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    METAL PATTERN AND PROCESS FOR PRODUCING THE SAME
    32.
    发明公开
    METAL PATTERN AND PROCESS FOR PRODUCING THE SAME 有权
    METALLSTRUKTUR UND PROZESS ZU IHRER HERSTELLUNG

    公开(公告)号：EP1667503A4

    公开(公告)日：2009-03-18

    申请号：EP05703506

    申请日：2005-01-13

    Applicant: PANASONIC CORP

    Inventor： NAKAGAWA TOHRU

    IPC: H05K3/06 ,  C23F1/02 ,  C23F1/16 ,  C23F1/18 ,  C23F1/30 ,  C25D5/02 ,  H01L21/033 ,  H01L21/3213 ,  H01L51/00

    CPC classification number: C25D5/022 ,  C23F1/02 ,  C23F1/14 ,  C23F1/18 ,  C23F1/30 ,  C23F1/40 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/32139 ,  H01L51/0019 ,  H01L51/0022 ,  H05K3/061 ,  H05K2201/015 ,  H05K2201/0239 ,  H05K2203/013 ,  H05K2203/0582 ,  H05K2203/0585 ,  H05K2203/122

    Abstract: Metal pattern (13’) obtained through formation on a substrate surface and etching, which metal pattern (13’) has masking film (18) formed through adsorption of a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n-: n is a natural number) on a metal film surface and penetrating of a molecule having mercapto (-SH) or disulfido (-SS-) into interstices between molecules constituting the monomolecular film. This metal pattern is produced by forming a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n-: n is a natural number) on a metal film surface; coating the surface of the monomolecular film with a solution in which a molecule having mercapto (-SH) or disulfido (-SS-) is dissolved so that the molecule having mercapto (-SH) or disulfido (-SS-) penetrates into interstices between molecules constituting the monomolecular film to thereby form a masking film; and exposing the metal film surface to an etching solution to thereby waste metal region devoid of the masking film.

    Abstract translation: 本发明的金属图案是通过蚀刻形成在基板的表面上的金属图案（13'）和含有氟化烷基链（CF 3（CF 2）n - ）的单分子膜，其中n表示自然数） 形成在构成金属图案（13'）的金属膜的表面上，并且通过将具有巯基（-SH）或二硫化物（-SS-）基团的分子穿透而形成掩蔽膜（18） 构成单分子膜的分子之间的间隙。 通过在金属膜的表面上形成含有氟化烷基链（CF 3（CF 2）n - ，其中n表示自然数）的单分子膜; 通过将分子中具有巯基（-SH）或二硫键（-SS-））的分子溶解在单分子膜的表面上形成掩蔽膜，使得具有巯基（-SH） 或二硫化物（-SS-）基团渗透在构成单分子膜的分子之间的间隙中; 并且通过将金属膜的表面暴露于蚀刻溶液来蚀刻金属膜，从而去除未被掩模膜覆盖的区域中的金属膜的一部分。

    INKJET INK COMPOSITION
    36.
    发明公开
    INKJET INK COMPOSITION 有权
    喷墨墨水组合物

    公开(公告)号：EP1681321A1

    公开(公告)日：2006-07-19

    申请号：EP04792849.4

    申请日：2004-10-22

    Applicant: Nikko Materials Co., Ltd.

    Inventor： KAWAMURA, Toshifumi, c/o Isohara Plant ,  IMORI, Toru, c/o Isohara Plant

    IPC: C09D11/00 ,  H05K1/09 ,  H05K3/10 ,  H05K3/18

    CPC classification number: C09D11/38 ,  H05K1/097 ,  H05K3/125 ,  H05K3/182 ,  H05K2201/0239 ,  H05K2203/013 ,  H05K2203/124

    Abstract: An object is to provide an inkjet ink composition to uniformly form a wiring pattern having excellent adhesion on a substrate, and to provide a method to form a wiring pattern by using this ink composition. This ink composition is an inkjet ink composition for drawing a wiring pattern on a substrate, the ink composition comprising an azole-based silane coupling agent as coupling agent for an activator.

    Abstract translation: 本发明的目的是提供一种喷墨油墨组合物，以均匀地形成在基板上具有优异粘合性的布线图案，并提供一种使用该油墨组合物形成布线图案的方法。 该油墨组合物是用于在基材上形成布线图案的喷墨油墨组合物，该油墨组合物含有作为活化剂的偶联剂的唑类硅烷偶联剂。

    Resin compatible yarn binder and uses thereof
    38.
    发明公开
    Resin compatible yarn binder and uses thereof 审中-公开
    树脂相容Garnbindemittel及其用途

    公开(公告)号：EP1457466A3

    公开(公告)日：2005-05-11

    申请号：EP04005598.0

    申请日：2004-03-09

    Applicant: PPG Industries Ohio, Inc.

