公开(公告)号：EP0705314A1

公开(公告)日：1996-04-10

申请号：EP93923160.0

申请日：1993-09-28

申请人： LORD CORPORATION

发明人： MOWREY, Douglas, H.

IPC分类号： C09J115 ,  C09J11 ,  C09J121 ,  C09J123 ,  C09J163 ,  C09J179

CPC分类号： C09J123/34 ,  C08L2666/04 ,  C08L2666/14 ,  C08L2666/36 ,  C08L2666/54 ,  C09J123/28 ,  C09J179/085

摘要： An adhesive composition exhibiting strong rubber-to-metal bonds with excellent environmental resistance without the necessity of first priming the metal surface has been discovered. The composition comprises a halogenated polyolefin, an aromatic nitroso compound, metal oxide such as zinc oxide or magnesium oxide, and optionally a vulcanizing agent such as sulfur or selenium, a phenolic epoxy resin, or carbon black.

公开(公告)号：EP3333856A1

公开(公告)日：2018-06-13

申请号：EP16832802.9

申请日：2016-07-22

申请人： Furukawa Electric Co., Ltd.

发明人： MIHARA, Naoaki ,  KIRIKAE, Noriyuki ,  SUGIYAMA, Jirou

IPC分类号： H01B1/22 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/04 ,  C09J201/00 ,  H01L21/52

CPC分类号： C09J9/02 ,  C08G73/1082 ,  C08G73/128 ,  C08K3/08 ,  C08K3/10 ,  C08K5/372 ,  C08K5/375 ,  C08K5/45 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C09J7/10 ,  C09J7/35 ,  C09J11/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  C09J179/085 ,  C09J201/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H01B1/22 ,  H01L21/52 ,  H01L21/6836 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  H01L2224/04026 ,  H01L2224/05644 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29218 ,  H01L2224/29224 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29266 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29366 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83906 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/0705 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The purpose of the present invention is to provide a means that exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. Namely, it is an electrically conductive composition, which contains at least a sulfide compound represented by R-S-R' (wherein R is an organic group containing at least carbon; R' is an organic group that is the same as or different from R; and R and R' may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film, each of which are produced using the electrically conductive composition, as well as a dicing die bonding film, which is obtained by bonding the conductive bonding film with an adhesive tape, are provided.

公开(公告)号：EP3110897A1

公开(公告)日：2017-01-04

申请号：EP15752347.3

申请日：2015-02-20

申请人： Henkel IP & Holding GmbH

发明人： BAI, Jie ,  DO, Ly ,  CHAU, Hung ,  KIM, Younsang ,  ECKENRODE, Julissa

IPC分类号： C09J5/00 ,  C09J7/02 ,  C09J9/00 ,  C09J11/04 ,  C09J133/08 ,  C09J163/00 ,  C09J175/04 ,  C09J179/08 ,  C09J183/04 ,  C01B35/14 ,  C01F7/02 ,  H01L23/373

CPC分类号： C09J9/00 ,  C08G59/5073 ,  C08K3/22 ,  C08K3/36 ,  C08K3/38 ,  C08K5/14 ,  C08K2003/2227 ,  C08K2003/385 ,  C08L33/00 ,  C08L63/00 ,  C08L75/04 ,  C08L79/08 ,  C09J5/00 ,  C09J11/04 ,  C09J179/085 ,  C09J183/04 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/00 ,  C09K5/14 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive.

摘要翻译： 本文提供了具有熔融粘度，玻璃化转变温度（Tg），热膨胀系数和/或透明度的组合的导热底层填料组合物，其使得这些材料可用于制备各种电子器件，例如倒装芯片 封装，堆叠管芯，混合存储器立方体，通过二氧化硅通孔（TSV）器件等。 在本发明的某些实施方案中，提供了组合物，其包含通过本文所述的制剂的固化等分试样永久地粘附到第二制品的第一制品。 在本发明的某些实施方案中，提供了将第一制品粘附到第二制品上的方法。 在本发明的某些实施方案中，提供了通过使用导热但不导电的粘合剂组装的电子设备来改善散热的方法。

公开(公告)号：EP1620495A4

公开(公告)日：2006-06-14

申请号：EP04750876

申请日：2004-04-30

申请人： ADVANCED APPLIED ADHESIVES

发明人： MIZORI FARHAD G ,  DERSHEM STEPHEN M

IPC分类号： C07D207/44 ,  C07D207/452 ,  C08F2/46 ,  C08G73/12 ,  C08L79/08 ,  C09J179/08 ,  C08J3/28 ,  C08F222/40 ,  C08G73/00 ,  C08L77/06

CPC分类号： C07D207/452 ,  C08G73/12 ,  C08G73/125 ,  C08L79/085 ,  C09J179/085

摘要： The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds (3).

公开(公告)号：EP0778857B1

公开(公告)日：2004-07-21

申请号：EP95933723.9

申请日：1995-08-30

申请人： Henkel Corporation

发明人： DERSHEM, Stephen, M. ,  PATTERSON, Dennis, B. ,  OSUNA, Jose, A., Jr.

