公开(公告)号：EP0568364A3

公开(公告)日：1995-04-19

申请号：EP93303353.2

申请日：1993-04-28

申请人： NEC CORPORATION

发明人： Miyazaki, Akito, c/o NEC Corporation

IPC分类号： H05K3/12 ,  H05K1/02

CPC分类号： H05K1/0269 ,  H05K3/306 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/094 ,  H05K2201/09936 ,  H05K2201/10689 ,  H05K2203/0588 ,  H05K2203/168

摘要： In a plated printed circuit, a substrate (20) is provided with land patterns (1-14, 101,102) and signal patterns thereon. A solder resist layer is formed on the signal patterns. A symbol pattern (30) indicative of the contour of a part to be mounted is provided on the solder resist layer by silk screen printing. A reference terminal indication line (40) extends out from the symbol pattern toward the land pattern (1) which is to receive a reference terminal provided on the part.

公开(公告)号：EP0568364A2

公开(公告)日：1993-11-03

申请号：EP93303353.2

申请日：1993-04-28

申请人： NEC CORPORATION

发明人： Miyazaki, Akito, c/o NEC Corporation

IPC分类号： H05K3/12 ,  H05K1/02

CPC分类号： H05K1/0269 ,  H05K3/306 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/094 ,  H05K2201/09936 ,  H05K2201/10689 ,  H05K2203/0588 ,  H05K2203/168

摘要： In a plated printed circuit, a substrate (20) is provided with land patterns (1-14, 101,102) and signal patterns thereon. A solder resist layer is formed on the signal patterns. A symbol pattern (30) indicative of the contour of a part to be mounted is provided on the solder resist layer by silk screen printing. A reference terminal indication line (40) extends out from the symbol pattern toward the land pattern (1) which is to receive a reference terminal provided on the part.

摘要翻译： 在电镀印刷电路中，衬底（20）上设置有焊盘图案（1-14,101,102）和信号图案。 在信号图案上形成阻焊层。 通过丝网印刷在阻焊层上设置表示要安装的部件的轮廓的符号图案（30）。 参考端子指示线（40）从符号图案朝向接收设置在该部件上的参考端子的焊盘图案（1）延伸出来。

公开(公告)号：EP0349161B1

公开(公告)日：1993-01-13

申请号：EP89306060.8

申请日：1989-06-15

申请人： AT&T Corp.

发明人： Blumenstock, Brent J. ,  Ors, Jose Alberto

IPC分类号： H05K3/10

CPC分类号： H05K3/428 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/108 ,  H05K3/28 ,  H05K3/465 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09881 ,  H05K2203/0582 ,  H05K2203/0588 ,  H05K2203/072 ,  H05K2203/1394

公开(公告)号：EP0238929A2

公开(公告)日：1987-09-30

申请号：EP87103376.7

申请日：1987-03-10

申请人： International Business Machines Corporation

发明人： Donson, William Arthur ,  Ellerson, James Vernon ,  Hammer, Richard Benjamin ,  Lafer, William ,  Snyder, Keith Alan

IPC分类号： H01L21/48

CPC分类号： H05K3/0079 ,  H05K1/0284 ,  H05K3/064 ,  H05K3/1216 ,  H05K3/388 ,  H05K2201/09018 ,  H05K2203/0588 ,  H05K2203/0723 ,  H05K2203/0759

摘要： A process for providing circuit lines on a substrate having a non-planar surface is provided. The process includes applying a layer of photoresist material in a liquid form to the substrate, selectively screen printing on non-planar areas of the substrate a screen-printable coating, photoprocessing the layer of photo­resist material, and providing electrical conductive pattern on the substrate.

公开(公告)号：EP1952935B1

公开(公告)日：2016-05-11

申请号：EP07101602.6

申请日：2007-02-01

申请人： HARIMA CHEMICALS, INC.

