公开(公告)号：EP1620714B1

公开(公告)日：2014-03-12

申请号：EP04759497.3

申请日：2004-04-14

Applicant: Senseonics, Incorporated

Inventor： COLVIN, Arthur, Earl, JR. ,  ZERWEKH, Paul, Samuel ,  LESHO, Jeffery, C. ,  LYNN, Robert William ,  LORENZ, Carrie, R. ,  O'CONNOR, Casey, J. ,  WALTERS, Steven, J.

IPC: G01N21/64 ,  A61B5/00

CPC classification number: A61B5/14556 ,  A61B5/0031 ,  A61B5/14532 ,  A61B5/1459 ,  A61B5/681 ,  G01N21/6428 ,  G01N21/645 ,  G01N2201/1244 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/403 ,  H05K2201/086 ,  H05K2201/09972 ,  H05K2201/10106

Abstract: The present invention provides systems and methods for attenuating the effect of ambient light on optical sensors and for measuring and compensating quantitatively for the ambient light.

公开(公告)号：EP2643795A1

公开(公告)日：2013-10-02

申请号：EP11793657.5

申请日：2011-11-23

Applicant: Giesecke & Devrient GmbH

Inventor： BALDISCHWEILER, Michael

IPC: G06K19/067 ,  H05K3/10 ,  H01F41/04 ,  H01F17/00 ,  H01L21/67

CPC classification number: G06K19/067 ,  H01F41/046 ,  H01F2017/0066 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/105 ,  H05K2201/0215 ,  H05K2201/086 ,  H05K2203/107 ,  H05K2203/1131

Abstract: The invention relates to a conductor track arrangement for a portable data storage medium consisting of a substrate (1) and a conductor track structure (2) which is formed directly in the substrate (1). The substrate (1) has a non-conductive ferrite layer, in which the conductor track structure (20) is formed in accordance with a layout, by structure changing by means of laser radiation.

公开(公告)号：EP2568781A1

公开(公告)日：2013-03-13

申请号：EP12183237.2

申请日：2012-09-05

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Klein, Philippe

IPC: H05K1/16 ,  H01F27/28 ,  H01F17/00

CPC classification number: H05K1/165 ,  H01F17/0033 ,  H01F27/2804 ,  H05K2201/086 ,  H05K2201/10151

Abstract: Circuit imprimé dans lequel une superposition, dans un plan parallèle aux couches de métallisation, de pistes conductrices (90, 92, 114, 116, 130, 132, 140, 142, 150, 152) d'une bobine, réalisées dans une première et une seconde couches de métallisation immédiatement consécutives dans une direction verticale, forme un motif présentant deux symétries axiales par rapport à des axes X et Y, ces axes X et Y étant orthogonaux entre eux et parallèles aux couches de métallisation, la ou les pistes conductrices de chacune des couches de métallisation superposées étant dépourvues, à elles seules, de symétrie axiale par rapport à l'axe X ou Y.

Abstract translation: 电路板具有通过电绝缘层彼此机械分离的金属化层。 垂直测量线圈和垂直补偿线圈包括由导电轨道（90,92,114,116,130,132,140,​​142,150,152）形成的匝。 轨道叠加在金属化层中以形成相对于X轴和Y轴（52,54）具有两个轴向对称的图案。 轴彼此正交并平行于金属化层。 叠加的金属化层的导电轨迹相对于轴不具有轴对称性。 磁场传感器还包括独立权利要求。

公开(公告)号：EP1484773B1

公开(公告)日：2012-11-28

申请号：EP04253343.0

申请日：2004-06-04

Applicant: M/A-COM Technology Solutions Holdings, Inc.

