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111.发明公开
公开(公告)号：EP0718693A2
公开(公告)日：1996-06-26
申请号：EP96102977.4
申请日：1987-12-22
Applicant: SHIPLEY COMPANY INC.
Inventor： Daniels, Brian Kenneth , Madoux, David Charles , Templeton, Michael Karpovich , Trefonas III, Peter , Woodbrey, James Calvin , Zampani, Anthony
CPC classification number: G03F7/0226 , G03F7/0048 , G03F7/022
Abstract: This invention is directed to novel photoresist processes and compositions having high resolution alkali-soluble resins, high resolution photoactive components with several diazoquinone groups per molecule, and solvents having a high solvency power, better safety, improved photospeed, higher contrast and equivalent cast film thickness from lower percent solids formulations.
Abstract translation: 本发明涉及具有高分辨率碱溶性树脂的新型光刻胶工艺和组合物，每分子具有几个重氮醌基团的高分辨率光活性组分和具有高偿付能力的溶剂，更好的安全性，更高的感光速度，更高的对比度和等效的流延膜厚度 来自较低百分比的固体制剂。
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公开(公告)号：EP0555749A1
公开(公告)日：1993-08-18
申请号：EP93101634.9
申请日：1993-02-03
Applicant: SHIPLEY COMPANY INC.
Inventor： Pai, Daniel Y. , Rodriguez Stephen S. , Cheetham, Kevin, J. , Calabrese, Gary, S. , Sinta Roger F.
CPC classification number: G03F7/038 , G03F7/0045
Abstract: A radiation sensitive composition, process for using said composition, and substrates coated with said composition. The photoimageable composition comprises a photobase generator compound, a resin binder and a material capable of crosslinking in the presence of base. In preferred aspects, the invention provides a negative-acting, aqueous developable photoimageable composition comprising a photobase generator compound, a resin binder which preferably is a phenolic polymer, a crosslinking agent that comprises one or more active groups that will undergo base-initiated crosslinking, and a curing agent.
Abstract translation: 辐射敏感组合物，使用所述组合物的方法，以及用所述组合物涂覆的基材。 可光成像组合物包含光碱产生剂化合物，树脂粘合剂和能够在碱存在下交联的材料。 在优选的方面，本发明提供负性作用的水性可显影光成像组合物，其包含光碱产生剂化合物，优选酚醛聚合物的树脂粘合剂，包含一个或多个将进行碱引发交联的活性基团的交联剂， 和固化剂。
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公开(公告)号：EP0520195A3
公开(公告)日：1993-03-10
申请号：EP92108801.9
申请日：1992-05-25
Applicant: SHIPLEY COMPANY INC.
Inventor： Bladon, John J.
IPC: C25D5/54
CPC classification number: C25D5/54 , H05K3/424 , H05K3/427 , H05K2203/0716
Abstract: A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.
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公开(公告)号：EP0507043A3
公开(公告)日：1992-12-16
申请号：EP92100140.0
申请日：1992-01-07
Applicant: SHIPLEY COMPANY INC.
Inventor： Harris, Martin J. , Ho, Ivan K.
CPC classification number: H01L21/4828 , C09D5/4411 , C23F1/02 , C25D5/022 , G03F7/164 , H05K3/0079 , H05K3/064 , H05K3/202
Abstract: Method for selective and precise etching and plating of a conductive substrate through electrophoretic deposition of a photoresist composition. The invention enables chemical milling and plating of products useful in high performance applications such as lead frames with lead widths less than 1.0 mil and precisely plated lead faces.
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公开(公告)号：EP0507043A2
公开(公告)日：1992-10-07
申请号：EP92100140.0
申请日：1992-01-07
Applicant: SHIPLEY COMPANY INC.
Inventor： Harris, Martin J. , Ho, Ivan K.
CPC classification number: H01L21/4828 , C09D5/4411 , C23F1/02 , C25D5/022 , G03F7/164 , H05K3/0079 , H05K3/064 , H05K3/202
Abstract: Method for selective and precise etching and plating of a conductive substrate through electrophoretic deposition of a photoresist composition. The invention enables chemical milling and plating of products useful in high performance applications such as lead frames with lead widths less than 1.0 mil and precisely plated lead faces.
