公开(公告)号：EP0052061B1

公开(公告)日：1985-09-04

申请号：EP81420165.3

申请日：1981-11-03

Applicant: RHONE-POULENC SPECIALITES CHIMIQUES

Inventor： Cassat, Robert ,  Vignando, Bruno

IPC: H05K1/02 ,  B32B15/14

CPC classification number: B32B15/14 ,  B32B5/022 ,  B32B15/20 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2305/30 ,  B32B2305/80 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31623 ,  Y10T428/31634 ,  Y10T428/31656 ,  Y10T428/31659 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/3188 ,  Y10T428/31949 ,  Y10T428/31975

公开(公告)号：EP0040848B1

公开(公告)日：1984-02-22

申请号：EP81104019.5

申请日：1981-05-25

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Fushiki, Yasuo ,  Abe, Masaharu ,  Oizumi, Masazuki

IPC: B32B27/10 ,  H01B3/48 ,  H05K3/02 ,  B32B27/04

CPC classification number: B32B27/10 ,  B32B7/12 ,  B32B15/08 ,  B32B27/04 ,  B32B27/36 ,  B32B27/38 ,  B32B2305/72 ,  B32B2457/08 ,  H01B3/48 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T428/24967 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/31692 ,  Y10T428/3179 ,  Y10T428/3188 ,  Y10T428/31906 ,  Y10T428/31967

公开(公告)号：EP0079608A2

公开(公告)日：1983-05-25

申请号：EP82110542.6

申请日：1982-11-15

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Fushiki, Yasuo ,  Oizumi, Masayuki ,  Abe, Masaharu ,  Watanabe, Makoto

IPC: B32B15/08 ,  H05K1/02 ,  D21H5/00

CPC classification number: B32B15/12 ,  B32B15/08 ,  B32B27/18 ,  B32B27/36 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2307/3065 ,  B32B2457/08 ,  H05K1/034 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10S428/92 ,  Y10S428/921 ,  Y10T428/31522 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703

Abstract: A flame retarded copper clad laminate is provided comprising a plurality of paper substrate layers each impregnated with a halogen-containing unsaturated polyester resin containing about 1% to about 30% by weight of a basic filler, and a copper cladding adhesively bonded onto at least one side of the laminate.

公开(公告)号：EP0050694A3

公开(公告)日：1982-08-11

申请号：EP80303822

申请日：1980-10-28

Applicant: LCOA LAMINATING COMPANY OF AMERICA

Inventor： Block, James P.

IPC: H05K13/00

CPC classification number: B32B15/10 ,  B32B7/12 ,  B32B15/20 ,  B32B2262/101 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0214

Abstract: An entry material for use in drilling circuit boards to avoid marring of such boards comprises a wood pulp-glass composite substrate (14) having aluminum foil (15, 16) bonded to the opposite surfaces thereof. This entry material is relatively economical and has a stiffness sufficient to avoid upward bending or "oil canning" when pressure feet spaced from the drill are employed to hold the workpiece during drilling and further has enough strength to withstand high torsional drill forces with drills operating for high rates of material removal. The double layers of foil separated by the low heat conductive substrate material affords a pair of heat sinks which more effectively can carry away heat from the drill.

公开(公告)号：EP0032931A1

公开(公告)日：1981-08-05

申请号：EP80901515.0

申请日：1980-07-28

Applicant: LCOA LAMINATING COMPANY OF AMERICA

Inventor： BLOCK, James P.

IPC: B32B15 ,  B23B35 ,  B32B43 ,  H05K3 ,  H05K1

CPC classification number: H05K3/0047 ,  B23B35/005 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0214 ,  Y10T83/9309 ,  Y10T408/03

Abstract: Un materiau d'entree utilise dans le percage de plaques de circuits pour eviter l'endommagement de ces plaques comprend un substrat composite de verre-pate a bois (14) ayant des feuilles d'aluminium (15, 16) liees sur leurs surfaces opposees. Ce materiau d'entree est relativement economique et possede une durete suffisante pour eviter le pliage vers le haut lorsque des pieds de pression espaces du foret sont utilises pour tenir la piece a usiner pendant le percage et possede une resistance suffisante pour supporter des grandes forces de torsion dues au percage lorsque les forets tournent a des vitesses elevees d'enlevement de materiau. Les doubles couches de feuilles separees par le materiau du substrat de faible conduction thermique forment une paire d'evacuateurs de chaleur qui permettent de refroidir plus efficacement la chaleur du foret.