Inventor： de Bhailis, Deirdre Anne ,  Keeney, Bill Allen

IPC: H01F21/06 ,  H01F17/00 ,  H03H7/01 ,  H05K1/16

CPC classification number: H01F17/0006 ,  H03H7/0115 ,  H03H7/0123 ,  H03H2001/0078 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2203/171

公开(公告)号：EP2166826B1

公开(公告)日：2011-08-24

申请号：EP09016073.0

申请日：1999-05-27

Applicant: DET International Holding Limited

Inventor： Jitaru, Ionel

IPC: H05K1/14 ,  H05K1/16

CPC classification number: H05K1/165 ,  H01F27/06 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/05 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09572 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49165

公开(公告)号：EP2277179A1

公开(公告)日：2011-01-26

申请号：EP09749972.7

申请日：2009-03-05

Applicant: Nokia Corporation

Inventor： SEPPÄLÄ, Eira ,  HEINO, Markku ,  OKSANEN, Markku ,  LEHTINIEMI, Reijo ,  IKONEN, Pekka ,  POHJAKALLIO, Maija ,  JOHANS, Christoffer ,  RAS, Robin ,  TIMONEN, Jaakko

IPC: H01F1/00 ,  H05K3/30 ,  C08J3/24 ,  C08J3/12 ,  H01Q1/12 ,  H01L23/29 ,  H01L21/56 ,  C08K3/08 ,  C08K3/22

CPC classification number: H01F1/44 ,  B05D3/06 ,  C08J3/24 ,  C08K3/08 ,  C08K3/22 ,  H01F1/28 ,  H01L21/563 ,  H01L23/295 ,  H01L23/552 ,  H01L23/645 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/83222 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q9/0407 ,  H01Q9/0421 ,  H05K1/0233 ,  H05K3/305 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2203/101 ,  H05K2203/104 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/249986 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31938 ,  Y10T428/32 ,  H01L2924/00

Abstract: A material contains a curable liquid polymer containing suspended nanoparticles capable of exhibiting a magnetic property. The nanoparticles are present in a concentration sufficient to cause the curable liquid polymer to flow in response to application of a magnetic field, enabling the material to be guided into narrow regions to completely fill such regions prior to the polymer being cured. A method includes applying a filler material to at least one component, the filler material including a heat curable polymer containing nanoparticles, and applying an electromagnetic field to at least part of the filler material. The nanoparticles contain a core capable of experiencing localized heating sufficient to at least partially cure surrounding polymer. Also disclosed is an assembly for use at radio frequencies. The assembly includes a substrate and at least one component supported by the substrate. The substrate contains a thermoplastic or thermoset polymer with suspended nanoparticles capable of exhibitinga magnetic property. The nanoparticles are of a type and have a concentration in the polymer selected to provide a certain dielectric permittivity, magnetic permeability and dissipation factor.

公开(公告)号：EP1863043A3

公开(公告)日：2009-05-13

申请号：EP07009030.3

申请日：2007-05-04

Applicant: ORION ELECTRIC CO., Ltd.

Inventor： Oda, Takato

IPC: H01F17/06 ,  H01F27/06

CPC classification number: H01F27/06 ,  H01F17/06 ,  H01F2017/065 ,  H01F2027/065 ,  H05K1/0233 ,  H05K3/301 ,  H05K2201/086 ,  H05K2201/10356 ,  H05K2201/10446

Abstract: To mount a ferrite core (9) stably without damaging a cable (13), a mounting structure of the ferrite core (9) includes an outer-circumferential-side holding member (4, 17) for supporting an outer circumferential face (11) of the ferrite core (9), and an inner-circumferential-side holding member (5, 18) for supporting an inner circumferential face (12). At least one of the outer-circumferential-side holding member (4, 17) and the inner-circumferential-side holding member (5, 18) is formed to extend in an axial direction of the ferrite core so that it can deflect by elastic deformation, thereby the outer-circumferential-side holding member and the inner-circumferential-side holding member nip the ferrite core while applying elastic force thereto.

公开(公告)号：EP2028664A1

公开(公告)日：2009-02-25

申请号：EP07745061.7

申请日：2007-06-12

Applicant: Murata Manufacturing Co. Ltd.

