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公开(公告)号：EP0476898B1
公开(公告)日：1995-12-20
申请号：EP91308201.2
申请日：1991-09-09
Applicant: FUJITSU LIMITED
Inventor： Horikoshi, Eiji , Tani, Motoaki , Watanabe, Isao , Natori, Katsuhide , Sato, Takehiko, Gurinhiru Kamoshidanishi 23-101
CPC classification number: H05K1/056 , H05K3/0023 , H05K3/0041 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4644 , H05K2201/0166 , H05K2201/09509 , H05K2201/09554 , H05K2203/135 , Y10T428/24917 , Y10T428/256
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公开(公告)号：EP0611121A3
公开(公告)日：1995-03-22
申请号：EP94300881.3
申请日：1994-02-07
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Wojnarowski, Robert John , Cole, Herbert Stanley , Gorczyca, Thomas Bert , Balch, Ernest Wayne , Saia, Richard Joseph
IPC: H01L21/48 , H01L23/498 , H01L21/311 , H01L23/538
CPC classification number: H05K3/0041 , H01L21/31138 , H01L21/486 , H01L21/76802 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/0401 , H01L2224/04105 , H01L2224/1147 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/30105 , H01L2924/3011 , H05K1/036 , H05K3/0032 , H05K2201/0166 , H05K2201/0195 , Y10S438/94 , Y10S438/945 , H01L2924/00
Abstract: A differentiable ablation approach to patterning dielectrics which are not of the same absorbance uses an absorbant dielectric (20) at a specified laser wavelength over a non-absorbant dielectric (18) at that wavelength. The absorbant dielectric may be laser-patterned and become an integral mask enabling plasma etching of the underlying non-absorbant dielectric. If the patterning of the absorbant dielectric involves vias, polymer ridges formed around via surfaces during laser patterning may be removed at the same time the underlying non-absorbant dielectric is etched using a transparent, oxygen plasma resistant mask. Alternatively, an inert mask may be used instead of the absorbent dielectric to allow plasma etching of the non-absorbant dielectric.
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公开(公告)号：EP0425437A3
公开(公告)日：1992-05-27
申请号：EP90810795.6
申请日：1990-10-17
Applicant: CIBA-GEIGY AG
Inventor： Banks, Christopher Paul, Dr. , Irving, Edward, Dr.
CPC classification number: G03F7/00 , H05K3/061 , H05K2201/0166 , H05K2203/0582 , H05K2203/0783 , H05K2203/0793
Abstract: The present invention provides a method for making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas which comprises (i) protecting the bare metal by coating with a film-forming resin, (ii) removing any film-forming resin from the resist, (iii) removing the resist from said remaining areas using a solvent which will not remove the film-forming resin, thereby exposing metal in said remaining areas, (iv) etching the metal exposed in (iii) using an etchant which does not remove the film-forming resin and (v) removing the film-forming resin with a suitable solvent.
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64.发明公开Circuit board and process for producing the same 失效Leiterplatte und Verfahren zu ihrer Herstellung。
公开(公告)号：EP0476898A2
公开(公告)日：1992-03-25
申请号：EP91308201.2
申请日：1991-09-09
Applicant: FUJITSU LIMITED
Inventor： Horikoshi, Eiji , Tani, Motoaki , Watanabe, Isao , Natori, Katsuhide , Sato, Takehiko, Gurinhiru Kamoshidanishi 23-101
CPC classification number: H05K1/056 , H05K3/0023 , H05K3/0041 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4644 , H05K2201/0166 , H05K2201/09509 , H05K2201/09554 , H05K2203/135 , Y10T428/24917 , Y10T428/256
Abstract: A circuit board comprising: a core material consisting of any one selected from the group consisting of magnesium, a magnesium alloy, and a magnesium-based composite material; and an electric circuit formed on the core material. A process for producing the circuit board comprises: forming an electrodeposition-painted coating on such a core material; forming a polyimide resin coating on the electrodeposition-painted coating; forming a viahole extending through the resin coating to the underlying electrodeposition-painted coating; etching and removing the electrodeposition-painted coating in the region exposed in the bottom of the viahole while masking the other region with the resin coating, to extend the viahole to the core material; forming a metal film at least on a free surface of the resin coating and a inner surface of the extended viahole; and etching the metal film by using a photoresist mask to form a conductor layer having a predetermined pattern.