公开(公告)号：EP0031852A4

公开(公告)日：1981-05-15

申请号：EP80900418

申请日：1980-10-08

Applicant: KANEGAFUCHI CHEMICAL IND

Inventor： OIZUMI MASAYUKI ,  GOTO MASANA ,  AZUMI ICHIRO ,  UOZUMI SHOJI ,  UEKITA MASAKAZU ,  ABE MASAHARU DORUMI NADA - OIS ,  FUSHIKI YASUO ,  ISHIKI MINORU ,  KAWASAKI KUNIO

IPC: B32B38/08 ,  H05K1/03 ,  H05K3/02 ,  B32B15/08

CPC classification number: B32B38/08 ,  B32B5/26 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/72 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/068 ,  H05K2203/1476

Abstract: A method of and device for continuously fabricating a printed circuit laminate or electrically insulating laminate. The method comprises the steps of continuously conveying sheet-like substrates (6) impregnated with a thermosetting resin liquid which produces almost no by-products such as gas, liquid, etc. during the hardening reaction process, laminating the substrates (6), applying coatings (11) to both sides of the laminated substrates at the same time as the laminating step or thereafter, and then allowing the resin to set without the application of pressure.

公开(公告)号：EP2799493B1

公开(公告)日：2018-07-04

申请号：EP11878850.4

申请日：2011-12-29

Applicant: Shengyi Technology Co., Ltd

Inventor： MENG, Yundong ,  FANG, Kehong

IPC: C08L71/12 ,  C08L63/00 ,  C08L79/04 ,  B32B17/04 ,  B32B19/02 ,  C08J5/24 ,  C08K5/5313 ,  C08L79/00

CPC classification number: C08L79/00 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08J2479/00 ,  C08K5/5313 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2205/03 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T428/31522 ,  Y10T442/20 ,  C08L79/04

Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

公开(公告)号：EP3148299A1

公开(公告)日：2017-03-29

申请号：EP16191243.1

申请日：2016-09-28

Applicant: Simoldes Plasticos, SA

Inventor： MAGALHÃES RIBEIRO DA CUNHA MELO, Sandra Rafaela ,  ALVES DA SILVA, Ana Sofia ,  SIMÕES COSTA, Hugo Filipe ,  GONÇALVES, António Miguel ,  OLIVEIRA DA SILVA, José Fernando ,  DE CARVALHO GOMES, João Manuel ,  TRINDADE MORGADO RODRIGUES, Lúcia ,  CAMPOS DE OLIVEIRA, Cristina Manuela ,  DE SOUSA BESSA SOARES, João Luís

IPC: H05K1/03 ,  B29C45/14 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0058 ,  B29C45/14655 ,  B29C45/14811 ,  B29L2031/3005 ,  B29L2031/3481 ,  H05K1/038 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/10106 ,  H05K2203/1327

Abstract: The present disclosure relates to a multi-layered textile structure with printed electronic circuits, in particular for lighting and sensing performances for the interior of a vehicle, skilled to be moulded into a high quality component by injection process or used in injected thermoplastic component coverings. The present disclosure also relates to the processes to obtain the novel multi-layered textile structure and final articles.
The present disclosure can have several applications namely for a new sensorized and lighting articles, in particular articles for the automotive industry.

Abstract translation: 本公开涉及具有印刷电子电路的多层纺织结构，特别是用于车辆内部的照明和感测性能，熟练地通过注射方法模制成高质量部件或用于注射的热塑性部件覆盖物中。 本公开还涉及获得新型多层织物结构和最终制品的方法。 本公开可以具有几个应用，即用于新的传感和照明制品，特别是用于汽车工业的制品。

公开(公告)号：EP2799493A4

公开(公告)日：2015-12-23

申请号：EP11878850

申请日：2011-12-29

Applicant: SHENGYI TECHNOLOGY CO LTD

Inventor： MENG YUNDONG ,  FANG KEHONG

IPC: C08L71/12 ,  B32B17/04 ,  B32B19/02 ,  C08J5/24 ,  C08K5/5313 ,  C08L63/00 ,  C08L79/00 ,  C08L79/04

CPC classification number: C08L79/00 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08J2479/00 ,  C08K5/5313 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2205/03 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T428/31522 ,  Y10T442/20 ,  C08L79/04

Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

公开(公告)号：EP2711399B1

公开(公告)日：2014-12-31

申请号：EP13764808.5

申请日：2013-03-15

Applicant: Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou

IPC: C08L101/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K7/14 ,  C08L77/00 ,  H05K1/03 ,  H05K3/10 ,  C08K9/02

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10°C/min, of 250°C or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.