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公开(公告)号：EP1003358A2
公开(公告)日：2000-05-24
申请号：EP99122724.0
申请日：1999-11-16
Applicant: GRUNDIG Aktiengesellschaft
Inventor： Weidel, Günther
CPC classification number: H05K3/3447 , H05K3/321 , H05K2201/1003 , H05K2201/10083 , H05K2201/10166 , H05K2201/10977 , H05K2201/10992
Abstract: Die Erfindung betrifft ein Verfahren zur Kontaktierung eines Bauelements, insbesondere eines Sperrwandlers, Leistungstransistoren und dgl., wobei mindestens ein Kontaktelement des Baulements mittels einer schmelzflüssigen Lotlegierung mit einer auf einem Schaltungsträger vorgesehenen Kontaktfläche unter Bildung einer Lötstelle kontaktiert wird. Um einen elektrischen Kontakt selbst bei einem Bruch der Lötstelle zu gewährleisten, ist erfindungsgemäß vorgesehen, dass die Lötstelle nach der Erstarrung der Lötlegierung mit einem leitfähigen Polymer überdeckt wird.
Abstract translation: 本发明涉及一种用于特别是回扫转换器，功率晶体管等接触的部件，其中，所述鲍勒单位中的至少一个接触元件是由熔融的焊料合金与设置在电路基板的接触面积，以形成的焊料接头的装置接触。 为了保证即使在焊接接头的一小部分的电接触，本发明提供的是，焊料是由焊料合金与导电聚合物的固化覆盖。
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公开(公告)号：EP0753990B1
公开(公告)日：2000-04-12
申请号：EP96401487.2
申请日：1996-07-05
Applicant: THOMSON-CSF
Inventor： Baumert, Eric , Chazelas, Jean
CPC classification number: H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/05611 , H01L2224/13 , H01L2224/13111 , H01L2224/13116 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13582 , H01L2224/13618 , H01L2224/13624 , H01L2224/13647 , H01L2224/13655 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01R12/707 , H05K3/3436 , H05K2201/0308 , H05K2201/10234 , H05K2201/10242 , H05K2201/10992 , Y02P70/613 , H01L2924/01028 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
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公开(公告)号：EP0865232A3
公开(公告)日：2000-01-19
申请号：EP98104452.2
申请日：1998-03-12
Applicant: HONEYWELL INC.
Inventor： Nichols, Randolph G.
CPC classification number: H05K1/141 , H05K1/0203 , H05K1/0206 , H05K1/0263 , H05K1/113 , H05K3/341 , H05K3/3426 , H05K3/368 , H05K2201/09781 , H05K2201/10659 , H05K2201/10689 , H05K2201/10992 , H05K2203/0415 , Y02P70/613
Abstract: A multichip module (10) is attached to a printed wire circuit board using three conductive mounting feet (13) that are vapor phase soldered to conductive feet on the module's substrate (10c) and to conductive feet on the printed wiring circuit board that are connected to a ground plane on the board.
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公开(公告)号：EP0942636A2
公开(公告)日：1999-09-15
申请号：EP99301531.2
申请日：1999-03-02
Applicant: LUCENT TECHNOLOGIES INC.
Inventor： Degani, Yinon , Tai, King Lien
IPC: H05K3/34 , H05K3/36 , H01L23/498
CPC classification number: H01L23/49827 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/181 , H05K3/3436 , H05K3/3463 , H05K2201/09572 , H05K2201/10666 , H05K2201/10992 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
Abstract: The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus saving board area and reducing the interconnection length.
Abstract translation: 该说明书描述了使用焊料凸块阵列将具有镀通孔的双面电路板连接到互连衬底的技术。 通孔中填充有高熔点焊料，可以使焊料凸块直接位于通孔上，从而节省了电路板面积并减少了互连长度。
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15.发明公开Improvements in or relating to connecting board for connection between base plate and mounting board 失效相对于改进的连接板为底板和安装板之间的连接
公开(公告)号：EP0804057A3
公开(公告)日：1999-02-10
申请号：EP97106928.1
申请日：1997-04-25
Applicant: NGK Spark Plug Co. Ltd.
IPC: H05K3/34
CPC classification number: H01R43/0235 , H01R12/52 , H05K3/3436 , H05K3/3478 , H05K2201/035 , H05K2201/10378 , H05K2201/10424 , H05K2201/10992 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , Y02P70/613
Abstract: A connecting board is provided for disposition between a base plate such a LGA base plate and a mounting board such as a printed circuit board. The connecting board has a substrate having a plurality of through holes. Each through hole extends between opposite first and second surfaces of the substrate. An easily deformable soft metal body is mounted in each through hole in such a way as to have protruded portions protruding from the first and second surfaces of the substrate. The protruded portions of the soft metal body are different in protruding height. The connecting board are connected at the protruded portions to the base plate and the mounting board. The heights of the protruded portions are set depending upon the materials and the coefficients of thermal expansion of the LGA base plate, printed circuit board and connecting board. By making the protruding heights of the protruded portions different from each other, the distance between the LGA base plate and the connecting board and the distance between the connecting board and the printed circuit board are set desiredly.
