公开(公告)号：EP1529812A1

公开(公告)日：2005-05-11

申请号：EP04023887.5

申请日：2004-10-07

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Lee, Yueh-Ling ,  Min, Gary Yonggang

IPC: C08L79/08 ,  B32B27/00

CPC classification number: B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  C08G73/10 ,  C08L27/18 ,  C08L79/08 ,  C09K19/38 ,  C09K2219/03 ,  C09K2219/11 ,  H01L2924/0002 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/281 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/24 ,  Y10T428/249921 ,  Y10T428/31721 ,  C08L2666/20 ,  H01L2924/00

Abstract: The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375 °C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns).
The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.

Abstract translation: 本发明是一种聚合物复合材料，包括聚酰亚胺成分和从微粉末得到的含氟聚合物组分。 将上述含氟聚合物微粉的熔融点250和375℃之间的含氟聚合物微粉对20和5000纳米米（5.0微米）之间的平均粒径。 的聚酰亚胺组分和含氟聚合物组分是相互混合以高分散水平，其中所述含氟聚合物组分存在于从10％至60％的重量比。 两种组分本文的聚合物复合材料是在高速数字电路或高信号完整性用于数字信号的低损耗薄膜的形式是特别有用的。 因此，该膜可以用作绕丝，或作为覆盖层或基膜的基材用于柔性电路层压板。

公开(公告)号：EP1479729A1

公开(公告)日：2004-11-24

申请号：EP04019933.3

申请日：2000-11-29

Applicant: OTSUKA CHEMICAL COMPANY, LIMITED

Inventor： Kawaguchi, Akiyoshi Otsuka Chemical Co., Ltd. ,  Ishii, Yoshiaki Otsuka Chemical Co., Ltd. ,  Tsutsumi, Hideyuki Otsuka Chemical Co., Ltd. ,  Tanaka, Tomohiro Otsuka Chemical Co., Ltd.

IPC: C08L101/00 ,  C08K7/00 ,  C08K9/00 ,  H05K1/03 ,  C08K3/34

CPC classification number: C08K7/00 ,  C08K3/01 ,  C08K2201/016 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  Y10S428/901 ,  Y10T428/24994

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300°C or above and (B) a flaky inorganic filler incorporated in the resin and having a pH of aqueous dispersion in the range of 5.5-8.0, and an amount of extracted alkalis: Na = 30 ppm or below and K = 40 ppm or below.

Abstract translation: 一种树脂组合物，其特征在于含有（A）熔融温度为300℃以上的合成树脂和（B）掺入树脂中的片状无机填料，其水分散体的pH为5.5-8.0，以及 提取碱的量：Na = 30ppm以下，K = 40ppm以下。

公开(公告)号：EP1423995A2

公开(公告)日：2004-06-02

申请号：EP02763569.7

申请日：2002-08-29

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： SAMUELS, Michael, R. ,  KAHN, Subhotosh ,  MIKHAIL, Levit, R.

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  B29B13/10 ,  B32B15/14 ,  B32B27/12 ,  D04H1/4374 ,  D04H1/4382 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249941 ,  Y10T442/30

Abstract: A sheet comprising thermoplastic polymer (TP) (4) and short high tensile modulus fibers (3) , in which the concentration of TP (4) in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

公开(公告)号：EP1395102A2

公开(公告)日：2004-03-03

申请号：EP03018683.7

申请日：2003-08-22

Applicant: Kuraray Co., Ltd.

Inventor： Tsugaru, Toshinori, Kuraray Co., Ltd. ,  Sunamoto, Tatsuya, Kuraray Co., Ltd. ,  Yoshikawa, Tadao, Kuraray Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2203/1189 ,  Y10T428/24917

Abstract: To provide a simplified method of making a multi-layer circuit board capable of observing a high density surface mounting of electronic parts, a method is provided for making a multi-layer circuit board including a first film (A) and at least two more films, second and third films (B and C), each being made of thermoplastic polymer capable of forming an optically anisotropic melt phase. The first film (A) has a low melting point (Tm 1 ), and the second and third films (B and C) have respective melting points (Tm 2 B and Tm 2 C) higher than the melting point (Tm 1 ) of the first film (A). And at least one of the second and the third films have a circuit pattern thereon. The first to third films (A to C) are thermo compressed together with the first film (A) interposed between the second and third films (B and C). The method includes causing at least one of the circuit patterns (D) on one of the second and third films (B and C) to contact an opposing surface of the other of the second and third films (B and C) through the first film (A) during the thermo compression bonding of the first to third films (A to C).

Abstract translation: 为了提供能够观察电子部件的高密度表面安装的多层电路板的简化方法，提供了一种制造包括第一膜（A）和至少两个以上膜的多层电路板的方法 ，第二和第三膜（B和C），每个由能够形成光学各向异性熔融相的热塑性聚合物制成。 第一膜（A）具有低熔点（Tm 1），第二膜和第三膜（B和C）的熔点（Tm 2 B和Tm 2 C）分别比熔点 第一部电影（A）。 并且第二和第三薄膜中的至少一个具有其上的电路图案。 第一至第三膜（A至C）与介于第二和第三膜（B和C）之间的第一膜（A）一起被热压。 所述方法包括使所述第二和第三膜（B和C）中的一个上的电路图案（D）中的至少一个与所述第二和第三膜（B和C）中的另一个的相对表面通过所述第一膜 （A）在第一至第三膜（A至C）的热压接期间。

公开(公告)号：EP1234857A4

公开(公告)日：2003-01-08

申请号：EP00979013

申请日：2000-11-29

Applicant: OTSUKA CHEMICAL CO LTD

Inventor： KAWAGUCHI AKIYOSHI ,  ISHII YOSHIAKI ,  TSUTSUMI HIDEYUKI ,  TANAKA TOMOHIRO

IPC: C08K3/00 ,  C08K7/00 ,  H05K1/00 ,  H05K1/03 ,  C08L101/00 ,  C08K3/34 ,  C08K9/00

CPC classification number: C08K7/00 ,  C08K3/01 ,  C08K2201/016 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  Y10S428/901 ,  Y10T428/24994

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300 DEG C or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5 - 8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 mu m or below, thickness b: 1.0 mu m or below, and aspect ratio (a/b): 20 or above.

