公开(公告)号：EP0910236A2

公开(公告)日：1999-04-21

申请号：EP98307896.5

申请日：1998-09-29

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Yamamoto, Masaki ,  Ogamoto, Kazutoshi

IPC: H05K9/00

CPC classification number: H05K3/3405 ,  H05K3/3447 ,  H05K9/0039 ,  H05K2201/09145 ,  H05K2201/2018

Abstract: In a conventional electronic apparatus an engagement member (21b) and a support member (21d) are provided on a frame member. This involves a bothersome machining and leads to poor productivity and high cost. Disclosed is an electronic apparatus which includes a frame member (1), in which a protruding support portion (1c) is formed by forming a notched portion (1b) from the upper end of a side plate (1a), whereby it is possible to provide an inexpensive electronic apparatus in which the construction of the frame member (1) is simpler and which provides satisfactory productivity.

Abstract translation: 在传统的电子设备中，接合构件（21b）和支撑构件（21d）设置在框架构件上。 这涉及到麻烦的加工，并导致生产率低和成本高。 公开了一种电子设备，其包括框架构件（1），其中通过从侧板（1a）的上端形成切口部分（1b）形成突出支撑部分（1c），由此可以 提供了一种便宜的电子设备，其中框架构件（1）的构造更简单并且提供令人满意的生产率。

公开(公告)号：EP0862212A2

公开(公告)日：1998-09-02

申请号：EP97308112.8

申请日：1997-10-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tanaka, Shinichi

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L24/50 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0271 ,  H05K1/117 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2203/0195 ,  H01L2924/00

Abstract: To offer a tape carrier package in which many pins and fine pitches can be simultaneously attained through a simplified positioning during the connection to external devices.
Leads 4 and 5 are formed from an over coat area 3, which is formed at the central area of a base film 2, which is made of a resin, such as polymide, for example. Furthermore, outer leads 4a at the input side and outer leads 5a at the output side are respectively formed in a manner so that they extend towards both edge areas of the base film 2. A notched section 6 is formed between the outer leads 5a at the output side of the base film 2, and through this, each of the regions 2a and 2b expands independently during a thermocompression bonding. The notched section 6 is provided almost at the central area of the base film 2 in the longitudinal direction, and outer leads 5 at the output side in the same number (256 for example) are formed at both of its sides in a pitch of approximately 70µm.

Abstract translation: 提供一种载带封装，其中可以通过在与外部设备的连接期间的简化定位同时获得许多引脚和细间距。 引线4和5由形成在例如聚酰亚胺等树脂制的基膜2的中心区域的外涂层区域3形成。 此外，输入侧的外部引线4a和输出侧的外部引线5a分别以使其朝向基底膜2的两个边缘区域延伸的方式分别形成。在外部引线5a处形成有切口部分6 基底膜2的输出侧，并且通过这一点，在热压接期间，各区域2a和2b独立地膨胀。 切口部6几乎位于基膜2的长度方向的中央区域，并且相同数量的输出侧的外引线5（例如256）以大致的间距形成在两侧 70亩。

公开(公告)号：EP0632681B1

公开(公告)日：1997-07-16

申请号：EP94107880.0

申请日：1994-05-21

Applicant: Schulz-Harder, Jürgen, Dr.-Ing.

Inventor： Schulz-Harder, Jürgen, Dr.-Ing.

IPC: H05K1/02

CPC classification number: H01L23/13 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/053 ,  H05K2201/09145 ,  H05K2201/09745 ,  H05K2201/098 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/256 ,  Y10T428/265 ,  Y10T428/29 ,  Y10T428/2933 ,  Y10T428/2956 ,  Y10T428/2958 ,  Y10T428/2991 ,  Y10T428/31678 ,  H01L2924/00

公开(公告)号：EP2259382B1

公开(公告)日：2018-07-18

申请号：EP10174522.2

申请日：2006-11-27

Applicant: Nintendo Co., Ltd.

