公开(公告)号：EP0256428A3

公开(公告)日：1989-02-22

申请号：EP87111292.6

申请日：1987-08-05

Applicant: AMP-AKZO CORPORATION (a Delaware corp.) ,  SMITH CORONA CORPORATION

Inventor： Cleveland, Eric J. ,  Frisch, David C.

IPC: H05K3/10 ,  C23C18/16 ,  B29C45/16

CPC classification number: H05K3/184 ,  B29C45/16 ,  B29C2045/0079 ,  B29C2045/169 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/1415 ,  H05K2203/1476

Abstract: Molded, one piece articles having selected surfaces suitable for adherent metallization, molded metallized one-piece articles, and processes for making the said articles are disclosed. The molded one-piece articles may be formed by molding into a first mold cavity a first portion of the article using a first electrically insulating material which is an amorphous polymer resin capable of being adhesion promoted by an adhesion pro miting process and is catalytic for adherent metalli­zation, or is capable of being rendered catalytic for adherent metallization by an activating process; in­serting the first portion into a second mold cavity and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surface areas of the first portion exposed. The second material is a crystalline polymer resin resistant to the adhesion promotion pro­cess employed for the first material, non-catalytic for and incapable of being rendered catalytic for adherent metallization by the activating process employed for the first material. The exposed surface areas of the first portion of the article may then be metallized, e. g., by electroless metal deposition to form the metallized, one piece article.

公开(公告)号：EP0166665A2

公开(公告)日：1986-01-02

申请号：EP85420114.2

申请日：1985-06-21

Applicant: CIBA-GEIGY AG

Inventor： Cassat, Robert

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K3/188 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0236 ,  H05K2203/1157 ,  H05K2203/125

Abstract: Circuits imprimés sur des supports injectés obtenus à partir de compositions polymériques contenant de 10 à 70% d'oxyde métallique non conducteur, le circuit conducteur étant révélé par réduction sélective avec un composé borohydrure. Ces circuits ont une conductibilité thermique améliorée.

Abstract translation: 在基片上印刷电路注射的从含有其它非导电性金属氧化物的10〜70％的聚合物组合物获得，该导电电路由用硼氢化物化合物选择性还原显露。 电路具有改进的热传导性。

公开(公告)号：EP3328926A1

公开(公告)日：2018-06-06

申请号：EP16754558.1

申请日：2016-07-29

Applicant: SABIC Global Technologies B.V.

Inventor： CHENG, Yunan ,  ZHENG, Yun ,  LI, Huihui ,  TANG, Haowei ,  LIU, Chao ,  LIU, Richard

IPC: C08K3/00 ,  C08K3/22 ,  C08K5/00 ,  C08K7/06 ,  C08K7/14 ,  H05K1/03 ,  H05K3/10 ,  C08K5/18 ,  C08K5/315 ,  C08K5/3447 ,  C08L69/00

CPC classification number: C08K3/22 ,  C08K3/013 ,  C08K5/0041 ,  C08K5/18 ,  C08K5/315 ,  C08K5/3447 ,  C08K7/06 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2248 ,  C08K2003/2293 ,  C08K2003/2296 ,  C08L23/0869 ,  C08L33/04 ,  C08L51/04 ,  C08L69/00 ,  C08L69/005 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/0275 ,  H05K2201/09118 ,  C08L101/00

Abstract: The disclosure concerns polymer compositions exhibiting LDS properties while maintaining mechanical properties and a dark color throughout the composition.

公开(公告)号：EP3188908A4

公开(公告)日：2018-04-18

申请号：EP15838426

申请日：2015-06-05

Applicant: BYD CO LTD

Inventor： ZHOU WEI ,  MAO BIFENG

IPC: B32B27/06 ,  B32B15/08 ,  B32B27/16 ,  C23C18/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

公开(公告)号：EP3139388A4

公开(公告)日：2017-12-27

申请号：EP15835403

申请日：2015-08-03

Applicant: LG CHEMICAL LTD

Inventor： PARK CHEE-SUNG ,  KIM JAE HYUN ,  JUN SHIN HEE ,  SHIN BU GON ,  KIM JAE JIN ,  PARK CHEOL-HEE ,  JEONG HAN NAH ,  SEONG EUN KYU ,  LEE SU JEONG ,  LEE HA NA

IPC: H01B1/22 ,  H05K3/10

CPC classification number: C09D5/24 ,  C08K3/16 ,  C23C18/00 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00 ,  H01B13/0026 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

Abstract: Provided are a composition for forming a conductive pattern, which enables formation of a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simplified process, a method of forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern includes a polymer resin; and a non-conductive metal compound including a coinage metal element [Group 11 (Group IB)] and a non-metal element, the non-conductive metal compound having a three-dimensional structure formed by vertex sharing of tetrahedrons including the Group 11 metal element, in which a metal core including the Group 11 metal element or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

公开(公告)号：EP3042980A4

公开(公告)日：2017-04-26

申请号：EP14842890

申请日：2014-09-03

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORP

Inventor： TAKANO TAKAHIRO ,  YAMADA RYUSUKE ,  AYUBA SHINICHI

IPC: C23C18/20 ,  C08K3/22 ,  C08K3/24 ,  C08K3/28 ,  C08K3/38 ,  C08K7/14 ,  C08K13/04 ,  C08K13/06 ,  C08L77/00 ,  C08L77/06 ,  C08L101/12 ,  C09K5/14 ,  C23C18/16 ,  C23C22/82 ,  H05K1/03 ,  H05K3/18

CPC classification number: C08K13/04 ,  C08K3/22 ,  C08K3/24 ,  C08K3/28 ,  C08K3/38 ,  C08K7/14 ,  C08K13/06 ,  C08K2003/282 ,  C08K2003/385 ,  C08L77/06 ,  C09K5/14 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/204 ,  C23C22/82 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

公开(公告)号：EP3154066A1

公开(公告)日：2017-04-12

申请号：EP15842308.7

申请日：2015-09-17

Applicant: LG Chem, Ltd.