公开(公告)号：EP1162866A2

公开(公告)日：2001-12-12

申请号：EP01250200.1

申请日：2001-06-05

Applicant: Matsushita Electric Works, Ltd.

Inventor： Ikegawa, Naoto, c/oMatsushita Electric Works Ltd. ,  Kondo, Naoyuki, c/oMatsushita Electric Works Ltd. ,  Nakata, Kimiaki, c/oMatsushita Electric Works Ltd.

IPC: H05K1/03 ,  C23C14/20

CPC classification number: H05K1/0366 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/095 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2916 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: The invention relates to a laminate comprising a metal layer which is formed on an covers the surface of an insulating substrate activated by the plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 µm and an average fiber length of 10 to 50 µm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.

Abstract translation: 本发明涉及一种层压体，其包括通过溅射法，真空沉积法和离子镀法中的任何一种方法形成在覆盖通过等离子体处理而激活的绝缘基板的表面上的金属层。 通过将相对于100质量份的平均纤维直径为0.1〜5μm，平均纤维长度为10〜50μm的纤维状填料，含有20〜150质量份的纤维填料， 包含热塑性树脂和热固性树脂的基础树脂。

公开(公告)号：EP1143775A2

公开(公告)日：2001-10-10

申请号：EP01109106.3

申请日：1996-08-16

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Hansen, Dennis D. ,  Kropp, Michael A. ,  Connell, Glen

IPC: H05K3/32 ,  C09J9/02 ,  C09J177/00

CPC classification number: H05K3/323 ,  B32B27/00 ,  C08G69/40 ,  C08G69/44 ,  C08L2666/22 ,  C09J9/02 ,  C09J177/00 ,  C09J177/12 ,  H01B1/22 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0141

Abstract: The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition (20), preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern (14) on a first substrate (12) to a second circuit pattern (18) on a second substrate (16). The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles (22).

Abstract translation: 本发明提供了一种微电子组件，其中优选以膜的形式提供的半结晶共聚物粘合剂组合物（20）用于将第一衬底（12）上的第一电路图案（14）电连接到第二衬底 电路图案（18）在第二基板（16）上。 粘合剂组合物优选包括包含聚醚和聚酰胺单体单元的半结晶共聚物，增粘剂和导电颗粒（22）。

公开(公告)号：EP1133902A2

公开(公告)日：2001-09-19

申请号：EP99968773.4

申请日：1999-11-03

Applicant: DEUTSCHE THOMSON-BRANDT GMBH

Inventor： STRUBEL, Volker ,  HALLER, Hans-Otto

IPC: H05K1/03 ,  H05K3/00 ,  B32B27/08

CPC classification number: H05K1/036 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/0064 ,  H05K3/046 ,  H05K2201/0116 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0162 ,  H05K2201/0195 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The invention relates to an electromechanical component (1) which is configured as a sandwich-type structure. In the interior of said structure, a support layer (2) consisting of foamed plastic is arranged. Said support layer (2) is placed between covering layers (4, 5) which consist of compact materials. All layers (2, m4, 5) are produced from hardly inflammable plastic material, for example LCP or PEI plastics so that it is not necessary to add any flame-retardant additives. The component (1) can be configured in the shape of a slab but it can also have a more complex three-dimensional structure and can optionally be provided with mechanical functional elements. According to an aspect of the invention, the support layer (2) of the component can consist of silicone. The composition of the inventive component (1) provides a means for simplifying recycling a product at the end of its lifetime.

公开(公告)号：EP0949067A3

公开(公告)日：2001-07-18

申请号：EP99106126.8

申请日：1999-04-06

Applicant: Kuraray Co., Ltd.

Inventor： Tanaka, Yoshinobu ,  Tsudaka, Takeichi ,  Onodera, Minoru ,  Sato, Toshiaki

IPC: B32B31/00 ,  B32B15/08

CPC classification number: B32B15/08 ,  B32B38/10 ,  B32B2305/55 ,  B32B2309/02 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/462 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/0264 ,  H05K2203/1536 ,  Y10T156/1059 ,  Y10T156/1911 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/1086 ,  Y10T428/31681

Abstract: A coating layer of a polymer capable of forming an optically anisotropic melt phase is formed by heat-pressing to a base material (3) a film (2) made of the polymer and having a segment orientation ratio of not greater than 1.3 and then separating the film into two halves (2a,2b) so as to leave one of the halves (2a) on the base material (3), thereby obtaining a coated material made of the base material and the thin coating layer.

公开(公告)号：EP0612610B1

公开(公告)日：1998-07-08

申请号：EP94301352.4

申请日：1994-02-25

Applicant: JAPAN GORE-TEX, INC.

Inventor： Moriya, Akira

IPC: B32B27/04 ,  B32B27/12

CPC classification number: B32B27/08 ,  B29C55/00 ,  B29C55/023 ,  B29C55/026 ,  B29K2105/0079 ,  B32B5/18 ,  B32B27/322 ,  B32B27/36 ,  B32B38/0012 ,  B32B38/08 ,  B32B2038/0028 ,  B32B2305/026 ,  B32B2307/52 ,  B32B2309/105 ,  H05K1/0353 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2203/0271