公开(公告)号：EP1439743A2

公开(公告)日：2004-07-21

申请号：EP04000569.6

申请日：2004-01-14

Applicant: Ticona GmbH

Inventor： Reil, Frank ,  Diel, Stefan

IPC: H05K3/02 ,  H05K3/04

CPC classification number: H05K1/0373 ,  H05K3/027 ,  H05K3/04 ,  H05K3/043 ,  H05K2201/0116 ,  H05K2201/0215 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2203/025 ,  H05K2203/0746 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49163

Abstract: Beschrieben wird ein Verfahren, bei dem Oberflächen von geschäumten Kunststoffen unter Zuhilfenahme von selektiv abtragenden Bearbeitungsverfahren mit elektrischen Leiterbahnen versehen werden.
Das Verfahren gestattet die kostengünstige Herstellung von Formteilen aus Kunststoff mit auf der Oberfläche integrierten Leiterbahnen.
Die Verfahrensprodukte lassen sich beispielsweise in der Elektro- und Elektronikindustrie einsetzen.

Abstract translation: 绝缘，结构泡沫的基材，填充有导电颗粒整体泡沫材料的方法包括。 这些在寻求量做的绝缘基板的所述蜂窝芯是电绝缘的，而其固体外层保持是导电性。 选择性去除过程是机械的。 它可替代地采用束或射流（包括例如水射流）或是机电方法。 外层厚度为50至1000微米和绝缘基板的核心是200至10,000微米厚。 核心是微孔泡沫，单元尺寸为1-20微米。

公开(公告)号：EP1190608A1

公开(公告)日：2002-03-27

申请号：EP00912789.5

申请日：2000-03-23

Applicant: International Business Machines Corporation ,  IBM United Kingdom Limited

Inventor： JAPP, Robert ,  POLIKS, Mark

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/38 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0769 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2203/1131 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1052 ,  Y10T428/24273 ,  Y10T428/24917

Abstract: Power and ground planes (203, 205) that are used in Printed Circuit Boards (PCBs) and that comprise porous, conductive materials are disclosed. Using porous power and ground plane materials in PCBs allows liquids (e.g., water and/or other solvents) to pass through the power and ground planes (202, 205), thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets (202, 205) porous by forming an array of holes (220) in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes (220) is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.

公开(公告)号：EP0901191A2

公开(公告)日：1999-03-10

申请号：EP98307198.6

申请日：1998-09-07

Applicant: Thomas & Betts International, Inc.

Inventor： Strange, Andrew H. ,  Millay, Arthur ,  Buchoff, Leonard S. ,  Macinnes, Steven K. ,  Rassier, Daniel W.

IPC: H01R13/24

CPC classification number: H01R13/2492 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/107 ,  Y10T442/109 ,  Y10T442/131

Abstract: An electrical interconnect (10) is comprised of a woven mesh in which an array of parallel wires (20) is retained in spaced relation by a transverse array of nonconducting strands (30), the mesh being enclosed or encased within a resilient matrix. The conductive wires are on a close pitch to yield greater current carrying capacity and achieve a lower more stable resistance. With this construction a great number of wires are in contact with each contact pad to yield greater current carrying capacity and corresponding lower resistance. The closer pitch wires also provide greater redundancy of contact points. This structure can be custom configured in as many layers or in a variety of shapes as is desirable to achieve a given electrical performance. The woven mesh can be wrapped around a shaped substrate to provide electrical connections in a desired shape. The woven mesh interconnect can be integrated as part of a boot, wherein the boot receives an electrical device therein and the woven mesh interconnect provides electrical connection from the device within the boot to outside the boot. The woven mesh interconnect can be layered and shaped to form an interconnect which not only provides electrical interconnection but also provides a biasing force due to the shape of the device.

Abstract translation: 电互连（10）由编织网组成，其中平行线（20）的阵列通过非导体股线（30）的横向阵列以间隔关系保持，所述网状物被包围或封装在弹性基体内。 导线处于紧密的间距处，以产生更大的载流能力并实现更低的更稳定的电阻。 利用这种结构，大量的电线与每个接触垫接触以产生更大的载流能力和相应的较低电阻。 更靠近的节距线还提供更大的接触点冗余度。 这种结构可以按照实现给定的电气性能所需的多层或多种形状来定制配置。 编织网可以缠绕成形的基底以提供所需形状的电连接。 机织网状互连可以集成为引导件的一部分，其中引导件在其中容纳电气设备，并且编织网状互连提供从引导器内的设备到引导件外部的电连接。 编织网状互连可以被分层和成形以形成互连，其不仅提供电互连，而且还由于设备的形状而提供偏置力。

公开(公告)号：EP0829186A1

公开(公告)日：1998-03-18

申请号：EP96914326.0

申请日：1996-05-20

Applicant: THE SECRETARY OF STATE FOR DEFENCE

Inventor： MORRIS, George William Defence Eval. & Res. Agency ,  TREEN, Andrew Shaun Defence Evaluation & Research ,  GRANT, Ian Defence Evaluation & Research Agency

