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    Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
    12.
    发明公开
    Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method 审中-公开
    一种用于通过加成法的装置，印刷电路板和与该方法获得的多层印刷电路板制造电路板的方法

    公开(公告)号：EP2592912A1

    公开(公告)日：2013-05-15

    申请号：EP13000238.9

    申请日：2009-04-30

    申请人： Panasonic Corporation

    发明人： Yoshioka, Shingo ,  Fujiwara, Hiroaki

    IPC分类号： H05K1/02 ,  H05K1/16 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46

    CPC分类号： H05K3/107 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/111 ,  H05K1/162 ,  H05K3/0032 ,  H05K3/184 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0565 ,  H05K2203/161

    摘要： The present invention relates to a circuit board comprising:
    a circuit groove having at least one land region for surface mounting of electronic parts and at least one circuit wiring region formed integrally with the land region, and
    a partial reinforcing structure formed in the land region of the circuit groove,
    wherein the partial reinforcing structure is at least one structure selected from a group consisting of:
    an irregular shape having a ten-point average roughness (Rz) of 0.1 to 20 µm formed on the groove surface in the land region,
    a groove shape having the groove depth in the land region larger than that of the circuit wiring region to form a plated film having thickness in the land region thicker than that of the circuit wiring region, and
    a structure formed by forming at least one protrusion on the periphery of the groove in the land region.

    摘要翻译： 本发明涉及一种电路板，包括：具有用于电子部件表面安装的至少一个国家区域和与国家，地区一体形成的至少一个电路布线区域，并在土地区域形成的局部加固结构的电路槽 所述电路凹槽，worin的局部加固结构是从以下一组中选出的至少一种结构：具有0.1微米至20微米的十点平均粗糙度（Rz）在陆地区域形成的凹槽表面上的不规则形状，一个 具有在陆地区域比电路布线区域的较大的槽深的槽形状，以形成在该国区域比电路布线区域的较厚的电镀具有膜厚，并通过形成在所述至少一个突起形成的结构 在陆地区域中的槽的周边上。

    METHOD OF FORMING MICROSTRUCTURES, LASER IRRADIATION DEVICE, AND SUBSTRATE
    13.
    发明公开
    METHOD OF FORMING MICROSTRUCTURES, LASER IRRADIATION DEVICE, AND SUBSTRATE 审中-公开
    VERFAHREN ZUR FORMUNG VON MIKROSTRUKTUREN，LASERBESTRAHLUNGSVORRICHTUNG UND SUBSTRAT

    公开(公告)号：EP2557906A1

    公开(公告)日：2013-02-13

    申请号：EP11766008.4

    申请日：2011-04-08

    申请人： Fujikura, Ltd.

    发明人： WAKIOKA, Hiroyuki

    IPC分类号： H05K3/10 ,  H05K3/00

    CPC分类号： H05K3/002 ,  H05K3/101 ,  H05K3/107 ,  H05K3/4038 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/128 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24744

    摘要： A microstructure forming method includes a step A of irradiating a region of a substrate, in which a hole-shaped or groove-shaped microstructure is to be formed, with a circularly or elliptically polarized laser beam having a pulse width of which the pulse duration is on the order of picoseconds or shorter, and scanning a focal point at which the laser beam converges to form a modified region, and a step B of performing an etching process on the substrate in which the modified region is formed and removing the modified region to form a microstructure.

