公开(公告)号：EP1837119A1

公开(公告)日：2007-09-26

申请号：EP05814212.6

申请日：2005-12-06

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： TAKAOKA, Hidekiyo c/o Murata Manufact. Co., LTD., ,  NAKANO, Kosuke c/o Murata Manufacturing Co., LTD.

IPC: B23K35/22 ,  H05K3/34

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. In the first metal powder, a second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au, or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed. Accordingly, even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.

Abstract translation: 在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。 第一金属粉末包括用作贱金属的第一金属材料，例如Cu，Ag，Au或Pd。 在第一金属粉末中，在第一金属材料的表面上涂布熔点低于第一金属材料的Sn或In的第二金属材料。 第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。 第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。 因此，可以抑制热处理后残留的未反应成分的可能性。 因此，即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

公开(公告)号：EP1813654A1

公开(公告)日：2007-08-01

申请号：EP07001889.0

申请日：2007-01-29

Applicant: Yang, Yung-Shu

Inventor： Yang, Yung-Shu

IPC: C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H05K1/09

CPC classification number: H05K1/095 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H05K2201/0218

Abstract: The present invention provides a radiation curable conductive ink and a manufacturing method for conductive substrate using the conductive ink, wherein components of the radiation curable conductive ink contain at least conductive powder having a covering layer and a photosensitive binder. The radiation curable conductive ink is printed on surface of a substrate using a screen printing method, and a chemical crosslinking reaction is achieved by irradiating the conductive ink with ultraviolet ray, visible light or electron beam, thereby forming a conductive substrate. The conductive substrate is particularly applicable for use in laminate type electronic devices, including radio frequency identification (RFID) antenna, printed-circuit boards, smart cards (non-contact chip cards) components, smart labels, printed electronics, anti-electromagnetic interference (EMI) and anti-electrostatic materials.

Abstract translation: 本发明提供一种可辐射固化的导电油墨和使用该导电油墨的导电基材的制造方法，其中该可辐射固化的导电油墨的组分至少含有具有覆盖层和感光性粘合剂的导电粉末。 使用丝网印刷方法将可辐射固化导电油墨印刷在基板的表面上，并且通过用紫外线，可见光或电子束照射导电油墨从而形成导电基板来实现化学交联反应。 导电基板特别适用于层叠型电子设备，包括射频识别（RFID）天线，印刷电路板，智能卡（非接触式芯片卡）部件，智能标签，印刷电子部件，抗电磁干扰（ EMI）和抗静电材料。

公开(公告)号：EP1796106A1

公开(公告)日：2007-06-13

申请号：EP05776769.1

申请日：2005-09-01

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： ISHIDA, Hiroya

IPC: H01B5/00 ,  H01B5/16 ,  H01B13/00 ,  H01R11/01

CPC classification number: C23C18/1635 ,  C23C18/1651 ,  C23C18/1683 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: It is the object of the present invention to provide a conductive particle which has excellent adhesion between a base particle and a conductive layer, a conductive layer being resistant to breaking, impact resistance being improved, and an anisotropic conductive material using the conductive particle.
The prevent invention is a conductive particle, which comprises a base particle and a conductive layer formed on a surface of said base particle, said conductive layer having a non-crystal nickel plating layer in contact with the surface of said base particle and a crystal nickel plating layer, and a proportion of a nickel crystal grain aggregate oriented in a nickel (111) plane derived from an integrated intensity ratio in X-ray diffraction measurement being 80% or more.

Abstract translation: 本发明的目的是提供一种导电颗粒，其具有优异的基体颗粒和导电层之间的粘合性，耐断裂性，耐冲击性得到改善的导电层以及使用该导电颗粒的各向异性导电材料。 防止发明是导电性粒子，其包含基体粒子和形成在所述基础粒子的表面上的导电层，所述导电层具有与所述基础粒子的表面接触的非结晶镍镀层和结晶镍 并且在X射线衍射测定中，从镍（111）面取向的镍晶粒聚集体的积分强度比的比例为80％以上。

公开(公告)号：EP1051265A4

公开(公告)日：2004-04-07

申请号：EP99905459

申请日：1999-01-29

Applicant: HENKEL LOCTITE CORP

Inventor： MCARDLE CIARAN B ,  BARNES RORY B

IPC: B05D5/12 ,  B05D3/06 ,  B05D3/14 ,  B05D7/00 ,  B05D7/04 ,  C08F2/46 ,  C08F2/48 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F1/00 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/32

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

公开(公告)号：EP0605689B1

公开(公告)日：1996-05-15

申请号：EP93914917.5

申请日：1993-07-12

Applicant: CENTRAL RESEARCH LABORATORIES LIMITED

Inventor： NAYLOR, Malcolm

IPC: H01R4/04 ,  H01R23/72 ,  H01B1/22 ,  H01B1/24 ,  H01B1/20

CPC classification number: H05K3/323 ,  H01L2224/29499 ,  H01L2924/01079 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/0218 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0281 ,  H05K2201/0323

Abstract: A method of forming an anisotropic electrical connection between conductive elements (22, 24) having an oxide layer (28) is disclosed. The method comprises the use of an adhesive (30) including carbon fibres (32) and metallic particles (34). On the application of pressure, the carbon fibres (32) penetrate the oxide layer (28), whilst the metallic particles (34) deform such that a good electrical connection is made between overlying elements (22, 24).