Inventor： Sakiyama, Tomoyuki ,  Kuwahara, Masato ,  Nakai, Hitoshi

IPC: H01R12/70 ,  H05K1/11 ,  H01R12/72

CPC classification number: H05K1/117 ,  H01R12/7052 ,  H01R12/7076 ,  H01R12/721 ,  H05K2201/09145

Abstract: A first recessed portion shaped so as to be open toward an outer periphery of a substrate is disposed on the substrate, and a conductive pattern is provided on an edge portion of the first recessed portion. A connector mounted on the substrate includes a body and terminals which are surface-mounted on the substrate and protrude from the body. The connector is mounted on the substrate such that a bottom of the terminals is positioned higher than a bottom of the body by a predetermined height. The connector is mounted on the substrate such that the body is disposed in the first recessed portion and the terminals contact the conductive pattern on the substrate.

公开(公告)号：EP3065817B1

公开(公告)日：2018-01-10

申请号：EP14802539

申请日：2014-10-29

Applicant: BOSTON SCIENT NEUROMODULATION CORPORATION

Inventor： MOAZEN DAMON ,  LAMONT ROBERT G ,  TONG ROBERT R ,  BUNYAN NAVIN N

IPC: A61N1/36

CPC classification number: A61N1/3758 ,  A61N1/36125 ,  A61N1/37229 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/30 ,  H05K2201/09145 ,  H05K2203/162 ,  Y10T29/49004

Abstract: Designs and methods of construction for a printed circuit board (PCB) in an implantable pulse generator (IPG) are disclosed which facilitate IPG PCB testing while also providing for protection of IPG circuitry in a simple and cost effective manner. The IPG PCB is formed as part of a larger test PCB, which includes an extender portion with traces routing nodes of interest in the IPG PCB to an edge connector. IPG electronics are mounted or soldered to the IPG PCB, and then such electronics are tested via the edge connector. The IPG PCB is then singulated from the extender portion in a manner leaving one or more PCB tabs at the severed edge of the PCB. The PCB tab(s) extend from the severed edge, and create an offset distance preventing traces severed and now exposed at the severed edge from contacting and potentially shorting to conductive structures in the IPG.

公开(公告)号：EP3217428A1

公开(公告)日：2017-09-13

申请号：EP16158942.9

申请日：2016-03-07

Applicant: Infineon Technologies AG

Inventor： Roth, Alexander

IPC: H01L23/544 ,  H01L23/12 ,  H01L23/373 ,  H05K1/02

CPC classification number: H05K1/0306 ,  H01L23/12 ,  H01L23/544 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H05K1/0269 ,  H05K1/0284 ,  H05K3/06 ,  H05K3/4644 ,  H05K2201/09145 ,  H05K2201/0929 ,  H05K2201/09936 ,  H05K2203/107

Abstract: Die Erfindung betrifft ein Substrat mit einer Keramikplatte oder Keramikschicht (21) und wenigstens einer an wenigstens einer Oberflächenseite der Keramikschicht (21) flächig befestigten Metallschicht (22), die an wenigstens einem Randbereich (23, 24, 25, 26) wenigstens eine Versenkung (27, 28, 29, 30) aufweist. Hierbei kodiert die wenigstens eine Versenkung (27, 28, 29, 30) im Randbereich (23, 24, 25, 26) eine Information.
Des Weiteren betrifft die Erfindung ein mehrere dieser Substrate umfassendes Mehrfachsubstrat sowie ein Verfahren zu dessen Herstellung.

Abstract translation: 本发明涉及一种具有陶瓷板或陶瓷层（21）和所述陶瓷层中的至少一个的至少一个表面侧的基板（21）表面安装金属层（22）上的至少一个边缘区域（23，24，25，26）的至少一个埋头孔（ 27，28，29，30）。 在此，边缘区域（23,24,25,26）中的至少一个埋头孔（27,28,29,30）编码信息。 此外，本发明涉及包含几种这些基材的多重基材，并涉及其制备方法。

公开(公告)号：EP3171679A1

公开(公告)日：2017-05-24

申请号：EP16200039.2

申请日：2016-11-22

Applicant: Thomson Licensing

Inventor： HUNT, Mickey ,  DERNIER, William

IPC: H05K1/02 ,  H05K5/02 ,  H05K3/32

CPC classification number: H05K5/03 ,  H01Q1/2258 ,  H01Q1/38 ,  H01Q13/10 ,  H05K1/02 ,  H05K1/0203 ,  H05K1/117 ,  H05K1/18 ,  H05K3/32 ,  H05K5/02 ,  H05K7/1417 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A wire retention cover (700) for an antenna mounting arrangement within an electronic device is configured to be positioned over an edge of a printed circuit board (501) and protect the antenna wires (604) and connectors (606) on the connector side thereof. A non-connector side portion or leg (701) of the cover includes one or more slots (702) for receiving antenna wires. A connector side portion or leg (704) of the cover includes raised (708) and lowered (706) portions. The raised portions (708) are configured to cover and protect antenna wire connections to the PCB.

