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    Grounding terminal and mounting structure of the same on a printed circuit board
    23.
    发明公开
    Grounding terminal and mounting structure of the same on a printed circuit board 有权
    Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte

    公开(公告)号：EP0954067A2

    公开(公告)日：1999-11-03

    申请号：EP99108326.2

    申请日：1999-04-28

    Applicant: Kitagawa Industries Co., Ltd.

    Inventor： Yumi, Hideo

    IPC: H01R23/70 ,  H01R13/648

    CPC classification number: H05K3/341 ,  H01R4/64 ,  H01R12/57 ,  H01R13/24 ,  H01R43/0256 ,  H05K1/0215 ,  H05K2201/09663 ,  H05K2201/1031 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

    Abstract: The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

    Abstract translation: 本发明通过解决通过回流焊接将接地端子焊接到印刷电路板上的问题，实现了对接地导体的正确接地，涉及通过焊接形成的印刷电路板上的接地端子的安装结构 一个到印刷电路板的接地端子。 在接地端子的接合部分内形成具有不同表面积的两个接合表面，并且通过使用具有对应于表面积的量的焊料将接地端子焊接到与接合表面相对应的印刷电路板上的导电图案上 的每个接合面。 而且，作为接地端子的接触部的弹性变形的中心的弯曲区域形成为远离接合部的相对较小的接合面的预定距离。

    Chip-type electronic component
    24.
    发明公开
    Chip-type electronic component 有权
    Elektronisches Bauelement in Chipbauweise und Verfahren zu seiner Herstellung

    公开(公告)号：EP0949642A2

    公开(公告)日：1999-10-13

    申请号：EP99302518.8

    申请日：1999-03-31

    Applicant: TDK Corporation

    Inventor： Ahiko, Taisuke ,  Sato, Hiroki ,  Ishigaki, Takaya ,  Kamiya, Takashi ,  Yamamoto, Masanori

    IPC: H01G4/232

    CPC classification number: H01G4/012 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A ceramic substrate (1) has two side surfaces (64, 65) in a lengthwise direction (X) and two side surfaces (66, 67) in a widthwise direction Y intersecting each other, and is also provided with at least one flat surface (68) in a thicknesswise direction (Z). Internal electrode films (2 to 11) are embedded in the ceramic substrate (1) with film surfaces thereof extending roughly parallel to the flat surface (68) of the ceramic substrate (1). External electrodes (44, 55) are each provided on the flat surface (68) of the ceramic substrate (1) toward one of the two ends of the ceramic substrate (1) in the lengthwise direction (X), are electrically continuous with the internal electrode films (2 to 11) and are formed over distances (d11, d12) and (d21, d22) from the two side surfaces (66, 67) in the widthwise direction (Y).

    Abstract translation: 陶瓷基板（1）在长度方向（X）上具有两个侧表面（64,65）和沿宽度方向Y彼此相交的两个侧表面（66,67），并且还设置有至少一个平坦表面 （68）在厚度方向（Z）上。 内部电极膜（2〜11）嵌入在陶瓷基板（1）中，其膜表面大致平行于陶瓷基板（1）的平坦表面（68）延伸。 在陶瓷基板（1）的平坦表面（68）上沿着长度方向（X）向陶瓷基板（1）的两端之一设置外部电极（44,45），与陶瓷基板 内部电极膜（2〜11），并且在宽度方向（Y）上从两个侧面（66,67）的距离（d11，d12）和（d21，d22）形成。

    Lötverbindung für elektrische Verbindungen
    26.
    发明公开
    Lötverbindung für elektrische Verbindungen 失效
    Lötverbindungfürelektrische Verbindungen

    公开(公告)号：EP0865102A2

    公开(公告)日：1998-09-16

    申请号：EP97104462.3

    申请日：1997-03-15

    Applicant: Mannesmann VDO AG

    Inventor： König, Eberhard

    IPC: H01R4/02

    CPC classification number: H05K3/3447 ,  H01R4/02 ,  H01R12/58 ,  H05K1/0268 ,  H05K1/0293 ,  H05K1/116 ,  H05K2201/0305 ,  H05K2201/09663 ,  H05K2203/173

    Abstract: Die Lötverbindung mit einem Kontaktstift (2) einem Lötauge (3) und einer Leitung (4), wobei das Leitungsende (5) innerhalb der Außenbegrenzung (6) des Lötauges (3) liegt, weist die Besonderheit auf, daß das Lötauge (3) im Bereich des Leitungsendes (5) eine Ausnehmung (7) aufweist, wodurch ein das Leitungsende (5) allseits umgebender Spalt (8) vorliegt, der beim Lötvorgang durch Lötmaterial geschlossen wird.