    Inventor： Lawton, Ernest L. ,  Rau, Robert B.

    IPC: C03C25/26 ,  C03C25/24 ,  C03C25/10

    CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/47 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2962 ,  Y10T428/2964

    Abstract: A fiber strand comprising at least one fiber at least partially coated with a composition formed from at least one rosin, at least one cationic lubricant, at least one film forming material, at least one organosilane coupling agent, and at least one dispersion of polymeric particles. A fiber strand comprising at least one fiber at least partially coated with a composition formed from components comprising at least one rosin, at least one polymeric lubricant, at least one film forming material, at least one organosilane coupling agent, and at least one dispersion of polymeric particles. A fiber strand comprising at least one fiber at least partially coated with a starch-free composition comprising at least one rosin, at least one cationic lubricant, at least one film forming material, and at least one organosilane coupling agent. A fiber strand comprising at least one fiber at least partially coated with a starch-free composition comprising at least one rosin, at least one polymeric lubricant, at least one film forming material, and at least one organosilane coupling agent. A fiber strand comprising at least one fiber at least partially coated with a composition comprising at least one rosin, at least one silyated polyamine, at least one film forming material, and at least one organosilane coupling agent. Also provided are fabrics and composite materials comprising at least one of these fiber strands.

    Epoxy resin composition, prepreg and multilayer printed-wiring board
    40.
    发明公开
    Epoxy resin composition, prepreg and multilayer printed-wiring board 有权
    Epoxyharzzusammensetzung，Prepreg und mehrschichtige Plattefürgedruckte Schaltungen

    公开(公告)号：EP1103575A1

    公开(公告)日：2001-05-30

    申请号：EP00250395.1

    申请日：2000-11-22

    Applicant: Matsushita Electric Works, Ltd.

    Inventor： Nakamura, Yoshihiko ,  Asano, Takuya ,  Ogasawara, Kenji ,  Ito, Naoki

    IPC: C08K5/5313 ,  C08G59/14 ,  H05K1/03

    CPC classification number: H05K1/0373 ,  C08G59/245 ,  C08G59/4071 ,  C08G59/621 ,  C08K5/5313 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  C08L63/00

    Abstract: An epoxy resin composition is disclosed, which comprises, as an essential component, a phosphorus compound having an average of not less than 1.8 and less than 3 of phenolic hydroxy groups reactive with an epoxy resin and an average of not less than 0.8 of a phosphorus element in the molecule, an inorganic filler having an average particle diameter of not greater than 30 µm, a bifunctional epoxy resin having an average of not less than 1.8 and less than 2.6 of epoxy groups in the molecule and a hardener, wherein the bifunctional epoxy resin is contained at an amount of not less than 51 % by mass relative to the whole epoxy resin. Dicyandiamide or a polyfunctional phenol system compound having an average of not less than 3 of phenolic hydroxy groups in the molecule are used as the hardener and a ration (a/c) of equivalent (a) of a phenolic hydroxy group of the phosphorus compound and equivalent (c) of an epoxy group of the bifunctional epoxy resin is not less than 0.3 and less than 0.75. Further, a combination of dicyandiamide and a polyfunctional phenol system compound having an average of not less than 3 of phenolic hydroxy groups in the molecule can be used as the hardener, wherein aluminium hydroxide is used as the inorganic filler, an amount of the inorganic filler to be added is not less than 15 parts by mass and less than 100 parts by mass relative to 100 parts by mass of the resin solids constituent, and the content of a phosphorus element is not less than 0.8 % by mass and less than 3.5 % by mass relative to the whole resin solids constituent.

    Abstract translation: 公开了一种环氧树脂组合物，其包含与环氧树脂反应的酚羟基的平均不小于1.8且小于3的磷化合物作为必需成分，平均不低于0.8的磷 分子内的元素，平均粒径为30μm以下的无机填料，分子中平均不低于1.8且小于2.6的环氧基的双官能环氧树脂和硬化剂，其中双官能 相对于整个环氧树脂，环氧树脂的含量不低于51质量％。 使用分子中平均不少于3个酚羟基的双氰胺或多官能苯酚系化合物作为固化剂和磷化合物的酚羟基当量（a）的比（a / c）和 双官能环氧树脂的环氧基的当量（c）不小于0.3且小于0.75。 此外，可以使用双氰胺和分子中平均不少于3个酚羟基的多官能苯酚系化合物的组合作为固化剂，其中使用氢氧化铝作为无机填料，使用无机填料的量 相对于100质量份的树脂固体成分为15质量份以上且小于100质量份，磷成分的含量为0.8质量％以上且小于3.5质量％ ，相对于整个树脂固体组分。

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