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    Lead structure
    11.
    发明公开
    Lead structure 审中-公开
    Leitstruktur

    公开(公告)号：EP2743980A2

    公开(公告)日：2014-06-18

    申请号：EP13196705.1

    申请日：2013-12-11

    Applicant: Wintek Corporation

    Inventor： Chu, Kuan-Yu ,  Huang, Chen-Fu ,  Liu, Chiu-Mei ,  Chen, Ming-Wu ,  Hwang, Chin-Pei ,  Huang, Chun-Cheng ,  Wang, Yu-Ching ,  Li, Chung-Hsien ,  Chen, Kuo-Hsing ,  Chen, Yu-Ting ,  Su, Chen-Hao

    IPC: H01L23/498

    CPC classification number: H02H9/02 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04107 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/117 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/09354 ,  H05K2201/09727 ,  H01L2924/00

    Abstract: A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.

    Abstract translation: 设置在基板上的引线结构。 衬底包括布置有器件的显示区域和设置有包括第一焊盘，第二焊盘，第一迹线和第二迹线的引线结构的周边区域。 第一条迹线连接到设备。 每个第一迹线具有连接在一起的第一直线部分和第一接合部分。 每个第一迹线通过第一结合部分电连接到第一焊盘之一。 第二迹线具有连接在一起的第二直线部分和第二接合部分。 第二迹线通过第二接合部电连接到第二焊盘。 第一直线部分的宽度小于第一接合部分的宽度，并且第二直线部分的宽度小于第二接合部分的宽度。

    CONDUCTIVE BASE FOR FORMING WIRING PATTERN OF COLLECTOR SHEET FOR SOLAR CELLS, AND METHOD FOR PRODUCING COLLECTOR SHEET FOR SOLAR CELLS
    12.
    发明公开
    CONDUCTIVE BASE FOR FORMING WIRING PATTERN OF COLLECTOR SHEET FOR SOLAR CELLS, AND METHOD FOR PRODUCING COLLECTOR SHEET FOR SOLAR CELLS 有权
    集电极薄膜太阳能电池和方法布线结构的制备高级基础生产电体膜太阳能电池

    公开(公告)号：EP2722417A1

    公开(公告)日：2014-04-23

    申请号：EP12800136.9

    申请日：2012-06-14

    Applicant: Dai Nippon Printing Co., Ltd.

    Inventor： KOMAI, Takayuki ,  EMOTO, Satoshi

    IPC: C23C30/00 ,  C23F1/02 ,  C25D7/06 ,  H01B5/02 ,  H01L31/042 ,  H05K1/09

    CPC classification number: H01L31/18 ,  B32B15/01 ,  C23C30/00 ,  C25D3/22 ,  C25D5/48 ,  C25D7/0607 ,  H01L31/05 ,  H01L31/0516 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/10143 ,  Y02E10/50 ,  Y10T428/12792

    Abstract: Provided are: a conductive base for forming a wiring pattern of a collector sheet for solar cells, which has good rust inhibiting properties and solderability without using an organic rust inhibitor that may harm a solar cell element; and a method for producing a collector sheet for solar cells, said method using the conductive base. A conductive base for forming a wiring pattern of a collector sheet for solar cells, which is a conductive base (30) wherein a zinc layer (320) composed of zinc is formed on the surface of a copper foil (310), is used. The conductive base for forming a wiring pattern of a collector sheet for solar cells is characterized in that the zinc layer (320) does not contain chromium and the amount of zinc therein is more than 20 mg/m 2 but 40 mg/m 2 or less.

    Abstract translation: 提供有：用于形成集电片太阳能电池，其具有良好的防锈抑制性质和可焊性，而无需使用有机防锈剂的并可能损害太阳能电池元件的布线图形的导电性基体; 以及用于制造太阳能电池用集电片的方法，使用导电性基体所述方法。 使用导电基用于形成集电片太阳能电池单元的布线图案，在所有这是一个导电性基体（30）worin锌组成的锌层（320）的铜箔（310）的表面上形成。 用于形成集电片的用于太阳能电池的布线图案的导电性基体的特征在于，所做的锌层（320）不包含铬和锌的量。其中超过20毫克/米2，但40毫克/米2或 少。

    ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT AND METHOD OF FORMING ELECTRONIC CIRCUIT USING SAME
    14.
    发明公开
    ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT AND METHOD OF FORMING ELECTRONIC CIRCUIT USING SAME 审中-公开
    压延铜箔或电解铜箔电子电路和法在施工的电子电路THAT