公开(公告)号：EP3067151A4

公开(公告)日：2017-07-19

申请号：EP14860167

申请日：2014-11-04

Applicant: SENJU METAL INDUSTRY CO

Inventor： HATTORI TAKAHIRO ,  SOMA DAISUKE ,  ROPPONGI TAKAHIRO ,  SATO ISAMU

IPC: B23K35/14 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/22 ,  B23K35/26 ,  B23K35/30 ,  C22C1/04 ,  C22C9/00 ,  C22C13/00 ,  C22F1/00 ,  C22F1/08 ,  C25D3/60 ,  C25D7/00 ,  H01L21/60 ,  H01L23/00 ,  H01L23/556 ,  H05K3/34

CPC classification number: B23K35/302 ,  B22F1/00 ,  B22F1/0048 ,  B22F1/025 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  C22C1/0483 ,  C22C9/00 ,  C22C13/00 ,  C25D3/60 ,  C25D7/00 ,  H01L23/556 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11825 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/13411 ,  H01L2224/13455 ,  H01L2224/13457 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2224/81048 ,  H01L2224/81075 ,  H01L2224/81211 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3463 ,  H05K2201/0218 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01026 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01048 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01044 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01092 ,  H01L2924/0109 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/00012 ,  H01L2924/013

Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1 % through not more than 3.0 % of Cu and the remainder is composed of Sn and impurities.

Abstract translation: 本发明提供了一种可降低热循环强度和强度的铜芯球和铜芯柱。 Cu芯球（1）包含由Cu或Cu合金制成的Cu球（2）和由Sn和Cu组成的焊料合金制成并覆盖Cu球（2）的焊料层（3）。 焊料层（3）含有0.1％以上且不超过3.0％的Cu，其余由Sn和杂质构成。

公开(公告)号：EP2484795A3

公开(公告)日：2017-06-21

申请号：EP12163295.4

申请日：2007-11-02

Applicant: Sulzer Metco (US) Inc.

Inventor： Schmid, Richard K. Dr. ,  Doesburg, Jason C.

IPC: C23C4/12 ,  C23C24/04 ,  B23K35/26 ,  B22F3/115 ,  B22F1/02 ,  H05K3/34 ,  B23K35/30 ,  B23K35/38 ,  B23K35/36 ,  B23K35/02

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

Abstract translation: 本发明提供了粉末混合物或复合粉末也被送入动态喷涂设备，以比现有的更好的焊料形成的热和电性能的复合焊料加速朝向基板或一部分。 建立这样一个焊料层的其它优点包括低氧化物含量以提高后续soldcrability，沉积厚度的良好的控制，沉积化学，最后，制造的高速的良好的控制。

公开(公告)号：EP2785158B1

公开(公告)日：2016-09-28

申请号：EP12851695.2

申请日：2012-11-26

Applicant: Showa Denko K.K.

Inventor： UCHIDA, Hiroshi

IPC: H05K3/12 ,  B05D3/02 ,  B05D5/12 ,  B05D7/24 ,  C09D11/00 ,  H01B1/00 ,  H01B1/20 ,  H01B13/00

CPC classification number: H01B13/003 ,  C09D11/037 ,  C09D11/52 ,  C09D17/00 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0257

公开(公告)号：EP2906027B1

公开(公告)日：2016-06-22

申请号：EP15159012.2

申请日：2009-08-20

Applicant: Lockheed Martin Corporation

Inventor： Zinn, Alfred, A.

IPC: H05K3/34 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  B82Y30/00 ,  C23C24/08

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

公开(公告)号：EP2841881A4

公开(公告)日：2016-01-06

申请号：EP13781538

申请日：2013-04-26

Applicant: UNIV NORTHEASTERN

Inventor： RANKY RICHARD ,  CARVER ALEXANDRA ,  MAVROIDIS CONSTANTINOS ,  LANDERS DANIEL ,  SIVAK MARK L

IPC: G01D11/00 ,  B29C67/00 ,  B29C70/88 ,  B29K83/00 ,  B29K505/08 ,  B29K507/04 ,  B29L31/34 ,  H01C10/10

CPC classification number: B29C67/0055 ,  B29C64/00 ,  B29C64/106 ,  B29C70/88 ,  B29K2083/00 ,  B29K2505/08 ,  B29K2995/0003 ,  B29K2995/0005 ,  B29L2031/34 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01C10/10 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/0091 ,  H05K3/1258 ,  H05K2201/0218 ,  H05K2201/0314 ,  H05K2201/0323 ,  H05K2201/0376 ,  H05K2201/10151 ,  H05K2203/0759