公开(公告)号：EP1076082A1

公开(公告)日：2001-02-14

申请号：EP00116899.6

申请日：2000-08-04

Applicant: Sony Chemicals Corporation

Inventor： Saito, Masao c/o Sony Chemicals Corp. ,  Takamatsu, Osamu c/o Sony Chemicals Corp. ,  Matsushima, Takayuki c/o Sony Chemicals Corp.

IPC: C09J9/02 ,  C09J11/08 ,  C09J7/00

CPC classification number: H05K3/323 ,  C08F290/062 ,  C08L71/12 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/08 ,  C09J133/068 ,  C09J163/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0239 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/31935 ,  C08F220/32 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract translation: 到各向异性设置绝缘粘合薄膜和导电性粘接膜，满足低温固化性，密合性高，可靠性高。 本发明的各向异性导电粘结片是这样配置的DID导电颗粒7在绝缘性粘接性树脂6，其包括作为主要成分的分散在：具有不饱和双键的可自由基聚合的树脂组分; 不具有不饱和双键的树脂组分; 树脂成分的含有磷酸的; 和自由基聚合引发剂。

公开(公告)号：EP1073319A2

公开(公告)日：2001-01-31

申请号：EP00116305.4

申请日：2000-07-27

Applicant: NGK INSULATORS, LTD.

Inventor： Otagiri, Tadashi, c/o NGK Insulators, Ltd. ,  Nonaka, Hisayoshi, c/o NGK Insulators, Ltd. ,  Tabuchi, Yoshitaka, c/o NGK Insulators, Ltd. ,  Suzuki, Tomio, c/o NGK Insulators, Ltd.

IPC: H05K1/03

CPC classification number: H05K3/4046 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/0235 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: There is provided a substrate material for wiring having an excellent thermal resistance, and durability and reliability under severe conditions, characterized in that said substrate material comprises an insulator whose major component is composed of epoxy resin and ceramics having a thermal expansion coefficient of 2 ppm/°C or less, and that the thermal expansion coefficient is isotropic.

Abstract translation: 提供了一种在恶劣条件下具有优异的耐热性，耐久性和可靠性的布线用基板材料，其特征在于，所述基板材料包括主要成分由环氧树脂和热膨胀系数为2ppm / ℃以下，热膨胀系数为各向同性。

公开(公告)号：EP1060141A1

公开(公告)日：2000-12-20

申请号：EP99908438.7

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce ,  ROBERTSON, Walter, J.

IPC: C03C25/02 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/42 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.

公开(公告)号：EP0736568B1

公开(公告)日：2000-06-28

申请号：EP96104407.0

申请日：1996-03-19

Applicant: COSMO RESEARCH INSTITUTE ,  COSMO OIL COMPANY, LTD

Inventor： Mizoguchi, Takashi ,  Iwafune, Masatoshi

IPC: C08K3/36 ,  C08K3/38 ,  C08L71/12 ,  C08L79/08

CPC classification number: H05K1/0373 ,  C08J7/045 ,  C08J2379/08 ,  C08K3/36 ,  C08K3/38 ,  C08K2201/016 ,  C08L71/123 ,  C08L79/08 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0773 ,  H05K2203/0793 ,  Y10T428/249958 ,  Y10T428/249978 ,  Y10T428/31605 ,  C08L71/12 ,  C08L2666/20 ,  C08L2666/14 ,  C08L71/00

公开(公告)号：EP0468476B1

公开(公告)日：1996-10-30

申请号：EP91112420.4

申请日：1991-07-24

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Ishii, Kenji, c/o Mitsubishi Gas Chemical Co. Inc. ,  Nakai, Takamasa, c/o Mitsubishi Gas Chemical ,  Matsumoto, Hiroyuki, c/o Mitsubishi Gas Chemical

IPC: B32B15/14 ,  B32B27/04 ,  C08J5/24

CPC classification number: B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/30 ,  B32B2457/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  Y10S428/901 ,  Y10T442/3415 ,  Y10T442/3439 ,  Y10T442/656

公开(公告)号：EP0460539A3

公开(公告)日：1993-03-24

申请号：EP91108904.3

申请日：1991-05-31

Applicant: AMP-AKZO CORPORATION

Inventor： Kohm, Thomas S.

IPC: H05K1/03 ,  C23C18/20

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0239 ,  H05K2201/0245

Abstract: A base material for printed wiring boards is formed by laminating together layers of prepregs of woven cloth impregnated with a thermosetting polymeric resin varnish. The varnish has an inorganic filler which is present in an amount sufficient to provide the base material with an average coefficient of thermal expansion along its Z-axis between 30°C and 270°C which is equal to or less than the coefficient of thermal expansion of copper from 30°C to 270°C plus the maximum elongation at 270°C of copper suitable for forming a conductive pattern on hole walls of printed wiring boards. Printed wiring boards manufactured on the base material by additive or subtractive processes are resistent to failure from thermal stress or thermal cycling.