    公开(公告)号：EP2371995A1

    公开(公告)日：2011-10-05

    申请号：EP09834854.3

    申请日：2009-12-22

    Applicant: JX Nippon Mining & Metals Corporation

    Inventor： YAMANISHI Keisuke ,  KAMINAGA Kengo ,  FUKUCHI Ryo

    IPC: C25D7/06 ,  B32B15/01 ,  C23F1/02 ,  H05K1/09

    CPC classification number: C23F1/18 ,  B32B15/01 ,  C23C22/24 ,  C23F1/02 ,  C23F1/28 ,  C25D3/562 ,  C25D5/12 ,  C25D5/48 ,  C25D7/0614 ,  H05K3/06 ,  H05K3/067 ,  H05K3/384 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12229 ,  Y10T428/31678

    Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the rolled copper foil or the electrolytic copper foil comprises a nickel alloy layer with lower etching rate than copper, which is formed on an etching side of the copper foil, and the nickel alloy layer contains zinc. This invention aims to prevent sagging caused by the etching, to form a uniform circuit having the intended circuit width, and to shorten the time of forming a circuit by etching as much as possible, when forming a circuit by etching a copper foil of the copper-clad laminate; and also aims to make the thickness of the nickel alloy layer as thin as possible, to inhibit oxidation when exposed to heat, to prevent tarnish (discoloration) known as "YAKE", to improve the etching properties in pattern etching, and to prevent the occurrence of short circuits and defects in the circuit width.

    Abstract translation: 提供了一种用于在用于通过蚀刻形成电路，worin轧制铜箔或电解铜箔的电子电路的压延铜箔或电解铜箔包括被形成在具有较低蚀刻速度比铜镍合金层，在所有 铜箔的蚀刻面侧，和镍合金层的含有锌。 本发明的目的在于防止由蚀刻下垂引起的，以形成具有预期的电路宽度均匀的电路，并且通过蚀刻尽可能缩短形成电路时，当通过蚀刻铜的铜箔形成电路 -clad层压; 因此旨在使镍合金层的厚度尽可能地薄，以抑制氧化。当暴露于热，以防止被称为“烧灼”的改善图案蚀刻中的蚀刻性变色（变色），并防止 在短路或电路宽度和缺陷的发生。

    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
    18.
    发明公开
    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS 有权
    激光白炽灯

    公开(公告)号：EP2011599A1

    公开(公告)日：2009-01-07

    申请号：EP07741875.4

    申请日：2007-04-18

    Applicant: Hitachi Zosen Corporation

    Inventor： FUKUDA, Naoaki ,  KUNISHIO, Kazuyoshi ,  NAKAYAMA, Shigeaki

    IPC: B23K26/06 ,  B23K26/08 ,  H05K3/00 ,  H05K3/08 ,  B23K101/42

    CPC classification number: B23K26/0604 ,  B23K26/0006 ,  B23K26/0608 ,  B23K26/0676 ,  B23K2201/42 ,  B23K2203/00 ,  B23K2203/56 ,  H05K3/0026 ,  H05K3/027 ,  H05K2201/0338 ,  H05K2203/108

    Abstract: [PROBLEMS] The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages.
    [MEANS FOR SOLVING PROBLEMS] A laser processing apparatus is provided with first and second laser oscillators (2a, 2b) for emitting laser beams (3a, 3b) of which at least the wavelength or the intensities are different from each other; a stage apparatus (5) for moving a workpiece (1) to be processed; and optical systems (4a, 4b) for guiding the laser beams (3a, 3b) to prescribed positions of the workpiece (1). The optical systems (4a, 4b) can be moved by means of an adjusting device (6) according to the relative moving direction of the laser beams (3a, 3b) and the workpiece (1) to permit the prescribed position of the workpiece (1) to be irradiated with laser beams (3a, 3b) in that order so that the workpiece (1) can be processed by the laser beams (3a, 3b). Thus, efficient laser processing can be performed without limiting the relative moving direction of the laser beams and the workpiece and without unnecessary movement.

    Abstract translation: 本发明提供了即使在多个阶段照射不同强度和波长的激光束时，也可以有效地处理电子电路板的图形化的方法和装置。 用于解决问题的手段激光加工装置设置有用于发射至少波长或强度彼此不同的激光束（3a，3b）的第一和第二激光振荡器（2a，2b） 用于移动待处理的工件（1）的平台装置（5） 以及用于将激光束（3a，3b）引导到工件（1）的规定位置的光学系统（4a，4b）。 光学系统（4a，4b）可以根据激光束（3a，3b）和工件（1）的相对移动方向通过调节装置（6）移动，以允许工件的规定位置 1）以激光束（3a，3b）依次照射，使得工件（1）能够被激光束（3a，3b）处理。 因此，可以在不限制激光束和工件的相对移动方向而没有不必要的移动的情况下执行高效的激光加工。

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