公开(公告)号：EP1049362B1

公开(公告)日：2006-05-31

申请号：EP00108615.6

申请日：2000-04-20

Applicant: Würth Elektronik Rot am See GmbH & Co. KG

Inventor： Kostelnik, Jan, Dr.

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0204 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096

公开(公告)号：EP1659838A2

公开(公告)日：2006-05-24

申请号：EP05023557.1

申请日：2005-10-27

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Sugahara, Hiroto Brother Kogyo K.K.

IPC: H05K1/02

CPC classification number: H01L23/4006 ,  B41J2/14233 ,  B41J2002/14491 ,  B41J2202/08 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2023/4075 ,  H01L2023/4081 ,  H01L2224/16 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/053 ,  H05K2201/064 ,  H05K2201/10409 ,  H05K2201/1056

Abstract: An electronic part-mounted substrate (1) includes a plate made of metal, an insulating material layer (4) which is formed of a ceramic material on a surface of the plate and which has a surface provided with a heat generating IC (5,6) thereon, and a thermal conductive member which is provided on a surface of IC. The heat, which is generated by IC (5,6) , is transmitted via the thermal conductive member (80) to the insulating material layer (4) and the plate, and the heat is dissipated to the outside. The heat generated by the electronic part can be dissipated more efficiently. The substrate is applicable to a liquid-jetting head.

公开(公告)号：EP1622199A3

公开(公告)日：2006-03-15

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/46 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：EP1626616A1

公开(公告)日：2006-02-15

申请号：EP05015217.2

申请日：2005-07-13

Applicant: Hitachi, Ltd.

Inventor： Kadoya, Kiyoomi c/o Hitachi, Ltd., Int. Prop. Gp. ,  Eguchi, Shuuji c/o Hitachi, Ltd., Int. Prop. Gp. ,  Sasaki, Masahiro c/o Hitachi, Ltd., Int. Prop. Gp. ,  Mayuzumi, Takuya c/o Hitachi, Ltd., Int. Prop. Gp.

IPC: H05K7/20

CPC classification number: H05K7/20872 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2203/1316

Abstract: The invention relates to an engine control circuit device which has higher heat resistance and can be installed in a place exposed to severe thermal environments. In an engine control circuit device comprising a circuit board (2) on which a plurality of packaged electronic parts (1) are mounted, and a connector (3) mounted on the circuit board for connection to an external circuit, the device further comprises a resin portion (4) formed of a thermo-setting resin and covering the connector (3) except for a connecting portion thereof and the circuit board (2), and a cooling pipe (5) integrally molded in the resin portion (4) and allowing a coolant to flow through it, thereby cooling the resin portion (4).

Abstract translation: 本发明涉及一种发动机控制电路装置，其具有较高的耐热性并且可以安装在暴露于严酷的热环境的地方。 在包括安装有多个封装电子部件（1）的电路板（2）和安装在电路板上用于连接到外部电路的连接器（3）的发动机控制电路装置中，该装置还包括： 树脂部分（4）由热固性树脂形成并且覆盖除了连接部分之外的连接器（3）和电路板（2），以及一体地模制在树脂部分（4）中的冷却管（5）和 允许冷却剂流过其中，从而冷却树脂部分（4）。

公开(公告)号：EP1599081A2

公开(公告)日：2005-11-23

申请号：EP05253019.3

申请日：2005-05-17

Applicant: RAYTHEON COMPANY

Inventor： Barson, George F. ,  Weber, Richard M. ,  Haws, James L.

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/0058 ,  H05K2201/064 ,  H01L2924/00

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components (102) includes a plastic coldplate (100) having a mounting surface for mounting one or more electronic components (102), one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate (100), and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface (102). The highly conductive material is operable to transfer heat from the mounting surface (102) to the fluid flow.