Abstract translation: 用于电子设备内的天线安装布置的电线保持盖（700）被配置为定位在印刷电路板（501）的边缘上并且保护其连接器侧上的天线电线（604）和连接器（606） 。 盖的非连接器侧部分或支腿（701）包括用于接收天线导线的一个或多个槽（702）。 盖的连接器侧部或支腿（704）包括凸起（708）和下降（706）部分。 凸起部分（708）被配置为覆盖并保护到PCB的天线导线连接。

公开(公告)号：EP3062590A4

公开(公告)日：2017-05-24

申请号：EP14855585

申请日：2014-10-23

Applicant: KYOCERA CORP

Inventor： MURAKAMI KENSAKU

IPC: H05K1/11 ,  H01L23/13

CPC classification number: H01L23/49811 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L24/05 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/181 ,  H05K3/403 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/0969 ,  H01L2924/00012

Abstract: This wiring board (1) is provided with: an insulating base (11) that has a lateral surface having an incision part (12); an electrode (13) that is provided on the inner surface of the incision part (12); and a wiring conductor (15) that is provided within the insulating base (11) or on the surface of the insulating base (11) and is electrically connected to the electrode (13) via a connection conductor (14). The width of the incision part (12) is larger than the depth thereof, and the connection conductor (14) is connected to the electrode (13) at an end of the incision part (12) in the width direction. An electronic device according to the present invention is provided with this wiring board (1) and an electronic component (2) that is mounted to the upper surface of this wiring board (1).

Abstract translation: 该布线基板1具有：绝缘性基体11，其具有具有切口部12的侧面; 设置在所述切口部（12）的内表面上的电极（13）; 以及设置在绝缘基体（11）内或绝缘基体（11）的表面上并经由连接导体（14）与电极（13）电连接的布线导体（15）。 切口部12的宽度大于其深度，连接导体14在切口部12的宽度方向的一端与电极13连接。 本发明的电子设备具备该布线基板（1）和安装于该布线基板（1）的上表面的电子部件（2）。

公开(公告)号：EP3073565A4

公开(公告)日：2016-12-14

申请号：EP14795505

申请日：2014-05-15

Applicant: ZTE CORP

Inventor： ZHOU CHUANGZHU

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H05K1/02

CPC classification number: H01Q1/2275 ,  H01Q1/245 ,  H01Q1/48 ,  H05K1/0203 ,  H05K1/0243 ,  H05K2201/09145

公开(公告)号：EP3099148A1

公开(公告)日：2016-11-30

申请号：EP15305796.3

申请日：2015-05-27

Applicant: Hager Controls SAS

Inventor： PEYRAS, Thierry

IPC: H05K3/46 ,  H05K1/02 ,  H05K7/14 ,  H05K5/02 ,  H02B1/48 ,  H02G3/08 ,  H05K1/18

CPC classification number: H05K3/4691 ,  H02G3/081 ,  H02G3/14 ,  H05K1/02 ,  H05K1/189 ,  H05K5/0247 ,  H05K7/1427 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/0999 ,  H05K2201/10053

Abstract: La présente invention a pour objet un circuit imprimé (10) pour un appareil électrique (100) d'une installation électrique domestique, ledit appareil électrique (100) comprenant un boîtier (110) comportant une saillie (112) et une zone de raccordement, ledit circuit imprimé (10) comprenant une première face, un tronçon principal (20) et un tronçon de raccordement (30), ledit tronçon principal comprenant un bouton poussoir (22) agencé sur la première face, ledit tronçon de raccordement formant une articulation (32) adaptée pour être raccordée à la zone de raccordement du boîtier (110) de sorte à permettre le pivotement du tronçon principal autour de l'articulation pour amener le bouton poussoir en appui de fonctionnement contre la saillie (112) du boîtier (110).
La présente invention a également pour objet un appareil électrique (100) comprenant un tel circuit imprimé (10) et un procédé de montage d'un tel appareil électrique (100).