Abstract translation: 连接板提供了一种用于寻求LGA基板上的底板和安装板之间配置：例如印刷电路板。 连接基板具有贯通孔的多个衬底。 每个通孔的基板的相对的第一和第二表面之间延伸。 容易变形的软质金属体在寻求一种方法，以具有从所述基片的第一和第二表面突出的凸部安装在每个通孔中。 软质金属体的突出部在突出高度不同。 连接基板在该突出部在底板和安装板连接。 凸部的高度设定在所述材料和所述LGA基板的热膨胀，印刷电路板和连接基板的系数DEPENDING。 通过使从不同的海誓山盟突出部的突出高度，所述LGA基板和连接基板与连接基板和印刷电路板之间的距离之间的距离是按所需设置。
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Patent Agency Ranking
公开(公告)号：EP0838854A3
公开(公告)日：1998-12-02
申请号：EP97118637.4
申请日：1997-10-27
Applicant: NGK Spark Plug Co. Ltd.
Inventor： Sakai, Hajime , Yamsaki, Kozo
IPC: H01L23/538 , H01L23/498
CPC classification number: H01L23/49816 , H01L2224/16 , H05K1/111 , H05K3/3436 , H05K2201/0373 , H05K2201/09736 , H05K2201/09745 , H05K2201/10992 , H05K2203/041 , H05K2203/048 , Y02P70/611 , Y02P70/613
Abstract: A wired ceramic board has on a main surface of a ceramic substrate thereof a plurality of bonding pads each of which has a projection having a solderable outer surface and positioned inside an outer periphery of each bonding pad when observed in a plan view. To each bonding pad is bonded a solder ball by using solder which is lower in melting point than the solder ball. The ceramic board and a resinous printed board are placed one upon another in such a manner that their bonding pads are aligned with each other. The bonding pads are soldered together with low melting point solder. The projection of each bonding pad is embedded in or surrounded by a mass of low melting point solder and joined with the mass of solder to constitute an integral unit while serving as a core of the unit. A shearing force acting on the assembly of the ceramic board and the plastic or resinous board parallel to the main surface of the ceramic board due to a temperature variation is applied by way of the mass of solder to the projection to be supported thereby, whereby to prevent initiation and growth of a crack or cracks in the mass of solder.
Abstract translation: 有线陶瓷板在其陶瓷基板的主表面上具有多个接合焊盘，每个接合焊盘具有突出部，该突出部具有可焊接的外表面并且当在平面图中观察时位于每个接合焊盘的外周的内部。 通过使用熔点比焊球低的焊料将焊球焊接到每个焊盘。 陶瓷板和树脂印制板以它们的接合衬垫彼此对齐的方式一个在另一个之上放置。 焊盘用低熔点焊料焊接在一起。 每个键合焊盘的凸起嵌入或包围在一团低熔点焊料中，并与焊料团结合在一起构成一个整体单元，同时作为单元的核心。 由于温度变化作用在陶瓷板和平行于陶瓷板主表面的塑料或树脂板上的剪切力通过焊料的质量施加到待支撑的凸起上， 防止裂纹的起始和生长或焊料块中的裂纹。
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公开(公告)号：EP0838854A2
公开(公告)日：1998-04-29
申请号：EP97118637.4
申请日：1997-10-27
Applicant: NGK Spark Plug Co. Ltd.
Inventor： Sakai, Hajime , Yamsaki, Kozo
IPC: H01L23/538 , H01L23/498
CPC classification number: H01L23/49816 , H01L2224/16 , H05K1/111 , H05K3/3436 , H05K2201/0373 , H05K2201/09736 , H05K2201/09745 , H05K2201/10992 , H05K2203/041 , H05K2203/048 , Y02P70/611 , Y02P70/613
Abstract: A wired ceramic board has on a main surface of a ceramic substrate thereof a plurality of bonding pads each of which has a projection having a solderable outer surface and positioned inside an outer periphery of each bonding pad when observed in a plan view. To each bonding pad is bonded a solder ball by using solder which is lower in melting point than the solder ball. The ceramic board and a resinous printed board are placed one upon another in such a manner that their bonding pads are aligned with each other. The bonding pads are soldered together with low melting point solder. The projection of each bonding pad is embedded in or surrounded by a mass of low melting point solder and joined with the mass of solder to constitute an integral unit while serving as a core of the unit. A shearing force acting on the assembly of the ceramic board and the plastic or resinous board parallel to the main surface of the ceramic board due to a temperature variation is applied by way of the mass of solder to the projection to be supported thereby, whereby to prevent initiation and growth of a crack or cracks in the mass of solder.