Inventor： NISHIZAWA, Yoshihiko

IPC: H01F17/00 ,  H01G4/12 ,  H05K3/46

CPC classification number: H05K3/4688 ,  B32B18/00 ,  C04B35/63 ,  C04B2235/663 ,  C04B2235/9607 ,  C04B2237/32 ,  C04B2237/34 ,  C04B2237/582 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/72 ,  H01F17/0006 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01L23/15 ,  H01L23/49822 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/086 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A multilayer ceramic electronic component including a ferrite ceramic laminate having a multilayer structure is disadvantageously brittle because of a fundamental feature of ferrite.
A ceramic laminate (5) is constituted by a ceramic base layer (2) and ceramic auxiliary layers (3 and 4) arranged on both main surfaces of the ceramic base layer (2), the ceramic base layer (2) and the ceramic auxiliary layers (3 and 4) being formed by co-firing. The ceramic base layer (2) and the ceramic auxiliary layers (3 and 4) are composed of ferrite materials having the same compositional system and have substantially the same crystal structure. The linear expansion coefficient of the ceramic auxiliary layers (3 and 4) is smaller than the linear expansion coefficient of the ceramic base layer (2).

Abstract translation: 由于铁素体的基本特征，包括具有多层结构的铁氧体陶瓷层叠体的多层陶瓷电子部件不利地是脆性的。 陶瓷层叠体（5）由陶瓷基层（2）和配置在陶瓷基层（2），陶瓷基层（2）和陶瓷辅助层（2）的两个主表面上的陶瓷辅助层 层（3和4）通过共烧形成。 陶瓷基层（2）和陶瓷辅助层（3和4）由具有相同组成系统的铁氧体材料组成并且具有基本上相同的晶体结构。 陶瓷辅助层（3和4）的线膨胀系数小于陶瓷基层（2）的线性膨胀系数。

公开(公告)号：EP1991039A2

公开(公告)日：2008-11-12

申请号：EP07715048.0

申请日：2007-02-28

Applicant: Daikin Industries, Ltd.

Inventor： OKANO, Takashi

IPC: H05K1/02 ,  H05K3/46 ,  H05K9/00

CPC classification number: H05K1/0231 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H05K1/0216 ,  H05K1/0233 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/09281 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00012

Abstract: The present invention provides a device in which the noise flowing in power-supply terminals is prevented from leaking to a power supply. One end (r20) of a power-supply bus (2) is connected to a power supply (Vc) through a ferrite bead (3). The power-supply bus (2) is connected to power-supply terminals (P11, P21, P31, P41). The power-supply terminals (P11, P21, P31, P41) are connected at positions (r24, r23, r22, r21) in such a manner that a terminal with a higher intensity (a1 to a4) is connected closer to the other end (r201) of the power-supply bus (2). Ground terminals (P12, P22, P32, P42) are connected to ground. Capacitors (C1 to C4) are bypass capacitors or decoupling capacitors, for example, and connected between respective power-supply terminals (P11, P21, P31, P41) and ground.

Abstract translation: 本发明提供一种防止在电源端子中流动的噪声泄漏到电源的装置。 电源总线（2）的一端（r20）通过铁氧体磁珠（3）与电源（Vc）连接。 电源总线（2）连接到电源端子（P11，P21，P31，P41）。 电源端子（P11，P21，P31，P41）在位置（r24，r23，r22，r21）处连接，使得强度较高的端子（a1〜a4）更靠近另一端 （r201）的电源总线（2）。 接地端子（P12，P22，P32，P42）接地。 例如，电容器（C1至C4）是旁路电容器或去耦电容器，并连接在相应的电源端子（P11，P21，P31，P41）和接地之间。

公开(公告)号：EP1642379B1

公开(公告)日：2008-09-17

申请号：EP04766121.0

申请日：2004-07-02

Applicant: Continental Automotive GmbH

Inventor： GOTTMANN, Wolfgang ,  KIRCHBERGER, Michael

IPC: H02K11/02

CPC classification number: H02K11/026 ,  H02K11/00 ,  H02K11/024 ,  H05K1/0233 ,  H05K2201/086

Abstract: The invention relates to a circuit arrangement and a switching module, in which an attenuator (7) is, for EMV suppression of a DC motor (1), connected to the lines (4) of the DC motor (1). The attenuator (7) comprises a ferrite, particularly a common mode ferrite (9).

Abstract translation: 本发明涉及电路装置和开关模块，其中衰减器用于直流电动机的EMV抑制，连接到直流电动机的线路。 衰减器包括铁氧体，特别是共模铁氧体。