Abstract translation: 用于印刷线路板的基材通过将浸渍有热固性聚合物树脂清漆的机织布的预浸料层叠在一起而形成。 清漆具有无机填料，其量足以使基材具有在30℃至270℃之间的Z轴的平均热膨胀系数，其等于或小于热膨胀系数 的铜从30℃加热至270℃，加上在270℃的最大伸长率，适用于在印刷电路板的孔壁上形成导电图案。 通过添加或减色法在基材上制造的印刷电路板抵抗热应力或热循环失效。

公开(公告)号：EP0468476A3

公开(公告)日：1992-10-28

申请号：EP91112420.4

申请日：1991-07-24

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Ishii, Kenji, c/o Mitsubishi Gas Chemical Co. Inc. ,  Nakai, Takamasa, c/o Mitsubishi Gas Chemical ,  Matsumoto, Hiroyuki, c/o Mitsubishi Gas Chemical

IPC: B32B15/14 ,  B32B27/04 ,  C08J5/24

CPC classification number: B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/30 ,  B32B2457/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  Y10S428/901 ,  Y10T442/3415 ,  Y10T442/3439 ,  Y10T442/656

Abstract: A metal foil-clad laminate obtained by lamination molding a resin-impregnated substrate and a metal foil, wherein the resin-impregnated substrate contains from 5 to 30% by weight of at least one inorganic filler selected from the group consisting of calcined kaolin, spherical fused silica, non-swellable synthetic mica, and a glass fine powder, the filler having an average particle diameter of from 0.1 to 5 µm and at least 90 wt% of the filler having a particle diameter of from 0.02 to 5 µm, and the resin-impregnated substrate is used as at least a surface layer of the laminate or as a resin-impregnated substrate which adheres the metal foil, thereby providing a surface smooth metal foil-clad laminate having a diminished surface undulation attributable to the substrate.

公开(公告)号：EP0440918A3

公开(公告)日：1992-02-26

申请号：EP90123488.0

申请日：1990-12-07

Applicant: International Business Machines Corporation

Inventor： Chellis, Leroy Newell ,  Japp, Robert Maynard ,  Summa, William Joseph ,  Rudik, William John ,  Wang, David Wei

IPC: C08J5/24 ,  C08J5/04 ,  C08K7/24 ,  H05K1/03 ,  C08K9/06

CPC classification number: C08J5/24 ,  C08K7/24 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0254 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/2982 ,  Y10T428/31663

Abstract: A flame retardant, low dielectric constant, controlled coefficient of thermal expansion, low cost prepreg material which includes randomly distributed silane coated hollow microspheres has been prepared by standard impregnation and lamination techniques. Laminates made of this prepreg can be drilled cleanly for through holes and can be used as a substrate for surface mounted devices.

公开(公告)号：EP0460539A2

公开(公告)日：1991-12-11

申请号：EP91108904.3

申请日：1991-05-31

Applicant: AMP-AKZO CORPORATION

Inventor： Kohm, Thomas S.

IPC: H05K1/03 ,  C23C18/20

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0239 ,  H05K2201/0245

Abstract: A base material for printed wiring boards is formed by laminating together layers of prepregs of woven cloth impregnated with a thermosetting polymeric resin varnish. The varnish has an inorganic filler which is present in an amount sufficient to provide the base material with an average coefficient of thermal expansion along its Z-axis between 30°C and 270°C which is equal to or less than the coefficient of thermal expansion of copper from 30°C to 270°C plus the maximum elongation at 270°C of copper suitable for forming a conductive pattern on hole walls of printed wiring boards. Printed wiring boards manufactured on the base material by additive or subtractive processes are resistent to failure from thermal stress or thermal cycling.

Abstract translation: 用于印刷线路板的基材通过将浸渍有热固性聚合物树脂清漆的机织布的预浸料层叠在一起而形成。 清漆具有无机填料，其量足以使基材具有在30℃至270℃之间的Z轴的平均热膨胀系数，其等于或小于热膨胀系数 的铜从30℃加热至270℃，加上在270℃的最大伸长率，适用于在印刷电路板的孔壁上形成导电图案。 通过添加或减色法在基材上制造的印刷电路板抵抗热应力或热循环失效。

公开(公告)号：EP0048992B1

公开(公告)日：1988-12-07

申请号：EP81107748.6

申请日：1981-09-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Oodaira, Hiroshi ,  Nagashima, Kenji ,  Matsumoto, Hiroshi ,  Tanaka, Masataka

IPC: H05K1/05 ,  H05K3/44

CPC classification number: H05K1/053 ,  H05K2201/0116 ,  H05K2201/0179 ,  H05K2201/0239 ,  H05K2203/1147