公开(公告)号：EP2973625A1

公开(公告)日：2016-01-20

申请号：EP14774544.2

申请日：2014-03-13

Applicant: Hiq Solar, Inc.

Inventor： WILLIS, Andre P.

IPC: H01G2/06 ,  H01G4/12 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.

公开(公告)号：EP2112723B1

公开(公告)日：2014-04-16

申请号：EP09005731.6

申请日：2009-04-23

Applicant: Iriso Electronics Co., Ltd.

Inventor： Sugaya, Yujiro ,  Saito, Tomomitsu

IPC: H01R13/66 ,  H01R43/02 ,  H01R13/658 ,  H05K3/32

CPC classification number: H01R43/0221 ,  H01R13/6585 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/328 ,  H05K2201/0112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2203/107 ,  H05K2203/1136

公开(公告)号：EP2489248B1

公开(公告)日：2013-09-11

申请号：EP10704608.8

申请日：2010-01-28

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： OLSÉN, Conny

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/112 ,  H05K1/0224 ,  H05K1/025 ,  H05K2201/09236 ,  H05K2201/09381

公开(公告)号：EP2034809B1

公开(公告)日：2013-06-26

申请号：EP08013851.4

申请日：2008-08-01

Applicant: DENSO CORPORATION

Inventor： Honda, Takayoshi ,  Hozuka, Minoru

IPC: H05K3/34 ,  H05K1/11 ,  H01R43/02 ,  H01R12/57 ,  H01R12/72 ,  H01R12/58

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

公开(公告)号：EP2555426A1

公开(公告)日：2013-02-06

申请号：EP11765420.2

申请日：2011-03-24

Applicant: Daishinku Corporation

Inventor： IIZUKA, Minoru ,  KOJO, Yuka

IPC: H03H9/02 ,  H01L23/04 ,  H01L23/12 ,  H03H9/10

CPC classification number: H05K5/0091 ,  H01L23/053 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K3/3431 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10075 ,  Y02P70/613 ,  H01L2924/00

Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal. The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

Abstract translation: 的表面安装电子部件封装的基部保持的电子部件元件上，并且将被安装在电路基板上用导电性接合材料。 所述基座具有主面和在外部连接端子被连接到所述电路板电。 外部连接端子在所述主面形成。 所述基座包括形成于外部连接端子上形成凸块。 凸块是比外部连接端子小。 所述基座具有在所述外部连接端子的外周端缘之间沿上在外部连接端子上的应力衰减的方向上的凸块的外周端缘的距离为d。 应力在电路基板上的基的安装关联生成。 的距离d是晚上12点多毫米且等于或小于0.45毫米。

公开(公告)号：EP2489247A1

公开(公告)日：2012-08-22

申请号：EP09797201.2

申请日：2009-12-21

Applicant: Telefonaktiebolaget L M Ericsson (PUBL)

Inventor： OLSÉN, Conny

IPC: H05K3/00

CPC classification number: H05K1/112 ,  H05K1/0224 ,  H05K1/025 ,  H05K2201/09236 ,  H05K2201/09381

Abstract: The present invention concerns a multi layered printed circuit board, PCB, with via holes connecting different signal layers of the PCB. The via holes are connected to pads (905) in the signal layers and are surrounded by anti-pads (1425) in the ground layers. In accordance with the invention the pads have a shape wherein a first path, stretching from the center of the pad and substantially in a direction in which adjacent routing channels (305) extend, to a first point located on the edge of the pad, is longer than a second path, stretching from the center of the pad and substantially in a direction towards the adjacent routing channels to a second point located on the edge of the pad.

Abstract translation: 本发明涉及具有连接PCB的不同信号层的通孔的多层印刷电路板PCB。 通孔连接到信号层中的焊盘（905）并且被接地层中的抗焊盘（1425）包围。 根据本发明，衬垫具有这样的形状，其中从衬垫的中心延伸并且基本上在相邻布线通道（305）延伸的方向上延伸到位于衬垫的边缘上的第一点的第一路径是 比第二路径长，从所述垫的中心延伸并且基本沿着朝向所述相邻路由通道的方向延伸到位于所述垫的所述边缘上的第二点。

公开(公告)号：EP2290676A1

公开(公告)日：2011-03-02

申请号：EP09762553.7

申请日：2009-06-12

Applicant: Mitsubishi Materials Corporation

Inventor： ISHIKAWA Masayuki ,  NAKAGAWA Sho

IPC: H01L21/52 ,  B23K3/06 ,  B23K35/26 ,  B23K35/30 ,  C22C5/02 ,  C22C11/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34

CPC classification number: B23K1/0008 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/262 ,  B23K35/268 ,  B23K35/3013 ,  B23K2201/36 ,  B23K2203/52 ,  C22C5/02 ,  C22C11/06 ,  C22C13/00 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/95085 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/09427 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12486 ,  Y10T428/24777 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: In this method of bonding a part to a substrate using a solder paste, the solder paste is mounted or applied between a metallization layer formed on the substrate and a metallization layer formed on the part, and the part is bonded to the substrate by performing a reflow process in a non-oxidizing atmosphere to bond the substrate and the part. The metallization layer formed on the surface of the substrate is planar and includes a metallization layer main portion that has an area smaller than that of the metallization layer of the part and a solder guide portion that protrudes from a periphery of the metallization layer main portion.

Abstract translation: 在使用焊膏将部件接合到基板的方法中，将焊膏安装或施加在形成在基板上的金属化层和形成在该部件上的金属化层之间，并且通过执行 在非氧化性气氛中回流焊接基板和部件。 形成在基板表面上的金属化层是平面的，并且包括具有小于该部分的金属化层的面积的金属化层主体部分和从金属化层主体部分的周边突出的焊料引导部分。

公开(公告)号：EP0949642B1

公开(公告)日：2010-11-03

申请号：EP99302518.8

申请日：1999-03-31

Applicant: TDK Corporation

Inventor： Ahiko, Taisuke ,  Sato, Hiroki ,  Ishigaki, Takaya ,  Kamiya, Takashi ,  Yamamoto, Masanori

IPC: H01G4/232 ,  H01G4/38 ,  H01G2/06

CPC classification number: H01G4/012 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP2208405A1

公开(公告)日：2010-07-21

申请号：EP08845428.5

申请日：2008-11-03

Applicant: Cinterion Wireless Modules GmbH

Inventor： WENDLER, Ralf ,  ROMAHN, Jörg ,  BÖLCKE, Annette

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/325 ,  H01R12/52 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09381 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10265

Abstract: The invention relates to a configuration, comprising a first circuit board (ELP), which has a contact surface (KF) for contacting a connection element (VE), said contact surface (KF) comprising a central contact point and a concentric ring enclosing said central contact point; a second circuit board (ZLP); and a connection element (VE), which is electrically contacted on a first side with the second circuit board (ZLP) and which comprises a first spring element (FE1) and at least one second spring element (FE2, FE3) on a second side, which is opposite the first side, said first spring element (FE1) being electrically contacted with the central contact point of the first circuit board (ELP) and the at least one second spring element (FE2, FE3) being electrically contacted with the concentric ring of the first circuit board (ELP).

公开(公告)号：EP2091307A4

公开(公告)日：2010-04-28

申请号：EP06823428

申请日：2006-11-15

Applicant: PANASONIC CORP

Inventor： SUZUKI HIROYUKI

IPC: H05K3/36 ,  H05K1/14 ,  H05K3/28

CPC classification number: H05K3/361 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/058 ,  H05K2201/09381 ,  H05K2201/0949 ,  H05K2201/09709