公开(公告)号：EP3126851A1

公开(公告)日：2017-02-08

申请号：EP15713895.9

申请日：2015-04-02

Applicant: Feinmetall GmbH

Inventor： EKIN, Cetin

IPC: G01R1/04 ,  G01R31/28 ,  G01R1/073 ,  H01R12/71 ,  H01R12/91 ,  H05K3/12 ,  H05K3/46 ,  H05K1/16 ,  H05K1/11 ,  G01R1/067

CPC classification number: G01R1/07371 ,  G01R1/0491 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2889 ,  H01L21/67288 ,  H01R12/714 ,  H01R12/91 ,  H05K1/0296 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/1241 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4664 ,  H05K3/4673 ,  H05K2201/0187 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/0126 ,  H05K2203/159

Abstract: The invention relates to a contact-distance transformer (4) of an electrical testing device (1) for testing an electrical test item (7), in particular wafers (8), said contact-distance transformer (4) being suitable for reducing the distance between electrical contacts (16, 19) arranged next to one another, and having a non-electrically conductive carrier structure (28) occupying a first side (17) and a second side (18), wherein first electrical contacts (16) are arranged on the first side (17) at a contact distance (a) to one another, and second electrical contacts (19) are arranged on the second side (18) at a smaller contact distance (b) to one another in relation to the first contacts (16) of the first side (17), wherein the first contacts (16) are connected to the second contacts (19) via electrical connections (20) which are passing through the carrier structure (28) and/or which are arranged on the carrier structure (28). According to the invention, both the carrier structure (28) and the electrical connections (20) are formed as 3D-printed components (27). The invention also relates to an electrical testing device (1), and a method for producing a contact-distance transformer (4).

Abstract translation: 电检测装置的电检体的检测的接触距离变压器：诸如晶片，用于降低邻近电触头之间的距离，具有带有第一侧与第一电接触的非导电性的支撑结构的变压器定位开的 第一距离和与第二电触点的第二侧面定位开的第二，较小的距离。 所述第一触点连接到通过穿过支撑结构和/或其中的电连接的第二触点在所述支撑结构被定位。

公开(公告)号：EP2954762A4

公开(公告)日：2016-12-14

申请号：EP14749472

申请日：2014-02-05

Applicant: UNIV ILLINOIS ,  UNIV NORTHWESTERN

Inventor： ROGERS JOHN A ,  XU SHENG ,  FAN JONATHAN A ,  HUANG YONGGANG ,  ZHANG YIHUI ,  JIA LIN

IPC: H05K1/03 ,  H01L23/14 ,  H01L23/498 ,  H05K1/02

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15747 ,  H05K2201/09263 ,  H01L2924/00

Abstract: The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

公开(公告)号：EP2954762A2

公开(公告)日：2015-12-16

申请号：EP14749472.8

申请日：2014-02-05

Applicant: The Board of Trustees of the University of Illinois ,  Northwestern University

Inventor： ROGERS, John A. ,  XU, Sheng ,  FAN, Jonathan A. ,  HUANG, Yonggang ,  ZHANG, Yihui ,  JIA, Lin

IPC: H05K1/03

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15747 ,  H05K2201/09263 ,  H01L2924/00

Abstract: The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

Abstract translation: 本发明提供了电子系统，包括器件阵列，其包括通过一个或多个容纳室至少部分封闭的功能器件和/或器件部件，使得器件和/或器件部件 ）至少部分地并且任选地完全浸入容纳流体中。 用于本发明的电子装置的容纳室中的有用的容纳液包括润滑剂，电解质和/或电阻性流体。 在一些实施例中，例如，本发明的电子系统包括一个或多个电子设备和/或设备组件，这些电子设备和/或设备组件以独立和/或系留配置的形式提供，其将来自于自由空间的支撑衬底的变形，拉伸或压缩， 站立或系留设备或设备组件。

公开(公告)号：EP2954551A1

公开(公告)日：2015-12-16

申请号：EP14748754.0

申请日：2014-02-05

Applicant: The Board of Trustees of the University of Illinois ,  North Western University

Inventor： ROGERS, John A ,  FAN, Jonathan ,  YEO, Woon-Hong ,  SU, Yewang ,  HUANG, Yonggang ,  ZHANG, Yihui

IPC: H01L23/14 ,  H01L21/00 ,  H01L31/00 ,  H01L29/06 ,  H05K1/00 ,  B81C1/00

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15747 ,  H05K2201/09263 ,  H01L2924/00

Abstract: The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

公开(公告)号：EP2928271A1

公开(公告)日：2015-10-07

申请号：EP14163552.4

申请日：2014-04-04

Applicant: Clothing Plus MBU Oy

Inventor： Ilkko, Aino-Maria ,  Malmivaara, Heidi ,  Jaakkola, Heikki ,  Myry, Manu

IPC: H05K1/02

CPC classification number: H05K1/0283 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/038 ,  H05K3/22 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/09281 ,  Y10T29/49218

Abstract: A stretchable device (100) for transmitting signal between end points, such as a sensor and electronic unit, comprises a conductive element (101), which is coupled with a supporting structure (102) by introducing said conductive element (101) successively through the thickness of said supporting structure (102) to the first (102a) and second (102b) side of said supporting structure, thereby providing a corrugated structure for said conductive element, which is configured to be straighten out at least partially during stretching said device in its longitudinal direction. The conductive element (101) is coupled with said supporting structure (102) between first (104a) and second (104b) outer layers thereby providing the stretchable device (100).

