公开(公告)号：EP0048992B1

公开(公告)日：1988-12-07

申请号：EP81107748.6

申请日：1981-09-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Oodaira, Hiroshi ,  Nagashima, Kenji ,  Matsumoto, Hiroshi ,  Tanaka, Masataka

IPC: H05K1/05 ,  H05K3/44

CPC classification number: H05K1/053 ,  H05K2201/0116 ,  H05K2201/0179 ,  H05K2201/0239 ,  H05K2203/1147

公开(公告)号：EP0099544B1

公开(公告)日：1986-10-08

申请号：EP83106871.3

申请日：1983-07-13

Applicant: International Business Machines Corporation

Inventor： Schaible, Paul Martin ,  Suierveld, John

IPC: H01L21/48

CPC classification number: H05K3/4647 ,  H01L21/486 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0306 ,  H05K3/061 ,  H05K3/4605 ,  H05K2201/0179 ,  H05K2203/0369 ,  H05K2203/0733

公开(公告)号：EP0057085B1

公开(公告)日：1984-12-05

申请号：EP82300306.6

申请日：1982-01-21

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nagashima, Kenji ,  Matsumoto, Hiroshi ,  Tanaka, Masataka ,  Oodaira, Hirosi ,  Iwase, Nobuo

IPC: H01L21/48 ,  H01L25/16 ,  H01L49/02 ,  H01L23/14

CPC classification number: H05K3/22 ,  H01L21/4846 ,  H01L23/142 ,  H01L23/3735 ,  H01L25/16 ,  H01L2224/48227 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2201/0179 ,  H05K2203/1147 ,  Y10T29/4913 ,  Y10T29/49144

公开(公告)号：EP3258751A1

公开(公告)日：2017-12-20

申请号：EP17176251.1

申请日：2017-06-15

Applicant: Nano Shield Technology Co., Ltd.

Inventor： Cheng Lee, James

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K1/185 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0257 ,  H05K2203/1333

Abstract: A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

Abstract translation: 提供了一种用于使装置防水的方法和所得到的装置。 该装置包括印刷电路板组件（PCBA），其包括印刷电路板以及布置在印刷电路板上的至少一个电子部件。 诸如聚合物涂层的防水涂层设置在至少一个电子部件的至少一部分上或与其接触。 纳米膜布置在PCBA上。 纳米膜包括内涂层和外涂层。 内涂层设置在印刷电路板上或与防水涂层接触。 内涂层包含具有约5nm至约100nm范围内的粒径的金属氧化物纳米粒子。 外涂层与内涂层接触，并且包含具有0.1nm至10nm范围内的粒径的二氧化硅纳米粒子。

公开(公告)号：EP2224479B1

公开(公告)日：2016-05-11

申请号：EP10005899.9

申请日：2006-05-24

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Oshika, Yoshikazu

IPC: H05K1/05

CPC classification number: H05K1/053 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2224/85469 ,  H01L2224/85484 ,  H01L2924/00011 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01S5/02272 ,  H01S5/02476 ,  H05K2201/0179 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01004

公开(公告)号：EP2641456A1

公开(公告)日：2013-09-25

申请号：EP11785760.7

申请日：2011-11-09

Applicant: Semblant Limited

Inventor： VON WERNE, Timothy

IPC: H05K3/28

CPC classification number: H05K3/282 ,  H05K1/032 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/09872 ,  H05K2203/095

Abstract: A method for reducing creep corrosion on a printed circuit board, the printed circuit board comprising a substrate, a plurality of electrically conductive tracks located on at least one surface of the substrate, a solder mask coating at least a first area of the plurality of electrically conductive tracks and a surface finish coating at least a second area of the plurality of electrically conductive tracks, the method comprising depositing by plasma-polymerization a fluorohydrocarbon onto at least part of the solder mask and at least part of the surface finish.

