公开(公告)号：EP3209488A4

公开(公告)日：2018-06-20

申请号：EP15852910

申请日：2015-10-23

Applicant: FACEBOOK INC

Inventor： ELMIEH BABACK ,  PALAN SAURABH ,  CROSSEN REX WENTERS ,  JAIS ALEXANDRE

IPC: H05K3/10 ,  B33Y10/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4679 ,  B29C33/0016 ,  B29C33/448 ,  B29C64/00 ,  B29C64/10 ,  B29C2043/3668 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  G05B19/4099 ,  G05B2219/35134 ,  G05B2219/49007 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/097 ,  H05K1/111 ,  H05K1/162 ,  H05K1/183 ,  H05K3/0005 ,  H05K3/0014 ,  H05K3/0044 ,  H05K3/0088 ,  H05K3/101 ,  H05K3/103 ,  H05K3/1258 ,  H05K3/26 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0329 ,  H05K2201/098 ,  H05K2201/10265 ,  H05K2203/0126 ,  H05K2203/0228 ,  H05K2203/0292 ,  H05K2203/0514 ,  H05K2203/06 ,  H05K2203/0783 ,  H05K2203/082 ,  H05K2203/085 ,  H05K2203/1115 ,  H05K2203/1194 ,  H05K2203/128 ,  H05K2203/143 ,  H05K2203/163 ,  H05K2203/175 ,  H05K2203/302 ,  H05K2203/308

Abstract: A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.

公开(公告)号：EP3273204A1

公开(公告)日：2018-01-24

申请号：EP17001175.3

申请日：2017-07-10

Applicant: Testo SE & Co. KGaA

Inventor： Ketterer, Klaus

IPC: G01D9/00 ,  G01D11/24

CPC classification number: G01D9/005 ,  G01D11/245 ,  H05K1/144 ,  H05K1/181 ,  H05K5/0026 ,  H05K2201/042 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10265

Abstract: Bei einem Datenlogger (1) wird vorgeschlagen, an einem Gehäuse (6) zwei voneinander elektrisch getrennte metallische Wandbereiche (7, 8) auszubilden, durch welche ein Datenanschluss, der zumindest einen ersten Pol (4) und einen zweiten Pol (5) aufweist, von außen elektrisch zu kontaktieren (vgl. Fig. 3).

Abstract translation: 在数据记录器（1）中，建议在壳体（6）上形成两个相互电隔离的金属壁区域（7,8），具有至少第一极（4）和第二极（5）的数据端子通过所述金属壁区域 从外部电接触（见图3）。

公开(公告)号：EP3149809A4

公开(公告)日：2017-11-22

申请号：EP15799258

申请日：2015-05-29

Applicant: IDEAL IND

Inventor： ZANTOUT ALAN E

IPC: H01R12/52 ,  H01R12/53 ,  H01R12/70 ,  H01R12/71 ,  H01R12/73 ,  H01R12/88 ,  H01R13/62 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01R12/732 ,  H01R4/4818 ,  H01R11/01 ,  H01R12/53 ,  H01R12/7023 ,  H01R12/7029 ,  H01R12/7052 ,  H01R12/714 ,  H05K1/142 ,  H05K3/368 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10424 ,  Y02P70/611

Abstract: An electrical connector has one or more body portions in which is disposed an electrical terminal having at least one contact pad interface for coupling to a contact pad of at least one printed circuit board (PCB). The body has an associated fastening device which is used to mechanically and electrically couple the electrical connector to the at least one PCB. The electrical connector may be provided with a full or partial hourglass-like shape, when viewed from the side and/or from above, to facilitate its use with a PCB that carries a source of light, such as an LED.

公开(公告)号：EP3209488A1

公开(公告)日：2017-08-30

申请号：EP15852910.7

申请日：2015-10-23

Applicant: Facebook Inc.