    摘要翻译： 微结构形成方法包括：步骤A，其将要形成孔形或凹槽状微结构的基板的区域用脉冲宽度为脉冲宽度的圆偏振或椭圆偏振激光束照射 以皮秒或更短的顺序，扫描激光束会聚的焦点以形成改性区域;以及步骤B，对形成有改质区域的基板进行蚀刻处理，并将修饰区域除去 形成微结构。

    A method of forming a high density structure
    17.
    发明公开
    A method of forming a high density structure 审中-公开
    Verfahren zum Formen einer Struktur mit hoher Dichte

    公开(公告)号：EP2146559A1

    公开(公告)日：2010-01-20

    申请号：EP08160452.2

    申请日：2008-07-15

    申请人： Nederlandse Organisatie voor Toegepast- Natuurwetenschappelijk Onderzoek TNO

    发明人： Van den Brand, Jeroen ,  Dietzel, Andreas Heinrich

    IPC分类号： H05K3/10 ,  H05K3/12

    CPC分类号： H05K3/107 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2203/0264

    摘要： The invention relates to a method of forming a high density structure comprising the steps of providing a substrate (2) wherein the high density structure is to be formed with a release liner (3), said release liner being self-removable; forming at least one cavity (5a, 5b) in the substrate through the release liner, said at least one cavity forming at least a part of the high density structure; at least partially filling the at least one cavity with a filler material (7a, 7b); removing the release liner from the substrate (2).

    摘要翻译： 本发明涉及一种形成高密度结构的方法，包括以下步骤：提供其中高密度结构将被形成有剥离衬垫（3）的基底（2），所述剥离衬垫是可自行去除的; 通过所述隔离衬垫在所述衬底中形成至少一个空腔（5a，5b），所述至少一个空腔形成所述高密度结构的至少一部分; 至少部分地用填充材料（7a，7b）填充所述至少一个空腔; 从衬底（2）上移除释放衬垫。

    Providing a plastic substrate with a metallic pattern
    18.
    发明公开
    Providing a plastic substrate with a metallic pattern 审中-公开
    Bereitstellung eines Kunststoffsubstrats mit metallischem Muster

    公开(公告)号：EP2124514A1

    公开(公告)日：2009-11-25

    申请号：EP08156833.9

    申请日：2008-05-23

    申请人： Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO

    发明人： Meinders, Erwin Rinaldo ,  Peter, Maria ,  Furthner, Francois ,  Tacken, Roland Anthony

    IPC分类号： H05K3/10

    CPC分类号： H05K3/107 ,  B29C59/022 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  G03F7/0002 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184 ,  H05K3/387

    摘要： The invention is directed to a method of providing a plastic substrate (1) with a metallic pattern (8) and to a plastic substrate (1) with a metallic pattern (8) obtainable by said method.
    The method of the invention comprises
    i) replicating a pattern of recesses and protrusions on a plastic substrate (1) by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate (1) with recesses and protrusions;
    ii) removing said stamp from said substrate;
    iii) - providing a layer of seed material (2) capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate at least in the recesses of said plastic substrate;
    - optionally providing a layer of inhibitor material on top of or below said layer of seed material (2); and
    - if necessary, etching excess seed material (2) and/or excess inhibitor material (3),
    to yield a substrate wherein said seed material (2) and/or said inhibitor material (3) remains selectively in the recesses or on the protrusions of said substrate; and thereafter
    iv) using said seed material (2) to initiate a metal deposition process.

    摘要翻译： 本发明涉及一种用金属图案（8）和塑料基板（1）提供具有通过所述方法可获得的金属图案（8）的塑料基板（1）的方法。 本发明的方法包括：i）通过将具有凹陷和突起的印模压靠在基底上，从而将塑料基底（1）上的凹槽和突出物提供到塑料基片（1）上，复制凹凸图案; ii）从所述基底上去除所述印模; iii） - 至少在所述塑料基板的凹部中提供能够在所述塑料基板上启动无电镀或电化学金属沉积工艺的种子材料层（2）; - 任选地在所述种子材料层（2）之上或之下提供一层抑制剂材料; 并且如果需要，蚀刻多余的种子材料（2）和/或过量的抑制剂材料（3），以产生其中所述种子材料（2）和/或所述抑制剂材料（3）选择性地保留在凹部中或在 所述基板的突起; 然后iv）使用所述种子材料（2）引发金属沉积工艺。