IPC分类号： C08G73/10 ,  C08G73/12 ,  C07D207/452

CPC分类号： C07D207/452 ,  C07D401/04 ,  C08G73/10 ,  C08G73/12 ,  C08G73/121 ,  C09J179/085

公开(公告)号：EP0705314B1

公开(公告)日：1997-12-29

申请号：EP93923160

申请日：1993-09-28

申请人： LORD CORP

发明人： MOWREY DOUGLAS H

IPC分类号： C09J115/02 ,  C09J11/08 ,  C09J121/00 ,  C09J123/28 ,  C09J123/34 ,  C09J163/00 ,  C09J163/04 ,  C09J179/08 ,  C08K5/33 ,  C08K13/02

CPC分类号： C09J123/34 ,  C08L2666/04 ,  C08L2666/14 ,  C08L2666/36 ,  C08L2666/54 ,  C09J123/28 ,  C09J179/085

摘要： An adhesive composition exhibiting strong rubber-to-metal bonds with excellent environmental resistance without the necessity of first priming the metal surface has been discovered. The composition comprises a halogenated polyolefin, an aromatic nitroso compound, metal oxide such as zinc oxide or magnesium oxide, and optionally a vulcanizing agent such as sulfur or selenium, a phenolic epoxy resin, or carbon black.

公开(公告)号：EP0778857A2

公开(公告)日：1997-06-18

申请号：EP95933723.0

申请日：1995-08-30

申请人： QUANTUM MATERIALS, INC.

发明人： DERSHEM, Stephen, M. ,  PATTERSON, Dennis, B. ,  OSUNA, Jose, A., Jr.

IPC分类号： C07D207 ,  C07D401 ,  C08F22 ,  C08F290 ,  C08G65 ,  C08G73 ,  C08G77 ,  C09J4 ,  C09J179 ,  H01L21

CPC分类号： C07D207/452 ,  C07D401/04 ,  C08G73/10 ,  C08G73/12 ,  C08G73/121 ,  C09J179/085

摘要： In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they dispaly good adhesion to both the substrate and the device attached thereto.

公开(公告)号：EP3362530A1

公开(公告)日：2018-08-22

申请号：EP16856271.8

申请日：2016-10-14

申请人： Henkel IP & Holding GmbH

发明人： RUATTA, Stephen A. ,  CARSON, George ,  YAO, Li

IPC分类号： C09J7/02 ,  C09J9/02 ,  C08K3/08 ,  C08K5/00 ,  H01B1/22

CPC分类号： C09J9/02 ,  C08K3/08 ,  C08K3/11 ,  C08K5/00 ,  C08K9/04 ,  C08K2003/0806 ,  C08K2003/0843 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006 ,  C08L33/04 ,  C08L63/00 ,  C09D11/52 ,  C09J4/00 ,  C09J11/04 ,  C09J133/04 ,  C09J133/10 ,  C09J163/00 ,  C09J163/04 ,  C09J179/04 ,  C09J179/085 ,  H01B1/22 ,  H01L24/00 ,  C08F220/18

摘要： In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.

公开(公告)号：EP3187560A1

公开(公告)日：2017-07-05

申请号：EP15837005.6

申请日：2015-08-10

申请人： Furukawa Electric Co. Ltd.

发明人： AOYAMA, Masami ,  KIRIKAE, Noriyuki

IPC分类号： C09J201/00 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  H01L21/301 ,  H01L21/52 ,  H01L21/60

CPC分类号： C09J9/02 ,  C09J7/30 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  C09J179/085 ,  C09J201/00 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2479/08 ,  H01L21/52 ,  H01L21/6836 ,  H01L21/78

摘要： A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness is provided.
Specifically, it is a conductive adhesive composition, which comprises
(A) a thermosetting resin;
(C) a filler that contains a metal element; and
(D) at least one catalyst or curing agent,
wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180°C or higher.
More preferably, the reaction initiation temperature is 200°C or higher.
More preferably, it is a conductive adhesive composition that further comprises (B) a flux and (E) a polymer component.

摘要翻译： 提供不含有焊剂（铅）等有害物质且显示优异的粘附性的导电性粘接剂。 具体而言，是导电性粘接剂组合物，其含有（A）热固性树脂， （C）含有金属元素的填料; 和（D）至少一种催化剂或固化剂，其中（A）热固性树脂和（D）至少一种催化剂或固化剂的反应起始温度为180℃或更高。 更优选地，反应起始温度为200℃或更高。 更优选地，它是进一步包含（B）助熔剂和（E）聚合物组分的导电粘合剂组合物。

公开(公告)号：EP2850146A4

公开(公告)日：2015-12-16

申请号：EP13790039

申请日：2013-04-05

申请人： HENKEL IP & HOLDING GMBH

发明人： GAO JUNBO ,  HOANG GINA

IPC分类号： C09J9/02 ,  C09J7/02 ,  C09J163/00

CPC分类号： C09J9/02 ,  C08G59/182 ,  C08G73/124 ,  C08G73/125 ,  C08G73/126 ,  C08G73/127 ,  C08K3/10 ,  C08L63/00 ,  C09J163/00 ,  C09J179/085

摘要： A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.