Abstract translation: 用于通过光致抗蚀剂组合物的电泳沉积一个导电性基板的选择性和精确的蚀刻和镀覆法。 本发明能够使化学研磨和的在高性能应用中有用的产品电镀：如引线框与引线宽度小于1.0密耳且精确地镀敷引线的面。
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Patent Agency Ranking
公开(公告)号：EP0483484A2
公开(公告)日：1992-05-06
申请号：EP91114755.1
申请日：1991-09-02
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Sricharoenchaikit, Prasit
CPC classification number: G03F7/2022 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , H05K3/184 , H05K2203/0505 , H05K2203/0706 , H05K2203/1415
Abstract: A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst (16) over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal (18) over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.
Abstract translation: 一种用于选择性金属化的方法，包括以下步骤：提供涂覆有光致抗蚀剂的基底，通过暴露于图案辐射和显影，对光致抗蚀剂涂层进行曝光，将光致抗蚀剂涂层暴露于激活辐射，在整个成像的光致抗蚀剂涂层上沉积化学镀催化剂， 裸露的下面的衬底，通过显影去除暴露的暴露的催化的光致抗蚀剂涂层的顶表面，由此镀催化剂保持在所需的选择性图案中并且在催化表面上沉积金属以形成诸如电路图案的选择性图案的金属沉积物。 该方法适用于制造包括印刷电路板在内的多种制品。
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公开(公告)号：EP0242530B1
公开(公告)日：1992-04-22
申请号：EP87102422.0
申请日：1987-02-20
Applicant: SHIPLEY COMPANY INC.
Inventor： Fisher, Gordon
CPC classification number: G01N27/423 , H05K3/241 , H05K3/423
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公开(公告)号：EP0407951A2
公开(公告)日：1991-01-16
申请号：EP90113111.0
申请日：1990-07-10
Applicant: SHIPLEY COMPANY INC.
Inventor： D'Ottavio, Eugene D. , Hawkins, Robert E. , Rodriguez, Stephen S. , Rychwalski, James
IPC: G03F7/16
CPC classification number: H05K3/108 , G03F7/164 , H05K1/0284 , H05K3/062 , H05K3/064 , H05K2201/0347 , H05K2201/09118 , H05K2203/135
Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby a) providing the board with a conductive surface and b) applying a photoresist by electrophoretic deposition.
Abstract translation: 一种用于由此a）提供所述板具有导电表面和b）通过电泳沉积施加光致抗蚀剂通过电泳沉积制造三维电路板的过程。
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公开(公告)号：EP0309682A3
公开(公告)日：1990-12-27
申请号：EP88112223.8
申请日：1988-07-28
Applicant: SHIPLEY COMPANY INC.
Inventor： Fisher, Thomas A.
CPC classification number: G03F7/36 , G03F7/0226 , Y10S438/948 , Y10T428/24802
Abstract: The invention provides a method for forming a photoresist mask on a substrate resistant to reticulation during plasma etching. The method comprises the steps of forming an imaged and developed photoresist coating over an integrated circuit substrate where the photoresist contains an essentially unreacted acid activated cross linking agent, and subjecting said substrate to an etching plasma in a gaseous stream that contains a Lewis acid. Contact of the surface of the photoresist film with the Lewis acid causes cross linking of the surface of the photoresist film during plasma etching with the formation of a reticulation resistant surface layer.
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120.发明公开
公开(公告)号：EP0355804A2
公开(公告)日：1990-02-28
申请号：EP89115521.0
申请日：1989-08-23
Applicant: SHIPLEY COMPANY INC.
Inventor： Bernards, Roger F. , Fischer, Gordon , Sonnenberg, Wade
IPC: C25D3/38
CPC classification number: C25D3/38 , H05K3/42 , H05K3/423 , H05K2203/162
Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
Abstract translation: 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以约1至10克/升溶液的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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