公开(公告)号：EP0844808B1

公开(公告)日：2003-08-13

申请号：EP97120236.1

申请日：1997-11-19

Applicant: ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH

Inventor： Süllau,Walter ,  Ilgen,Hermann ,  Schütze,Jörg

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K7/20254 ,  H05K1/0272 ,  H05K2201/064

公开(公告)号：EP0922379A4

公开(公告)日：2000-07-26

申请号：EP98909041

申请日：1998-03-09

Applicant: MOTOROLA INC

Inventor： DENNEY DONALD L JR ,  PAIS MARTINHO R

IPC: H01L23/473 ,  H05K1/18 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0272 ,  H05K1/189 ,  H05K7/20345 ,  H05K7/20927 ,  H05K2201/051 ,  H05K2201/064 ,  H05K2201/09109 ,  Y10S165/908 ,  H01L2924/00

Abstract: The apparatus includes a flexible printed wiring device (18) having a region sized to receive the electronic component (10) and a channel (28) disposed within the flexible printed wiring device. The channel has an inlet end (32) and an outlet end (34) and has an orifice (36) disposed therein. The inlet end receives a fluid, the fluid is distributed to the orifice via the channel and the orifice directs the fluid towards the region, so that the fluid is in direct contact with the electronic component when the electronic component is disposed in the region.

公开(公告)号：EP0527980A1

公开(公告)日：1993-02-24

申请号：EP92904744.0

申请日：1992-02-21

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco ,  FREI, Alexandra

IPC: B01D39 ,  B01D67 ,  B01D69 ,  B07B1 ,  B81B1 ,  G02B6 ,  H05K3 ,  H05K1

CPC classification number: B07B1/4618 ,  B01D39/1692 ,  B01D67/0034 ,  B01D69/12 ,  B01D2323/345 ,  B07B1/4663 ,  G02B6/122 ,  G02B6/4228 ,  G02B6/423 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0041 ,  H05K3/42 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/09509 ,  H05K2203/0554

Abstract: Afin de produire un microtamis déterminé ayant un grand nombre de passages de n'importe quelle forme voulue agencés de manière précise, on recouvre une feuille mince (2) en matière plastique d'une couche de matériau (2, 2') résistant à la morsure. On forme ensuite, par attaque, des évidements (4, 4') dans ladite couche (2, 2'), aux endroits où les passages doivent être formés. Pendant une autre étape du procédé, les passages (5) sont produits par un procédé d'attaque au plasma. En outre, on introduit des conduits (K, L) dans la couche de couverture (2, 2'), que ce soit sous forme de canaux (K) ou sous forme de pistes solides (L). On superpose plusieurs microtamis (S1, S2) afin de former un corps composite déterminé. Les couches superposées sont orientées en fonction des conduits (5, K, L), de sorte que ceux-ci soient réticulés dans les directions x, y et z. Des exemples d'application sont des diaphragmes de conduite de fluides, des multicouches conductrices d'électricité, des microsystèmes réticulés de guides d'ondes lumineuses.

公开(公告)号：EP0456423A3

公开(公告)日：1992-08-26

申请号：EP91304013.5

申请日：1991-05-03

Applicant: AT&T Corp.

Inventor： Azar, Kaveh

IPC: H05K7/20

CPC classification number: H05K7/20345 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/09063 ,  Y10S165/908 ,  Y10S428/901 ,  H01L2924/00

Abstract: Disclosed is a means for cooling heat generating components (14, 16) mounted on the front surface (12) of printed circuit boards. A conduit member (31) is attached to the back surface of the board to form a sealed plenum and to provide direction of cooling fluid toward the components. Holes (18) in the board establish cooling jets directed at the components from the plenum.

Abstract translation: 公开了一种用于冷却安装在印刷电路板的前表面（12）上的发热部件（14,16）的装置。 导管构件（31）附接到板的后表面以形成密封的增压室并且朝向部件提供冷却流体的方向。 板上的孔（18）建立了来自气室的组件的冷却喷气。

公开(公告)号：EP0238915B1

公开(公告)日：1992-01-29

申请号：EP87103231.4

申请日：1987-03-06

Applicant: Dyconex AG

Inventor： Schmidt, Walter, Dr.

IPC: H05K1/14 ,  H05K1/18 ,  H05K7/10

CPC classification number: H05K1/147 ,  H05K1/0204 ,  H05K1/0272 ,  H05K1/0393 ,  H05K1/141 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/325 ,  H05K3/365 ,  H05K7/1053 ,  H05K2201/056 ,  H05K2201/064