公开(公告)号：EP1937043A4

公开(公告)日：2012-10-24

申请号：EP06821879

申请日：2006-10-16

Applicant: IBIDEN CO LTD

Inventor： KARIYA TAKASHI ,  TANAKA HIRONORI

IPC: H05K1/16 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/46

CPC classification number: H05K1/162 ,  H01L21/4867 ,  H01L23/498 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/388 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

公开(公告)号：EP1665915B1

公开(公告)日：2010-12-15

申请号：EP04782987.4

申请日：2004-09-02

Applicant: Medtronic MiniMed, Inc.

Inventor： PENDO, Shaun ,  SHAH, Rajiv

IPC: H05K3/46 ,  H01L21/48

CPC classification number: H05K3/467 ,  H01L21/4857 ,  H01L21/4867 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K1/162 ,  H05K3/048 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/4664 ,  H05K2201/0179 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K2203/1476 ,  H05K2203/308 ,  H01L2924/00

Abstract: A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.

公开(公告)号：EP2224479A2

公开(公告)日：2010-09-01

申请号：EP10005899.9

申请日：2006-05-24

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Oshika, Yoshikazu

IPC: H01L23/12 ,  H01L23/36 ,  H01S5/022

CPC classification number: H05K1/053 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2224/85469 ,  H01L2224/85484 ,  H01L2924/00011 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01S5/02272 ,  H01S5/02476 ,  H05K2201/0179 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01004

Abstract: A metal-ceramic composite substrate having excellent heat dissipation and a method of manufacturing such a metal-ceramic composite substrate at low cost are disclosed. A metal-ceramic composite substrate (10) comprises a metal substrate (11) having front and rear surfaces, a ceramic layer (12) formed on each of the front and rear surfaces of the metal substrate (11), an electrode layer (13) formed on each ceramic layer (12) and a solder layer (14) formed on each electrode layer (13). Each ceramic layer (12) is in the form of a thin film of a ceramic.

Abstract translation: 公开了一种具有优异散热性的金属 - 陶瓷复合基板以及以低成本制造这种金属 - 陶瓷复合基板的方法。 本发明提供一种金属陶瓷复合基板（10），其特征在于，具备：具有表面和背面的金属基板（11），在该金属基板（11）的表面和背面分别形成的陶瓷层（12），电极层 ）和形成在每个电极层（13）上的焊料层（14）。 每个陶瓷层（12）都是陶瓷薄膜的形式。

公开(公告)号：EP2136399A1

公开(公告)日：2009-12-23

申请号：EP08739676.8

申请日：2008-04-02

Applicant: Ibiden Co., Ltd.

Inventor： KAWANO, Shuichi

IPC: H01L23/32 ,  H01L23/12

CPC classification number: H05K1/162 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/423 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/0733 ,  H01L2924/00

Abstract: An interposer 10 is constructed with a substrate body 12 having first and second through-holes 14,16, a capacitor 20 formed by a laminating dielectric layer 24 and a second electrode portion 26 on a first electrode portion 22, which is structured on inner surfaces of first and second through-holes 14,16 and on the first surface of the substrate body 12. An insulation layer 18 is formed by filling insulation material in the space within the first through-hole 14 surrounded by second electrode portion 26, and a first post 40 passes through the insulation layer 18, one end being electrically connected to the first electrode portion 22, while the first post 40 is electrically insulated from the second electrode portion 26. Furthermore, a second post 42 is formed in the second through-hole 16, and is connected to the second electrode portion 26 at its peripheral surface while being electrically insulated from the first electrode portion 22.

Abstract translation: 中介层10由具有第一和第二通孔14,16的基板主体12，由层压介电层24形成的电容器20和在第一电极部分22上的第二电极部分26构成，第一电极部分22构造在内表面 第一和第二通孔14,16以及衬底本体12的第一表面上形成绝缘层18.绝缘层18通过在由第二电极部分26围绕的第一通孔14内的空间中填充绝缘材料而形成， 第一支柱40穿过绝缘层18，其一端电连接到第一电极部分22，而第一支柱40与第二电极部分26电绝缘。此外，第二支柱42形成在第二支柱40中。 在与第一电极部22电绝缘的状态下与第二电极部26的周面连接。