Abstract translation: 用于在诸如传感器和电子单元的端点之间传输信号的可拉伸装置（100）包括导电元件（101），其通过将所述导电元件（101）连续地引入所述导电元件（101）而与支撑结构（102）耦合， 所述支撑结构（102）的厚度到所述支撑结构的第一（102a）和第二（102b）侧，从而为所述导电元件提供波纹状结构，其被构造成在拉伸所述装置期间至少部分地伸直 其纵向方向。 导电元件（101）与第一（104a）和第二（104b）外层之间的所述支撑结构（102）联接，从而提供可拉伸装置（100）。

公开(公告)号：EP2826346A1

公开(公告)日：2015-01-21

申请号：EP13712380.8

申请日：2013-03-14

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO ,  IMEC

Inventor： VAN HECK, Gerardus Titus ,  DE KOK, Margaretha Maria

IPC: H05K1/02

CPC classification number: H05K1/111 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K1/189 ,  H05K3/301 ,  H05K13/00 ,  H05K2201/09263 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/10962 ,  Y10T29/49002

Abstract: The present invention pertains to a submount (1) for mechanically and electrically coupling an electronic component (4) to a carrier (6). The submount (1) has a mounting portion (10) for mounting the submount to the carrier and has attachment portions (12a, 12b, 12c, 12d) for holding the electronic component. The submount further has primary electric contacts (14a, 14b) for cooperation with respective electrical conductors (61a, 61b) in the carrier, and secondary electric contacts (16a, 16b, 16c) for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions (18a, 18b, 18c) that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.

公开(公告)号：EP2824622A2

公开(公告)日：2015-01-14

申请号：EP14176231.0

申请日：2014-07-09

Applicant: Compagnie Industrielle et Financière d'Ingénierie "Ingenico"

Inventor： Georges, Didier ,  Wolff, Caroline ,  Lebonnois, Etienne ,  Estorges, Stéphane

IPC: G06Q20/00 ,  G07G1/12 ,  G07G1/00 ,  B65D55/06 ,  H05K5/00

CPC classification number: H05K1/0275 ,  H05K1/0224 ,  H05K1/0281 ,  H05K2201/09263

Abstract: L'invention se rapporte à un circuit imprimé (Cl) comprenant au moins une partie flexible.
Selon l'invention, ladite partie flexible (PF) comprend au moins une couche, dite couche de transport (CT) comprenant au moins une piste de cuivre de transmission de signal (P1, P2, P3, PdG, PdD), et au moins une couche de support (CS), ladite au moins une couche de support (CS) comprenant au moins une piste faisant office de plan de masse (PM) et au moins une piste de protection (TS) d'au moins une desdites pistes de transmission de signal.

Abstract translation: 本发明涉及包括至少一个柔性部分的印刷电路（C1）。 根据本发明，所述柔性部分（FP）包括至少一个层，所述传输层（CT），包括至少一个信号传输铜轨道（P1，P2，P3时，PDG，PDD），和至少 （CS），所述至少一个支撑层（CS）包括充当接地平面（PM）的至少一个轨道和至少一个所述轨道的至少一个保护轨道（TS）;以及其中， 信号传输。

公开(公告)号：EP2793537A1

公开(公告)日：2014-10-22

申请号：EP14160091.6

申请日：2014-03-14

Applicant: Johnson Electric S.A.

Inventor： Salle, Vincent Daniel Jean ,  Edmonds, Martin Wallace

IPC: H05K1/02 ,  E05B73/00 ,  G08B13/24 ,  H05K1/09

CPC classification number: G06K19/02 ,  G06F21/86 ,  G08B13/2434 ,  H05K1/0275 ,  H05K1/0386 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09445

Abstract: An electronic device is protected from unauthorized access by use of a security wrap having a security screen (26) connected to an alarm circuit (17) of the electronic device. The security screen (26) has a pair of screen terminals (48) interconnected by a conductor (46). The conductor (46) is formed on a substrate (22). The substrate (22) is arranged such that attempts to remove the security wrap will result in the substrate (22) being torn and the conductor (46) being damaged or broken whereby the resistance of the conductive path formed by the conductor (46) changes to indicate an alarm condition.

Abstract translation: 通过使用具有连接到电子设备的警报电路（17）的安全屏幕（26）的安全保护装置来保护电子设备免受未经授权的访问。 安全屏幕（26）具有通过导体（46）互连的一对屏幕端子（48）。 导体（46）形成在基板（22）上。 衬底（22）被布置成使得尝试去除安全包装将导致衬底（22）被撕裂并且导体（46）被损坏或破坏，由此由导体（46）形成的导电路径的电阻改变 以指示报警状况。

公开(公告)号：EP2742784A1

公开(公告)日：2014-06-18

申请号：EP12778423.9

申请日：2012-08-30

Applicant: Koninklijke Philips N.V.

Inventor： DINGEMANS, Antonius Petrus Marinus

IPC: H05K3/20 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/303 ,  F21K9/90 ,  F21V21/002 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/202 ,  H05K13/046 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49144 ,  H01L2924/00

Abstract: There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

公开(公告)号：EP2690585A3

公开(公告)日：2014-02-26

申请号：EP13171784.5

申请日：2013-06-13

Applicant: FUJITSU LIMITED

Inventor： Matsumura, Takayoshi ,  Osaki, Noritsugu

IPC: G06K19/077

CPC classification number: G06K19/07749 ,  H05K1/0283 ,  H05K1/16 ,  H05K2201/09263 ,  H05K2201/10098

Abstract: An RFID tag includes: a base sheet in which a plurality of first slits are formed to extend alternately from two opposite sides from an end of the base sheet; an antenna pattern provided on the base sheet by folding the antennal pattern to avoid the first slits; an RFID chip provided over the base sheet and electrically connected to the antenna pattern; an elastic sheet provided over any one of a top surface and a bottom surface of the base sheet; and a protective sheet provided on a surface of the elastic sheet opposite to the surface that is in contact with the base sheet and including second slits formed to correspond in position to the first slits of the base sheet.