在导电性配线图案的表面上将电子部件的外部端子与导电性配线图案连接的接合部相比，可以在强度更高的接合部处将外部端子与导电性配线图案连接。
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