IPC: B32B5 ,  G01L1 ,  H01Q15 ,  H05K1 ,  H05K3

CPC classification number: H05K1/038 ,  G01L1/205 ,  H05K1/0366 ,  H05K1/185 ,  H05K3/284 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10151 ,  Y10T442/3382 ,  Y10T442/339 ,  Y10T442/3398 ,  Y10T442/3407 ,  Y10T442/3463

Abstract: A laminated composite material (10) having patterned conductors integral to its structure is described which comprises a plurality of cloth layers and a penetrating resin matrix material in which at least one of the cloth layers (4) has a deposited patterned layer of electrical conductor to form a conducting path (14) in the resultant composite material. The electrical conductor is preferably deposited to such a thickness that individual fibres of the cloth are coated but that the resin permeates between individual fibres in the conducting regions. The conducting regions provide for external electrical connection of embedded electronic devices (2).

公开(公告)号：EP0649723A2

公开(公告)日：1995-04-26

申请号：EP94116209.1

申请日：1994-10-14

Applicant: Battenfeld GmbH

Inventor： Holzschuh, Johann

IPC: B29C45/82 ,  B29C45/67

CPC classification number: B29C45/82 ,  B29C2045/826 ,  H05K2201/0129 ,  H05K2201/0281

Abstract: Es ist ein hydraulisches Betriebssystem für Spritzgießmaschinen mit einer Hydraulikpumpe 14 und einer Mehrzahl von Hydraulikantrieben 1 bis 6 vorgeschlagen, die hiermit über ein Hydraulik-Leitungsnetz 13 und Ventile 7 bis 12 in wählbarer Anzahl und Reihenfolge verbindbar sind.
Für das Arbeiten mit gutem Wirkungsgrad und geringen Betriebskosten ist vorgeschlagen,

- daß die Hydraulikpumpe 14 als Stetig- bzw. Konstant-Förderpumpe mit einem mindestens der maximalen Verbrauchsmenge aller Hydraulikantriebe 1 bis 6 entsprechenden Förder-(strom)-Volumen und/oder -druck ausgelegt ist,
- daß die Hydraulikpumpe 14 durch einen über einen vorgegebenen Drehzahlbereich in seiner Drehzahl stufenlos - oder aber zumindest vielstufig - regelbaren Elektromotor 15 antreibbar ist,
- daß durch die maximale Antriebsdrehzahl des Elektromotors 15 das Förder(strom)-Volumen und/oder der Förderdruck an die maximale Verbrauchsmenge und/oder den maximalen Verbrauchsdruck aller Hydraulikantriebe 1 bis 6 anpaßbar ist,
- und daß die Drehzahl für den Elektromotor 15 proportional der Verbrauchsmenge und/oder dem Verbrauchsdruck der jeweils in Betrieb gesetzten Hydraulikantriebe 1 bis 6 regelbar ist.

Abstract translation: 提出了一种用于注射成型机的液压致动系统，其具有液压泵14和多个液压驱动器1至6，液压驱动器可以通过液压管网13和阀7至12以可选择的数量和顺序与其连接。 为了以良好的效率和低的操作成本进行工作，建议将液压泵14设计成具有至少相当于最大消耗（吸收）的体积输送（位移）和/或输送压力的恒定进料泵 所有的液压驱动装置1至6，液压泵14可以由电动机15驱动，电动机15可以在预定的速度范围内以无限可变（无级地）无级地（无级地）控制其速度） 容积输送（位移）和/或输送压力可以通过电动机15的最大驱动速度适应所有t的最大消耗和/或最大消耗压力 他的液压驱动器1至6，并且可以相对于分别致动的液压驱动器1至6的消耗和/或消耗压力成比例地控制电动机15的速度。

公开(公告)号：EP0649273A1

公开(公告)日：1995-04-19

申请号：EP94115754.7

申请日：1994-10-06

Applicant: HOECHST AKTIENGESELLSCHAFT

Inventor： Pfeiffer, Bernhard, Dr. ,  Skaletz, Detlef, Dr.

IPC: H05K3/10 ,  H05K9/00

CPC classification number: H05K9/0088 ,  H05K1/095 ,  H05K3/102 ,  H05K3/245 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/035 ,  H05K2203/0783

Abstract: Zur Herstellung eines elektrischen Kontakts an einem elektrisch leitfähigen Formkörper aus thermoplastischem Material, der Metallfasern enthält, wird auf die Oberfläche des Formkörpers eine Suspension aufgetragen, die ein elektrisch leitfähiges Pulver sowie ein Lösungsmittel enthält, das das thermoplastische Material des Formkörpers anlöst oder aufquillt. Dann läßt man die aufgetragene Suspension eintrocknen.

