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    Radiation-sensitive compositions
    82.
    发明公开
    Radiation-sensitive compositions 失效
    Strahlungsempfindliche Zusammensetzungen。

    公开(公告)号：EP0565858A1

    公开(公告)日：1993-10-20

    申请号：EP93103750.1

    申请日：1993-03-09

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Knudsen, Philip D. ,  Shipley, Charles R. ,  Pai, Daniel Y.

    IPC: G03F7/033

    CPC classification number: G03F7/038 ,  G03F7/0045 ,  H05K3/287 ,  Y02P20/582 ,  Y10T428/24917

    Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions off the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

    Abstract translation: 辐射敏感组合物，使用组合物的方法和包含该组合物的制品。 本发明的可光成像组合物包含辐射敏感组分，树脂粘合剂和包含一个或多个内部环氧基团的聚丁二烯。 在优选的方面，本发明的组合物还包含交联剂，例如三聚氰胺或环氧化物质，或其混合物。

    Methods and apparatus for maintaining electroless plating solutions
    83.
    发明公开
    Methods and apparatus for maintaining electroless plating solutions 失效
    用于维持所述电金属化的溶液中的方法和装置。

    公开(公告)号：EP0564780A1

    公开(公告)日：1993-10-13

    申请号：EP93102058.0

    申请日：1993-02-10

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Storjohann, Donald E. ,  Wiberg, Sven J.

    IPC: C23C18/16 ,  G05D21/02

    CPC classification number: C23C18/1617 ,  C23C18/1683 ,  H05K3/187

    Abstract: Methods and apparatus for controlling plating rates of electroless plating solutions. The invention provides for continuous monitoring and replenishment of a one or more components of an electroless plating solution on a real time basis. The invention can be characterized in part by use of a quartz crystal microbalance.

    Abstract translation: 方法和设备控制的化学镀镀解决率。 本发明提供用于在实时的基础上化学镀溶液的一个或多个部件的连续监控和补充。 本发明可以部分地通过使用石英晶体微量天平的来表征。

    Radiation sensitive compositions and methods
    84.
    发明公开
    Radiation sensitive compositions and methods 失效
    Strahlungsempfindlic Zusammensetzungen und Verfahren。

    公开(公告)号：EP0537524A1

    公开(公告)日：1993-04-21

    申请号：EP92116406.7

    申请日：1992-09-24

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Thackeray, James W. ,  Lamola, Angelo A.

    IPC: G03F7/004

    CPC classification number: G03F7/0382 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/0226 ,  G03F7/038 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/40

    Abstract: The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.

    Abstract translation: 本发明提供辐射敏感组合物和方法，其包括用于提供增强分辨率的浮雕图像的新型装置。 在一个方面，本发明提供了一种控制光生酸扩散的方法，包括将极性化合物加入到辐射敏感组合物中，并将该组合物的一层施加到基底上; 将组合物层暴露于激活辐射，由此产生包含与极性化合物络合的酸部分的分布的潜像; 并处理暴露的组合物层以提供活化量的酸。

    Selective metallization process
    86.
    发明公开
    Selective metallization process 失效
    选择性金属化过程

    公开(公告)号：EP0483484A3

    公开(公告)日：1993-01-20

    申请号：EP91114755.1

    申请日：1991-09-02

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Gulla, Michael ,  Sricharoenchaikit, Prasit

    IPC: C23C18/16 ,  H05K3/18 ,  G03F7/20

    CPC classification number: G03F7/2022 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  H05K3/184 ,  H05K2203/0505 ,  H05K2203/0706 ,  H05K2203/1415

    Abstract: A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst (16) over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal (18) over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.

    Abstract translation: 一种用于选择性金属化的方法，包括以下步骤：提供涂覆有光致抗蚀剂的基底，通过暴露于图案辐射和显影，对光致抗蚀剂涂层进行曝光，将光致抗蚀剂涂层暴露于激活辐射，在整个成像的光致抗蚀剂涂层上沉积化学镀催化剂， 裸露的下面的衬底，通过显影去除暴露的暴露的催化的光致抗蚀剂涂层的顶表面，由此镀催化剂保持在所需的选择性图案中并且在催化表面上沉积金属以形成诸如电路图案的选择性图案的金属沉积物。 该方法适用于制造包括印刷电路板在内的多种制品。

    Coating processes and apparatus
    87.
    发明公开
    Coating processes and apparatus 失效
    Beschichtungsverfahren和Einrichtung。

    公开(公告)号：EP0505894A1

    公开(公告)日：1992-09-30

    申请号：EP92104580.3

    申请日：1992-03-17

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Sandock, Leonard Richard

    IPC: G03F7/16 ,  B05B15/02 ,  B05C5/02

    CPC classification number: B05C9/04 ,  B05C5/0254 ,  B05C5/0262 ,  B05C9/14 ,  B05C11/1039 ,  G03F7/16 ,  H05K3/0091 ,  H05K2203/1518 ,  H05K2203/1572 ,  H05K2203/159

    Abstract: Processes and apparatus for uniformly coating discrete substrates by application of a controlled volume of fluid per unit surface area of a substrate. In one aspect, the invention provides a process comprising providing a fluid reservoir; and flowing fluid from the fluid reservoir without substantial interruption through one or more fluid applicators, the fluid applied with a controlled volume per unit surface area of the substrate. The invention also provides processes for applying fluid on a discrete substrate by upwardly or laterally flowing the fluid onto the substrate, and processes for applying fluid onto at least two sides of a discrete substrate. The invention further provides fluid application apparatus which enable application of a uniform fluid layer, including apparatus that provides termination of fluid flow without fluid dripping or trailing of fluid.

    Abstract translation: 通过在衬底的每单位表面积上施加受控体积的流体来均匀地涂覆离散衬底的方法和设备。 一方面，本发明提供一种方法，包括提供流体储存器; 并且通过一个或多个流体施加器从流体储存器流动流体而没有实质的中断，所述流体以基板的每单位表面积施加受控的体积。 本发明还提供了通过将流体向上或横向流动到衬底上而在离散衬底上施加流体的方法，以及将流体施加到离散衬底的至少两侧上的过程。 本发明进一步提供了能够应用均匀流体层的流体施加装置，包括提供流体流动终止而不流体流体滴落或拖尾的装置。

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