发明人： Sakurai, Hitoshi ,  Kukimoto, Yoichi

IPC分类号： B23K35/26 ,  B23K35/02 ,  H01L23/00 ,  H05K3/34

CPC分类号： B23K35/262 ,  B23K35/0244 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/11332 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13499 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0588 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder paste composition 5 used in a solder precoating method of forming solder bumps by forming a dam 4 around electrodes 2 on a substrate 1, introducing a solder paste composition on the electrodes within openings surrounded by the dam, and heating the solder paste composition introduced, so that solder adheres to the surfaces of the electrodes. The solder paste composition contains solder powder which is of a particle size distribution in which particles having a particle size of below 10 µm are present 16% or more, and the sum of the particles having a particle size of below 10 µm and particles having a particle size of 10 µm or more and below 20 µm is 90% or more. This leads to suppression of the occurrence of bump defects, and to formation of solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

公开(公告)号：EP2373135A1

公开(公告)日：2011-10-05

申请号：EP11158025.4

申请日：2011-03-14

申请人： FUJITSU LIMITED

发明人： Nakamura, Naoki ,  Taketomi, Nobuo ,  Hatanaka, Kiyoyuki ,  Iriguchi, Shigeo

IPC分类号： H05K3/22 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K3/3452 ,  H05K3/225 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2203/0574 ,  H05K2203/0588 ,  H05K2203/176 ,  Y02P70/613 ,  Y10T29/49144

摘要： A printed circuit board includes a printed circuit board body and a resin layer. The printed circuit board body includes a plurality of mounting pads. The resin layer, containing a thermoplastic resin, is formed on the surface of the printed circuit board body. The resin layer includes a plurality of holes disposed to be aligned with the positions of the mounting pads on a one-to-one basis for exposing the mounting pads therethrough. In a method of fabricating the printed circuit board, the resin layer is formed atop the printed circuit board body.

摘要翻译： 印刷电路板包括印刷电路板主体和树脂层。 印刷电路板主体包括多个安装垫。 含有热塑性树脂的树脂层形成在印刷电路板主体的表面上。 树脂层包括多个孔，其设置成与安装焊盘的位置一一对准地布置，用于使安装焊盘从中穿过。 在制造印刷电路板的方法中，树脂层形成在印刷电路板主体的顶部。

公开(公告)号：EP1952935A1

公开(公告)日：2008-08-06

申请号：EP07101602.6

申请日：2007-02-01

申请人： HARIMA CHEMICALS, INC.

发明人： Sakurai, Hitoshi ,  Kukimoto, Yoichi

IPC分类号： B23K35/26 ,  B23K35/02 ,  H01L21/60

CPC分类号： B23K35/262 ,  B23K35/0244 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/11332 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13499 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0588 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder paste composition 5 used in a solder precoating method of forming solder bumps by forming a dam 4 around electrodes 2 on a substrate 1, introducing a solder paste composition on the electrodes within openings surrounded by the dam, and heating the solder paste composition introduced, so that solder adheres to the surfaces of the electrodes. The solder paste composition contains solder powder which is of a particle size distribution in which particles having a particle size of below 10 µm are present 16% or more, and the sum of the particles having a particle size of below 10 µm and particles having a particle size of 10 µm or more and below 20 µm is 90% or more. This leads to suppression of the occurrence of bump defects, and to formation of solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

摘要翻译： 通过在基板1上的电极2的周围形成堤坝4，在堤坝包围的开口内的电极上导入焊膏组合物，并将导入的焊膏组合物加热，从而形成焊料凸块的焊料预涂法 ，使得焊料粘附到电极的表面。 该焊膏组合物含有具有粒径分布的焊料粉末，其中粒径小于10μm的粒子存在16％或更多，并且粒径小于10μm的粒子的总和和具有 10μm以上且20μm以下的粒径为90％以上。 这导致抑制了凸块缺陷的发生，并且通过使用该堰的焊料预涂方法以高产率形成了具有均匀高度的焊料凸块。

公开(公告)号：EP0776150B1

公开(公告)日：2006-06-07

申请号：EP96916328.6

申请日：1996-06-06

申请人： IBIDEN CO, LTD.

