Abstract:
A method of making a plurality of monolithic thick film components (10) having multiple terminals (12, 14, 16, 18) comprising the steps of printing a plurality of components (10) in a wafer form forming a matrix of components, printing holes (20) in the matrix of components where two terminal ends meet thereby separating the terminals (12, 14, 16, 18) on each component, and dipping the terminal ends in a silver based thick film ink (26).
Abstract:
The object of the invention is to prevent the flow of molten solder to the adjacent input electrodes and to prevent short-circuiting between electrodes as well as wire breakage from happening by performing a process for avoiding the concentration of shearing stress applied to the input electrodes. The lengths of the slit 26 for the input electrodes 28 are made uneven. The input electrodes 28 and the board electrodes 30 are laid over one another. When they are heated, the solder 32 is melted, thereby securing the electrodes 28 and 30. The molten solder 32 flows between the base 22 and the board 18A by capillary action. This flow of solder to the adjacent input electrodes 28 is prevented by forming the convex sections 26A at the lengths of the slit 26 so as to make it uneven to make the base 22 connecting the adjacent input electrodes 28 non-linear. Moreover, in cases of relative motion of the liquid crystal cells 16 and the boards 18A and B, independent deformation becomes possible at the joint section between the convex sections 26A and separate input electrodes 28, thereby avoiding the concentration of shearing stress and increasing the strength.
Abstract:
The invention relates to an arrangement for connecting a hybrid circuit to a mother board, the hybrid circuit comprising a printed circuit board (1) of an insulating material, with foils on both sides, components fixed to the printed circuit board, and printed circuit board legs (2) by means of which the hybrid printed circuit board is connected to the mother board. The purpose is to achieve a connection which is maximally easy to manufacture and at the same time electrically and mechanically reliable. To achieve this, the legs of the printed circuit board consist of projections (2) in the board (1) itself, and the mother board has apertures corresponding to the legs, the apertures not being copper-plated throughout, in which case the earth foils and conductor foils in the projections (2) are connected to the foils of the mother board at the edges of the apertures. The apertures in the mother board are preferably oval, corresponding in width to the thickness of the legs (2).
Abstract:
Die Erfindung betrifft ein Verbindungselement (1) für eine elektronische Bauelementanordnung, aufweisend einen Träger (2), ein erstes Kontaktpad (3) und ein zweites Kontaktpad (4), eine das erste Kontaktpad (3) und das zweite Kontaktpad (4) elektrisch leitend miteinander verbindende elektrisch leitfähige Struktur (5) und einen ersten Kontaktleiter (6), der mittels einer Lotschicht (11) mit dem ersten Kontaktpad (3) elektrisch leitend verbunden ist und der in einem zweiten Abschnitt der ersten Oberfläche (61) und/oder auf der zweiten Oberfläche (62) zum Ausbilden einer Schweißverbindung ausgestaltet ist. Die Erfindung betrifft ferner eine elektronische Bauelementanordnung mit einem solchen Verbindungselement und mit zumindest einem an den Kontaktleiter geschweißten Bauelement und die Verfahren zum Herstellen des Verbindungselements und der Bauelementanordnung.
Abstract:
A communication jack has a housing with a face having a plug receiving aperture. A plurality of conductive path pairs extends from corresponding plug interface contacts located at the plug receiving aperture to corresponding output terminals. A first circuit board is connected to the plug interface contacts and a second circuit board is connected to the plug interface contacts and the output terminals. The first circuit board has a first single stage of crosstalk compensation with opposite polarity of the crosstalk of a plug for a first combination of the conductive path pairs. The second circuit board includes a second single stage of opposite polarity crosstalk compensation for some of the conductive path pairs not compensated on the first circuit board. The stages cancel substantially all of the crosstalk caused by the plug, for the signal operating frequencies, for corresponding combinations of the conductive path pairs.