Abstract translation: 一种电路板，包括：由选自镁，镁合金和镁基复合材料中的任何一种组成的芯材料; 以及形成在芯材上的电路。 制造电路板的方法包括：在这种芯材上形成电沉积涂层; 在电沉积涂覆的涂层上形成聚酰亚胺树脂涂层; 形成延伸穿过树脂涂层的通孔到下面的电沉积涂层; 在暴露于通孔的底部的区域中蚀刻和去除电沉积涂层，同时用树脂涂层掩蔽另一区域，将通孔延伸到芯材; 至少在树脂涂层的自由表面和延伸通孔的内表面上形成金属膜; 并通过使用光致抗蚀剂掩模蚀刻金属膜以形成具有预定图案的导体层。
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公开(公告)号：EP0422213A4
公开(公告)日：1992-03-11
申请号：EP90908011
申请日：1990-04-17
Applicant: AMOCO CORPORATION
Inventor： SALENSKY, GEORGE, ANTHONY , THOMAN, THOMAS, STEVEN
IPC: C08J5/18 , C08J7/02 , C08J7/04 , C08L71/00 , C09J5/02 , H05K1/09 , H05K3/20 , H05K3/28 , H05K3/34 , H05K3/38
CPC classification number: C08L71/00 , C08J7/02 , H05K1/095 , H05K3/207 , H05K3/28 , H05K3/3452 , H05K3/381 , H05K2201/0129 , H05K2201/0166 , H05K2203/0537 , H05K2203/0783 , C08L61/20
Abstract: This invention relates to an adhesion promoting composition and method for its use for promoting adhesion of printed circuits on thermoplastic substrates. The composition includes isopropanol with either methylene chloride or resorcinol. An added ingredient includes polycyclohexanone. The preferred substrate is polyarylsulfone.
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Patent Agency Ranking66.发明公开
公开(公告)号：EP0431095A1
公开(公告)日：1991-06-12
申请号：EP90907707.0
申请日：1990-04-17
Applicant: AMOCO CORPORATION
Inventor： SALENSKY, George, Anthony , THOMAN, Thomas, Steven
CPC classification number: H05K3/285 , C08L71/00 , H05K1/095 , H05K3/207 , H05K3/28 , H05K2201/0129 , H05K2201/0166 , H05K2201/0209 , H05K2203/0537 , H05K2203/0783 , Y10S428/901 , C08L61/20
Abstract: Cette invention concerne une composition d'un masque de soudure pour des substrats thermoplastiques. Le masque de soudure possède des composants critiques qui comprennent un polyhydroxyéther et une formaldéhyde de mélanine. D'autres composants consistent en un solvant, un matériau de charge et un agent de régulation de la fluidité. D'éventuels ingrédients sont un colorant, une résine époxyde et de l'acide pour contribuer à la réaction de la composition. Un agent tensio-actif peut également être incorporé. Le masque de soudure confère aux plaquettes de circuit thermoplastiques la flexibilité et l'adhésion nécessaires. Le masque peut être appliqué directement sur une plaquette de circuit ou sur un milieu de transfert pour le recouvrement ultérieur d'un substrat. Elle concerne un article qui peut être une plaque à circuit imprimé. Elle concerne également un procédé de fabrication de tels composites qui inclut le traitement du masque de soudure.
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公开(公告)号：EP0425437A2
公开(公告)日：1991-05-02
申请号：EP90810795.6
申请日：1990-10-17
Applicant: CIBA-GEIGY AG
Inventor： Banks, Christopher Paul, Dr. , Irving, Edward, Dr.