Abstract translation: 为了在由包含金属纤维的热塑性材料构成的导电模塑件上进行电接触，悬浮液沉积在模制品的表面上，悬浮液含有导电粉末以及溶解或溶胀热塑性塑料的溶剂 成型材料。 然后可以将沉积的悬浮液干燥。

公开(公告)号：EP0242303B1

公开(公告)日：1993-11-03

申请号：EP87400879.0

申请日：1987-04-16

Applicant: DIGITAL EQUIPMENT CORPORATION

Inventor： Lee, James C.K. ,  Beck, Richard ,  Lee, Chune ,  Hu, Edward

IPC: H01L25/04 ,  H01R13/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01R13/2414 ,  H01L25/0657 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06579 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/15312 ,  H01R43/007 ,  H01R43/16 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0133 ,  H05K2201/0281 ,  H05K2203/0235 ,  Y10T29/435 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01077

公开(公告)号：EP0547852A2

公开(公告)日：1993-06-23

申请号：EP92311375.7

申请日：1992-12-14

Applicant: XEROX CORPORATION

Inventor： Wallce, Stanley J. ,  Swift, Joseph A.

IPC: H01R9/09 ,  H01R23/72 ,  H05K3/36

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K3/325 ,  H05K2201/0281 ,  H05K2201/10378

Abstract: An interlevel connector, a multilayer wiring board assembly, and method for making the same are presented. The interlevel connector includes a dielectric substrate having a plurality of through holes and a corresponding plurality of pultrusions. Each pultrusion includes a plurality of electrically conductive fibers and an electrically conductive or insulating host material carrying the plurality of fibers, each of the plurality of pultrusions being located in a respective through hole and having fibrillated portions extending from surfaces of the dielectric substrate. The interlevel connector is used in the construction of a multilayer wiring assembly in which first and second wiring boards having respective conductive portions are interconnected. The interlevel connector is located adjacent and between the first and second wiring boards, whereby the fibrillated portions of the pultrusion extending from the surfaces of the dielectric substrate contact the conductive portions of the first and second wiring boards. The wiring boards can be permanently or removably locatable adjacent the dielectric substrate.

Abstract translation: 介绍了一种层间连接器，多层布线板组件及其制造方法。 层间连接器包括具有多个通孔和相应的多个拉挤成型体的电介质基板。 每个拉挤成型包括多个导电纤维和承载多个纤维的导电或绝缘主体材料，多个拉挤成型机中的每一个位于相应的通孔中并具有从电介质基板的表面延伸的原纤化部分。 层叠连接器用于多层布线组件的构造中，其中具有相应导电部分的第一和第二布线板互连。 层间连接器位于第一和第二布线板之间并且位于第一和第二布线板之间，由此从电介质基板的表面延伸的拉挤成形的原纤化部分接触第一和第二布线板的导电部分。 布线板可以永久地或可移除地邻近电介质基片定位。

公开(公告)号：EP0456428A3

公开(公告)日：1992-02-26

申请号：EP91304030.9

申请日：1991-05-03

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Adams, Jerome Thomas ,  Yost, Bruce Allen

IPC: C09J9/02 ,  H01L23/373 ,  C09J11/04

CPC classification number: H05K3/305 ,  C08L2666/54 ,  C09J201/00 ,  H01L23/4828 ,  H01L23/49883 ,  H01L2224/32225 ,  H05K1/0203 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/0323 ,  Y02P70/613

Abstract: Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesive resins have high through-the-thickness thermal conductivity.

公开(公告)号：EP0242303A2

公开(公告)日：1987-10-21

申请号：EP87400879.0

申请日：1987-04-16

Applicant: DIGITAL EQUIPMENT CORPORATION

Inventor： Lee, James C.K. ,  Beck, Richard ,  Lee, Chune ,  Hu, Edward

IPC: H01L25/04 ,  H01R13/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01R13/2414 ,  H01L25/0657 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06579 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/15312 ,  H01R43/007 ,  H01R43/16 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0133 ,  H05K2201/0281 ,  H05K2203/0235 ,  Y10T29/435 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01077

Abstract: Electronic assemblies are fabricated by stacking alternate connecting layers and component layers. The component layers may be virtually any rigid structure having contact regions formed on at least one face thereof. The connecting layers are formed from anisotropic elastomeric conductors which in turn are fabricated by stacking a plurality of conductive sheets and insulating sheets, where the conductive sheets have a plurality of parallel electrically conductive elements formed therein. By introducing a curable elastomeric resin into the stacked structure so formed, and then curing the elastomer, a solid elastomeric block having a plurality of parallel electrically conductive elements running its length is obtained. Individual elastomeric conductors suitable as connecting layers interfacing between adjacent component layers are obtained by slicing the block in a direction perpendicular to the conductors.

Abstract translation: 通过堆叠交替的连接层和组件层来制造电子组件。 组件层可以是实质上具有形成在其至少一个面上的接触区域的任何刚性结构。 连接层由各向异性弹性体导体形成，其又通过堆叠多个导电片和绝缘片制成，其中导电片在其中形成有多个平行的导电元件。 通过将可固化的弹性体树脂引入到如此形成的层叠结构中，然后固化弹性体，获得具有多个平行的导电元件延伸其长度的固体弹性体块。 通过在垂直于导体的方向上切割块来获得适合作为相邻部件层之间连接的连接层的各个弹性体导体。