Abstract translation: 有线陶瓷板在其陶瓷基板的主表面上具有多个接合焊盘，每个接合焊盘具有在平面图中观察时具有可焊接的外表面并位于每个接合焊盘的外周的内部的突起。 通过使用熔点低于焊球的焊料，对每个焊盘焊接焊球。 陶瓷板和树脂印刷电路板以这样的方式彼此对准，使得它们的焊盘彼此对准。 焊盘与低熔点焊料焊接在一起。 每个接合焊盘的突出部分嵌入或被一群低熔点焊料围绕，并与焊料块接合，构成整体单元，同时用作该单元的核心。 由于温度变化而作用于陶瓷板和陶瓷板的主表面平行的塑料或树脂板的剪切力通过焊料的质量被施加到要被支撑的突起上，由此到 防止焊料质量发生裂缝或裂缝的起始和生长。
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18.发明公开
公开(公告)号：EP0828410A3
公开(公告)日：1998-03-18
申请号：EP97202494.7
申请日：1997-08-12
Applicant: DELCO ELECTRONICS CORPORATION
Inventor： Stankavich, Anthony John , Sarma, Dwadasi Hare Rama , Paszkiet, Christine Ann , Ellis, Marion Edmond
IPC: H05K3/34
CPC classification number: H05K3/3484 , H01L2224/16225 , H01L2224/32 , H05K1/092 , H05K2201/10992 , H05K2203/043
Abstract: A high temperature thick-film hybrid circuit characterized by a surface-mount circuit component (10) that is electrically interconnected with a conductor (14). The surface-mount circuit component (10) of the thick-film hybrid circuit is bonded to the conductor (14) with a soldering technique employing dual-solder layers (18,20). The dual-solder layers (18,20) enable component attachment to the conductor (14) at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165°C. The dual-solder layers (18,20) chosen to inhibit tin diffusion from the solder, silver leaching from the conductor (14), and the formation of a brittle intermetallic at the solder-conductor interface.
Abstract translation: 一种高温厚膜混合电路，其特征在于与导体（14）电互连的表面安装电路元件（10）。 利用采用双焊料层（18,20）的焊接技术将厚膜混合电路的表面安装电路元件（10）粘合到导体（14）上。 双焊料层（18,20）使元件在低于元件最大加工温度的温度下连接到导体（14），同时形成在超过165℃的温度下表现出合适的粘附特性的焊点。 选择双焊料层（18,20）以抑制锡从焊料中扩散，银从导体（14）中浸出，以及在焊料 - 导体界面处形成脆性金属间化合物。
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公开(公告)号：EP0804056A2
公开(公告)日：1997-10-29
申请号：EP97106924.0
申请日：1997-04-25
Applicant: NGK Spark Plug Co. Ltd.
IPC: H05K3/34
CPC classification number: H01R12/52 , H01R43/0235 , H05K3/3436 , H05K3/3478 , H05K2201/035 , H05K2201/10378 , H05K2201/10424 , H05K2201/10992 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , Y02P70/613 , Y10T29/49126 , Y10T29/49149 , Y10T29/49165
Abstract: A connecting board for electrically and mechanically connecting a base plate such as a circuit board having disposed thereon an IC chip to a mounting board such as a motherboard. The connecting board includes a substrate having a plurality of through holes, a plurality of soft metal bodies which are deformable with ease and which are mounted in the through holes, and a plurality of solder layers disposed on upper and lower end portions of the soft metal bodies. The soft metal bodies are mounted in the through holes by disposing soft metal pieces at end portions of the through holes, heating and melting and allowing them to be poured into the through holes. The solder layers are disposed on the upper and lower end portions of the soft metal bodies by using transfer jigs each having a plurality of holes filled with solder paste, placing the jigs on the upper and lower end portions of the soft metal bodies, melting the solder paste and allowing them to he transferred onto the soft metal bodies. An assembly of the base plate, connecting board and mounting board can be obtained by placing them one upon another and heating them.
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20.发明授权TIN-BISMUTH SOLDER CONNECTION HAVING IMPROVED HIGH TEMPERATURE PROPERTIES, AND PROCESS FOR FORMING SAME 失效具有改进的高温性能与教育过程锡WISMUT-焊接连接。
公开(公告)号：EP0643903B1
公开(公告)日：1997-08-06
申请号：EP94912785.6
申请日：1994-03-17
Applicant: MOTOROLA, INC.
Inventor： MELTON, Cynthia , FUERHAUPTER, Harry , DEMET, George
CPC classification number: H05K3/3484 , B23K35/007 , B23K35/264 , H05K3/243 , H05K3/3442 , H05K3/3452 , H05K3/3463 , H05K3/3473 , H05K2201/0317 , H05K2201/10636 , H05K2201/10992 , H05K2203/0435 , H05K2203/054 , Y02P70/611
Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.
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