CPC classification number: G03F7/00 , H05K3/061 , H05K2201/0166 , H05K2203/0582 , H05K2203/0783 , H05K2203/0793
Abstract: The present invention provides a method for making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas which comprises (i) protecting the bare metal by coating with a film-forming resin, (ii) removing any film-forming resin from the resist, (iii) removing the resist from said remaining areas using a solvent which will not remove the film-forming resin, thereby exposing metal in said remaining areas, (iv) etching the metal exposed in (iii) using an etchant which does not remove the film-forming resin and (v) removing the film-forming resin with a suitable solvent.
Abstract translation: 本发明提供了一种在预定区域中具有裸露金属表面的基板上制造金属图案的方法以及在剩余区域中由抗蚀剂涂覆的金属的方法，其包括（i）通过用成膜树脂涂覆来保护裸露金属， （ii）从抗蚀剂中除去任何成膜树脂，（iii）使用不会除去成膜树脂的溶剂从所述剩余区域除去抗蚀剂，从而暴露所述剩余区域中的金属，（iv）蚀刻金属 暴露于（iii）使用不除去成膜树脂的蚀刻剂和（v）用合适的溶剂除去成膜树脂。
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公开(公告)号：EP0309190A3
公开(公告)日：1990-10-17
申请号：EP88308686.0
申请日：1988-09-20
Inventor： Powell, David B. , Rose, Bruce H.
CPC classification number: H05K3/285 , C08G73/1046 , C08G73/106 , C08L63/00 , C08L79/08 , H01B3/306 , H01B3/40 , H01L23/293 , H01L23/296 , H01L2924/0002 , H05K2201/0166 , H01L2924/00
Abstract: Compositions comprising phenolic end-capped polyimides and epoxy resins containing at least two 1,2-epoxy groups per resin molecule are fusible and/or soluble in polar solvents, for use in forming protective passivation coatings on e.g. electrical components. Preferred polyimides are polysiloxane-modified. The coatings are resistant to solvent and solder flux.
Abstract translation: 包含酚类封端的聚酰亚胺和每个树脂分子含有至少两个1,2-环氧基的环氧树脂的组合物在极性溶剂中是易熔的和/或可溶的，用于在例如玻璃上形成保护性钝化涂层。 电气元件。 优选的聚酰亚胺是聚硅氧烷改性的。 涂层耐溶剂和助焊剂。
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69.发明公开Printing ink for solder resist in printed circuit board 失效FlüssigemLötzinnbroadstehende Druckertintefürgedruckte Schaltungen。
公开(公告)号：EP0282638A2
公开(公告)日：1988-09-21
申请号：EP87115865.5
申请日：1987-10-29
Applicant: Nippon CMK Corp.
Inventor： Machida, Hideo , Kawakami, Shin , Haruyama, Satoshi , Okonogi, Hirotaka , Nikaido, Katutomo , Mukai, Norito
CPC classification number: B23K35/224 , H05K3/285 , H05K2201/0166
Abstract: A printing ink for solder resist used in the production of printed circuit boards contains a given amount of a silicon resin and/or fluororesin in addition to ink components.
Abstract translation: 用于制造印刷电路板的阻焊用印刷油墨除了油墨成分外还含有一定量的硅树脂和/或氟树脂。
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公开(公告)号：EP0159873A3
公开(公告)日：1987-05-27
申请号：EP85302570
申请日：1985-04-12
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , St. John, Frank
CPC classification number: H05K3/0076 , B23K35/224 , C09D5/008 , C09D157/00 , H05K3/3452 , H05K2201/0166 , H05K2203/0264 , C08L2666/02
Abstract: The invention concerns a coating composition which may be used to form a peelable solder mask. The coating composition comprises a mixture of vinylic resin, microcrystalline wax and solvent. Applied as a film coating, the coating composition can be used to provide a temporary mask to selected areas of a substrate, for example, a printed circuit, prior to exposure to a solder flux, the mask being readily peelable from the substrate.
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