Inventor： JUN, Shin Hee ,  LEE, Dae Ki ,  SOHN, Se Hui ,  JEONG, Han Nah ,  PARK, Cheol-Hee ,  PARK, Chee-Sung ,  KIM, Jae Hyun ,  LEE, Ha Na

IPC: H01B1/22 ,  H01B13/00 ,  H01B5/14

CPC classification number: H01B5/14 ,  C08J7/123 ,  C08J2369/00 ,  C08J2483/04 ,  C08K3/32 ,  C08K2003/328 ,  C08L69/00 ,  C08L2203/20 ,  C08L2205/06 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/405 ,  H01B1/026 ,  H01B1/22 ,  H05K1/0313 ,  H05K1/0373 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.

Abstract translation: 本发明涉及用于形成导电图案和具有导电图案的树脂结构的组合物，worin所述组合物使得有可能通过简单的工艺形成的各种聚合物树脂产品或树脂层的微细利于图案，并且可以更有效地 满足本领域中，颜色的需要：例如显示各种颜色。

公开(公告)号：EP3146809A1

公开(公告)日：2017-03-29

申请号：EP15709567.0

申请日：2015-02-05

Applicant: Sierra Circuits Inc.

Inventor： KARAVAKIS, Konstantine ,  BAHL, Kenneth S. ,  CARNEY, Steve

IPC: H05K3/18

CPC classification number: H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/08 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4038 ,  H05K2201/017 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：EP3139388A1

公开(公告)日：2017-03-08

申请号：EP15835403.5

申请日：2015-08-03

Applicant: LG Chem, Ltd.

Inventor： PARK, Chee-Sung ,  KIM, Jae Hyun ,  JUN, Shin Hee ,  SHIN, Bu Gon ,  KIM, Jae Jin ,  PARK, Cheol-Hee ,  JEONG, Han Nah ,  SEONG, Eun Kyu ,  LEE, Su Jeong ,  LEE, Ha Na

IPC: H01B1/22 ,  C09D5/24 ,  H01B13/00

CPC classification number: C09D5/24 ,  C08K3/16 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/40 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0026 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

Abstract: Provided are a composition for forming a conductive pattern, which enables formation of a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simplified process, a method of forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern includes a polymer resin; and a non-conductive metal compound including a coinage metal element [Group 11 (Group IB)] and a non-metal element, the non-conductive metal compound having a three-dimensional structure formed by vertex sharing of tetrahedrons including the Group 11 metal element, in which a metal core including the Group 11 metal element or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

Abstract translation: 提供了用于形成导体图案，其通过非常简化的处理能够形成微细的导体图案的到各种聚合物树脂产品或树脂层，使用相同的形成导体图案的方法的组合物，和树脂结构，其具有 导电图案。 用于形成导电图案的组合物包括聚合物树脂; 和非导电性金属化合物包括货币金属元素[第11族（IB族）]和非金属元素，具有三维结构的其他非导电性金属化合物通过包括第11族金属四面体的顶点共享FORMED 元件，其中，金属核包括第11族金属元素或离子上其从通过电磁辐射的其它非导电性金属化合物形成。

公开(公告)号：EP2899236A4

公开(公告)日：2016-05-25

申请号：EP13836606

申请日：2013-09-05

Applicant: MITSUBISHI ENG PLASTICS CORP

Inventor： TAKANO TAKAHIRO ,  SUMINO TAKAHIKO ,  ISHIHARA KENTAROU ,  AKASHI NAOHISA

IPC: C08L101/00 ,  C08K3/22 ,  C08K7/14 ,  C08L77/00 ,  C23C18/20 ,  C23C18/30 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/09 ,  H05K3/18

CPC classification number: C23C18/285 ,  C08G69/265 ,  C08K3/22 ,  C08K3/2279 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L53/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO 2 and Al 2 O 3 in a proportion of 60 to 70 % by weight of SiO 2 and 20 to 30 % by weight of Al 2 O 3 .

Abstract translation: 提供从其中具有高白度和机械强度的树脂成型制品可以同时保持树脂成形品的镀敷性能能够得到一种热塑性树脂组合物。 一种热塑性树脂组合物，包括热塑性树脂和1至30份（重量）的激光直接结构化添加剂的0.1〜20重量份的二氧化钛和10〜230重量份每100份的玻璃纤维的重量的 热塑性树脂，worin所述激光直接结构化添加剂具有在50以上，L值，和玻璃纤维包括SiO 2和Al 2 O 3 30％的在60％至70％的比例（重量）的SiO 2和20的 重量的Al 2 O 3构成。