Inventor： ELMIEH, Baback ,  PALAN, Saurabh ,  CROSSEN, Rex, Wenters ,  JAIS, Alexandre

IPC: B29C70/88 ,  B29C70/82 ,  H05K3/10

CPC classification number: H05K3/4679 ,  B29C33/0016 ,  B29C33/448 ,  B29C64/00 ,  B29C64/10 ,  B29C2043/3668 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  G05B19/4099 ,  G05B2219/35134 ,  G05B2219/49007 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/097 ,  H05K1/111 ,  H05K1/162 ,  H05K1/183 ,  H05K3/0005 ,  H05K3/0014 ,  H05K3/0044 ,  H05K3/0088 ,  H05K3/101 ,  H05K3/103 ,  H05K3/1258 ,  H05K3/26 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0329 ,  H05K2201/098 ,  H05K2201/10265 ,  H05K2203/0126 ,  H05K2203/0228 ,  H05K2203/0292 ,  H05K2203/0514 ,  H05K2203/06 ,  H05K2203/0783 ,  H05K2203/082 ,  H05K2203/085 ,  H05K2203/1115 ,  H05K2203/1194 ,  H05K2203/128 ,  H05K2203/143 ,  H05K2203/163 ,  H05K2203/175 ,  H05K2203/302 ,  H05K2203/308

Abstract: A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.

Abstract translation: 用于形成具有至少一个导电迹线的三维物体的方法包括提供根据三维物体的模型设计从第一材料产生（例如，加性或减性地产生）的中间结构。 中间结构可以具有用于至少一个导电迹线的至少一个预定位置。 该模型设计包括至少一个预定义位置。 接下来，可以在中间结构的至少一个预定位置附近产生至少一个导电迹线。 该至少一个导电迹线可以由具有比第一材料大的导电率和/或导热率的第二材料形成。

公开(公告)号：EP2112717B1

公开(公告)日：2017-03-08

申请号：EP09158172.8

申请日：2009-04-17

Applicant: Sherman, Neil S.

Inventor： Sherman, Neil S. ,  Steuer, Brian H.

IPC: H01R12/57 ,  H01R13/24 ,  H05K3/32

CPC classification number: H01R12/57 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

公开(公告)号：EP2946251B1

公开(公告)日：2017-02-22

申请号：EP13803036.6

申请日：2013-12-12

Applicant: ETA SA Manufacture Horlogère Suisse

Inventor： BALMER, Raphaël ,  KLOPFENSTEIN, François

IPC: G04G17/06 ,  H05K1/02

CPC classification number: G04G17/06 ,  G04G17/02 ,  G04G17/04 ,  G04G17/045 ,  H05K1/115 ,  H05K2201/10265

公开(公告)号：EP2115819B1

公开(公告)日：2016-01-27

申请号：EP07822811.1

申请日：2007-11-22

Applicant: Gigaset Communications GmbH

Inventor： BUSCH, Georg ,  HÜNTING, Ralf ,  FELS, Christoph

IPC: H01H1/04 ,  H01H1/40 ,  H01H19/58 ,  H01R12/52 ,  H01R12/57 ,  H01R13/03 ,  H05K3/24 ,  H05K3/32 ,  H04R1/10

CPC classification number: H01R12/57 ,  H01H1/04 ,  H01H1/403 ,  H01R12/52 ,  H01R13/03 ,  H05K3/249 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10265

公开(公告)号：EP2727142A1

公开(公告)日：2014-05-07

申请号：EP12719527.9

申请日：2012-04-11

Applicant: Apple Inc.

Inventor： DEGNER, Brett W. ,  TICE, Gregory

IPC: H01L23/40 ,  H05K7/12 ,  H05K3/30 ,  H01L23/473 ,  H05K7/20

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

Abstract: A low Z profile consolidated thermal module suitable for securing and removing excess heat generated by an integrated circuit (208) mounted to a printed circuit board (214) and operating in a compact computing environment is disclosed. The consolidated thermal module comprises a heat removal assembly (202, 204, 206) with a reduced footprint and disposed on a first surface of the printed circuit board and in thermal contact with the integrated circuit. A retaining mechanism (210) is disposed on a second surface of the printed circuit board and a backer plate (218) is disposed between the retaining mechanism and the printed circuit board. At least one fastener (212) secures the heat removal assembly to the backer plate and the retaining mechanism, wherein the retaining mechanism causes a substantially uniform retaining force to be applied across the backer plate, thereby minimizing an amount of torque applied to the integrated circuit.