发明人： ASAI, Motoo, Ibiden Co., Ltd. ,  KAWADE, Masato, Ibiden Co., Ltd. ,  HIRATUKA, Shinji, Ibiden Co., Ltd.

IPC分类号： H05K3/28

CPC分类号： H05K3/3457 ,  H05K1/112 ,  H05K3/184 ,  H05K3/3452 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2203/0588

摘要： A printed wiring board suitable for reliable connections and reliable high-density mounting of components by using solder bumps. The printed wiring board has a mounting surface on which are formed pads coated with solder resist and having solder bumps. The position of the solder bump is coincident with the position of a via-hole, or the size of an opening disposed in the solder resist is made greater than a land diameter of the via-hole so that the solder resist does not overlap with the via-hole.

公开(公告)号：EP0776150A1

公开(公告)日：1997-05-28

申请号：EP96916328.6

申请日：1996-06-06

申请人： IBIDEN CO, LTD.

发明人： ASAI, Motoo, Ibiden Co., Ltd. ,  KAWADE, Masato, Ibiden Co., Ltd. ,  HIRATUKA, Shinji, Ibiden Co., Ltd.

IPC分类号： H05K3/28

CPC分类号： H05K3/3457 ,  H05K1/112 ,  H05K3/184 ,  H05K3/3452 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2203/0588

摘要： This invention is to provide a printed circuit board suitable for the high densification of mounting parts using a solder bump and for the improvements of connection reliability and mounting reliability, and proposes a printed circuit board comprising a mounting pad provided with a solder bump by covering a mounting surface with a solder resist, characterized in that a position of forming the solder bump is arranged so as to match with a position of a viahole, or a size of opening portion formed in the solder resist is made larger than a size of a land of the viahole so as not to overlap the solder resist with the viahole.

摘要翻译： 本发明提供一种印刷电路板，其适用于使用焊料凸块的安装部件的高致密化，并且提高了连接可靠性和安装可靠性，并提出了一种印刷电路板，其包括通过覆盖焊料凸块 安装表面具有阻焊剂，其特征在于，形成焊料凸块的位置被布置成与通孔的位置相匹配，或者形成在阻焊剂中的开口部分的尺寸大于焊盘的尺寸 以防止阻焊剂与通孔重叠。

公开(公告)号：EP0681416A3

公开(公告)日：1996-07-03

申请号：EP95106452.6

申请日：1995-04-28

申请人： SEIKO EPSON CORPORATION

发明人： Hashimoto, Nobuaki, c/o Seiko Epson Corp.

IPC分类号： H05K3/34

CPC分类号： H05K3/3457 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3489 ,  H05K3/46 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0315 ,  H05K2203/043 ,  H05K2203/0485 ,  H05K2203/0588 ,  H05K2203/161 ,  Y02P70/613 ,  H01L2924/00

摘要： A printed circuit board (2) to which an IC package such as a TCP having a multiplicity of leads arranged with a small pitch is suitably connected by a local heating method using a bonding tool. The upper surfaces of solder layers (11) provided on lands (8) formed on the printed circuit board (2) are flattened, and leads of an electronic part to be mounted are placed on the solder layers. These members are soldered by being pressed and heated with the bonding tool. At least a region of the printed circuit board corresponding to the bottom surface of the bonding tool has a height lower than that of the leads superposed on the lands, whereby the desired parallelism of the bottom surface of the bonding tool with respect to the printed circuit board is maintained.

摘要翻译： 通过使用接合工具的局部加热方法适当地连接具有多个引线以小间距排列的诸如TCP的诸如TCP的IC封装的印刷电路板（2）。 设置在形成在印刷电路板（2）上的焊盘（8）上的焊料层（11）的上表面被平坦化，并且要安装的电子部件的引线被放置在焊料层上。 这些构件通过用粘结工具压制和加热而被焊接。 对应于接合工具的底面的印刷电路板的至少一个区域的高度低于重叠在焊盘上的引线的高度，由此焊接工具的底面相对于印刷电路的期望的平行度 董事会维持。