    Abstract translation: 连接点包括接触针（2），封闭销的焊接凸耳（3）和至少一个导体（4），其端部（5）位于凸耳内。 焊接凸耳在导体附近具有孔（7），其间隙（8）封闭在待焊接的导体的所有侧面上。 当焊接工艺将接触销连接到凸耳上时，间隙被焊接材料封闭。 在导体端附近可以加宽凸耳。 导体端可以加宽。

    A CIRCUIT BOARD WITH SPECIFICALLY DESIGNED CONNECTION TERMINALS
    27.
    发明公开
    A CIRCUIT BOARD WITH SPECIFICALLY DESIGNED CONNECTION TERMINALS 失效
    具有特殊阐述连接面电路板

    公开(公告)号：EP0739579A1

    公开(公告)日：1996-10-30

    申请号：EP95907168.0

    申请日：1995-01-12

    Applicant: XICON AB

    Inventor： WIKSTRÖM, Bo

    IPC: H05K1 ,  H05K3

    CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K3/321 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611

    Abstract: A circuit board (10) with spaced circuits (13) and connection terminals (12) of metal for connection of electrical components (11) between the connection terminals by means of electrically conductive glue (14), which connects the connection terminals (12) and the components (11) electrically and mechanically. The connection terminals (12) are designed in pairs with substantially continuous fronts (15) facing each other with a space (18), which is delimited behind the front (15) and is free from circuits (13) and connection terminals (12), for receiving and adhesion of the glue (14).

    Semiconductor package
    29.
    发明公开
    Semiconductor package 失效
    Halbleitergehäusung。

    公开(公告)号：EP0656741A2

    公开(公告)日：1995-06-07

    申请号：EP94118303.0

    申请日：1994-11-21

    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

    Inventor： Miyawaki, Katumi, Mitsubishi Denki K.K. ,  Usuki, Tosio, Mitsubishi Denki K.K.

    IPC: H05K3/34

    CPC classification number: H05K3/3442 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/3025 ,  H05K1/0237 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A semiconductor package comprises a package body (101), a semiconductor chip disposed on the surface of the package body, a plurality of external lead terminals (5) disposed on opposite two side surfaces of the package body, a lid (4) hermetically sealing and shielding the semiconductor chip in the package body, a package substrate (1) having a metallized region (2) on which the package body is mounted, and a metal layer (110) disposed on the rear surface of the package body and connected to the metallized region of the package substrate (1) with solder (6). The metal layer (110) comprises a material having a good adhesion with the solder and has a pattern in which stripe-shaped metal portions (110a) abut on opposite two side surfaces of the package body where the external lead terminals are absent, and stripe-shaped openings (110b) of the metal layer abut on the respective metal portions (110a). Therefore, when the package body (101) is soldered to the package substrate (1), unwanted flow of the melted solder toward the center of the package body is stopped at the openings (110b) of the metal layer (110). Therefore, solder fillets (9) are produced on the side surfaces of the package body with high reliability, whereby the connecting condition can be inspected with eyes using the solder fillets (9).

    Abstract translation: 半导体封装包括封装主体（101），设置在封装主体表面上的半导体芯片，设置在封装体的相对的两个侧表面上的多个外部引线端子（5），密封（4） 并且屏蔽封装主体中的半导体芯片，具有安装有封装体的金属化区域（2）的封装基板（1）和设置在封装主体的后表面上的金属层（110） 所述封装衬底（1）的金属化区域具有焊料（6）。 金属层（110）包括与焊料具有良好粘附性的材料，并且具有条形金属部分（110a）邻接在外部引线端子不存在的封装主体的相对两个侧表面上的条纹，条纹 金属层的开口（110b）邻接在各个金属部分（110a）上。 因此，当将封装主体（101）焊接到封装基板（1）时，熔融的焊料朝向封装体的中心的不期望的流动停止在金属层（110）的开口（110b）处。 因此，在封装主体的侧面上以高可靠性制造焊接圆角（9），由此可以使用焊接圆角（9）用眼睛检查连接状态。

    Electrical connectors
    30.
    发明公开
    Electrical connectors 失效
    电连接器

    公开(公告)号：EP0643440A2

    公开(公告)日：1995-03-15

    申请号：EP94203444.8

    申请日：1992-06-03

    Applicant: MOD-TAP W CORPORATION

    Inventor： White, Rowland Spencer ,  Ivey, David Ernest ,  Jones, Keith Henry

    IPC: H01R4/24 ,  H01R9/24

    CPC classification number: H01R4/2429 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/142 ,  H05K3/42 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/09954

    Abstract: An insulation displacement contact (10) comprises first and second contact portions each of which comprises a cantilevered split beam (19). The upper split beam, which receives insulated wires, comprises a pair of tynes (20,22) which are folded about the axis of a slot (25) separating the tynes such that the internal angle between the tynes is approximately 90°. The width of the tynes is larger than that of prior art devices resulting in increased stiffness and the length of the tynes is sufficiently long to receive two wires therebetween.
    The contacts (10) are mounted in a housing which includes a plurality of teeth (90) provided with means for retaining lugs (32,34) on the end of the tynes to ensure bowed opening of the tynes on insertion of a wire. The contacts are arranged along the central axis (72) of the housing such that the folded tynes of alternate contacts extend on opposite sides of the central axis.

    Abstract translation: 绝缘位移触点（10）包括第一和第二接触部分，每个接触部分包括悬臂分离梁（19）。 接收绝缘电线的上部开口梁包括一对围绕分隔台面的槽（25）的轴线折叠的台面（20,22），使得台面之间的内角约为90°。 台面的宽度大于现有技术装置的宽度，导致刚度增加，并且台面的长度足够长以在其间接收两根线。 触头（10）安装在包括多个齿（90）的壳体中，所述齿设置有用于将突耳（32,34）保持在触头的端部上的装置，以确保在插入电线时弓形打开。 触点沿外壳的中心轴线（72）布置，使得交替触点的折叠式触点在中心轴线的相对侧上延伸。

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