公开(公告)号：EP2683035A2

公开(公告)日：2014-01-08

申请号：EP13174631.5

申请日：2013-07-02

Applicant: MAHLE International GmbH

Inventor： Nestmann, Bernhard ,  Weber, Stephan

IPC: H01R12/52 ,  H01R12/57 ,  H01R12/91 ,  H01R43/02 ,  G01D5/14

CPC classification number: H01R12/52 ,  G01D5/145 ,  G01D11/245 ,  H01R12/57 ,  H01R12/91 ,  H01R43/0256 ,  H01R43/0263 ,  H05K3/368 ,  H05K2201/10265

Abstract: Die vorliegende Erfindung betrifft eine Stellvorrichtung (1) zum bidirektionalen Verstellen eines Stellglieds (2) mit einem Gehäuse (4) aus Kunststoff und mit einer Positionssensorik (15) zum Erfassen einer Position einer mobilen Komponente (16) der Stellvorrichtung (1) relativ zu einer stationären Komponente (17) der Stellvorrichtung (1), wobei die Positionssensorik (15) eine Platine (18) aufweist, die wenigstens einen Positionssensor (19) trägt und die mit einer zumindest teilweise in den Kunststoff des Gehäuses (4) eingebetteten Metallstruktur (20) elektrisch kontaktiert ist.
Die Dauerhaltbarkeit der elektr. Verbindung in der Stellvorrichtung (1) lässt sich verbessern, wenn die Platine (18) über wenigstens ein Kontaktelement (24) mit der Metallstruktur (20) elektrisch kontaktiert ist, das zwischen einer elektrisch mit der Platine (18) kontaktierten Platinenkontaktzone (25) und einer elektrisch mit der Metallstruktur (20) kontaktierten Metallstrukturkontaktzone (26) eine wellenförmig gebogene Federzone (27) aufweist, die Relativbewegungen zwischen der Platinenkontaktzone (25) und der Metallstrukturkontaktzone (26) federelastisch aufnimmt.

Abstract translation: 该装置具有位置传感器机构，其包括印刷电路板（PCB）（18），其承载位置传感器并且通过接触元件（24）与金属结构（20）进行电接触，即冲压废料。 金属结构部分地嵌入外壳的塑料中。 接触元件包括在PCB接触区域（25）和金属结构接触区域（26）之间的波纹状弯曲弹簧区域（27）。 弹簧区域弹性地接收PCB和金属结构接触区域之间的相对运动。 还包括用于制造用于控制装置的PCB的方法的独立权利要求。

公开(公告)号：EP2438802B1

公开(公告)日：2013-12-25

申请号：EP10724726.4

申请日：2010-05-17

Applicant: Huber+Suhner AG

Inventor： WAGNER, Martin ,  FUCHS, Josef

IPC: H05K1/14 ,  H05K3/36 ,  H01R13/24

CPC classification number: H05K3/368 ,  H01R12/73 ,  H01R12/732 ,  H05K1/14 ,  H05K2201/10265

Abstract: The invention relates to a printed circuit board arrangement (20) having at least two printed circuit boards (11; 12′), which are located alongside one another on a common, electrically conductive base plate (13′), have two mutually opposite edges, forming an intermediate space (14), and are connected to one another, bridging the intermediate space (14) by means of electrical connections (21), in order to transmit extremely high frequencies. In the case of a printed circuit board arrangement such as this, RF-compatible electrical connections are made between the printed circuit boards in a simple and space-saving manner when the printed circuit boards are fitted on the base plate and without any further necessary additional tasks or reworking, in that the electrical connections are each made via at least one contact-making element (21), via which the printed circuit boards make detachable electrical contact with one another when mounted on the base plate (13′).