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    Piezoresistive sensing structure
    81.
    发明公开
    Piezoresistive sensing structure 有权
    压阻传感器结构

    公开(公告)号：EP1721865A3

    公开(公告)日：2011-09-28

    申请号：EP06075963.6

    申请日：2006-04-28

    Applicant: Delphi Technologies, Inc.

    Inventor： Rich, David B. ,  Crist, Steven M.

    IPC: B81C1/00 ,  G01P15/12

    CPC classification number: B81C1/00142 ,  B81B2201/0235 ,  B81B2201/032 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C2201/016 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828

    Abstract: A technique for manufacturing a piezoresistive sensing structure (170) includes a number of process steps. Initially, a piezoresistive element (108) is implanted into a first side of an assembly (102,106,104A) that includes a semiconductor material (102,104A). A passivation layer (110A) is then formed on the first side of the assembly (102,106,104A) over the element (108). The passivation layer (110A) is then removed from selected areas on the first side of the assembly (102,106,104A). A first mask is then provided on the passivation layer (110A) in a desired pattern. A beam (152), which includes the element (108), is then formed in the assembly over at least a portion of the assembly (102,106,104A) that is to provide a cavity (103). The passivation layer (110A) provides a second mask, in the formation of the beam (152), that determines a width of the formed beam (152).

    MEM SWITCH AND METHOD FOR MANUFACTURING THE SAME
    84.
    发明公开
    MEM SWITCH AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    VERFAHREN ZU SEINER HERSTELLUNG的MEM-SCHALTER

    公开(公告)号：EP2276047A1

    公开(公告)日：2011-01-19

    申请号：EP09727218.1

    申请日：2009-03-30

    Applicant: Panasonic Electric Works Co., Ltd

    Inventor： YOSHIHARA, Takaaki ,  HAYASAKI, Yoshiki ,  SHIRAI, Takeo ,  MATSUSHIMA, Tomoaki ,  KAWADA, Hiroshi ,  HAGIHARA, Yousuke

    IPC: H01H59/00 ,  B81B3/00 ,  B81C1/00 ,  H01H49/00 ,  H01H57/00

    CPC classification number: B81B3/0021 ,  B81B2201/032 ,  H01H59/0009 ,  H01H2057/006 ,  Y10T29/42

    Abstract: The MEMS switch comprises a substrate with signal-lines having fixed-contacts, a movable-plate with a movable-contact, a flexible support-member supporting the movable-plate, a static-actuator and a piezoelectric-actuator configured to contact the movable-contact with the fixed-contact. The movable-contact is provided at its longitudinal center with the movable-contact, and its both the longitudinal ends with static-movable-electrode-plate. The support-member is four strips disposed on portions outside of the both width ends of the movable plate. The strip extends along the longitudinal direction of the movable plate, provided with a first end fixed to the movable plate, and provided with a second end fixed to the substrate. The piezoelectric-element is disposed on an upper surface of the strip to be located at a portion outside of the width ends of the movable-plate. The piezoelectric-actuator is configured to develop the stress applied to the coupling-portion which is created between each the strip and the movable-plate.

    Abstract translation: MEMS开关包括具有固定触点的信号线的基板，具有可移动触点的可移动板，支撑可移动板的柔性支撑构件，静止致动器和构造成接触可动触点的压电致动器 - 与固定联系人联系。 可动触点在其纵向中心设置有可动触点，并且其两个纵向端部具有静电可动电极板。 支撑构件是设置在可移动板的两个宽度端的外侧的四个条。 该条带沿可移动板的纵向方向延伸，设置有固定到可移动板的第一端，并且设置有固定到基板的第二端。 压电元件设置在条的上表面上，以位于可移动板的宽度端的外侧的部分。 压电致动器被构造成产生施加到在每个条和可移动板之间产生的联接部分的应力。

    MECHANICAL STRUCTURE INCLUDING A LAYER OF POLYMERISED LIQUID CRYSTAL AND METHOD OF MANUFACTURING SUCH
    88.
    发明授权
    MECHANICAL STRUCTURE INCLUDING A LAYER OF POLYMERISED LIQUID CRYSTAL AND METHOD OF MANUFACTURING SUCH 有权
    根据上述制造的聚合液晶层和过程的机械结构

    公开(公告)号：EP1714265B1

    公开(公告)日：2007-08-01

    申请号：EP05702811.0

    申请日：2005-01-27

    Applicant: Koninklijke Philips Electronics N.V.

    Inventor： BROER, Dirk, J. ,  DE WITZ, Christiane, M., R. ,  MOL, Grietje, N. ,  PENTERMAN, Roel

    IPC: G09F9/37 ,  B81B3/00 ,  B81B7/04 ,  G02B26/02

    CPC classification number: G02B26/02 ,  B81B3/0024 ,  B81B2201/032 ,  B81B2201/047 ,  Y10T156/11

    Abstract: A mechanical structure comprises an element which is moveable by non­mechanical means, such as heat or radiation, between a first state having a first shape and a second state having a second shape different. To this end, the element includes a layer of oriented polymerized liquid crystal which exhibits an anisotropic expansion when subjected to such means. In order to facilitate manufacture the element is positioned on a substrate which has a region of high adhesiveness and a region of low adhesiveness for polymerized liquid crystal. To manufacture such structures a layer of oriented polymerizable liquid crystal is formed on a substrate (201) which is provided with a patterned surface that provides adhesive regions (204) with high adhesiveness to polymerized liquid crystal and non­adhesive regions (203) with low adhesiveness to polymerized liquid crystal. After polymerization, for example a thermal shock is applied which causes the layer of polymerized liquid crystal to delaminate at the non-adhering region while remaining fixed to the adhesive regions. Thus, the method does not require time-consuming under-etching steps.

    Bi-directional released-beam sensor
    89.
    发明公开
    Bi-directional released-beam sensor 有权
    Biirektionaler传感器mit freischwingendem Ausleger

    公开(公告)号：EP1676810A1

    公开(公告)日：2006-07-05

    申请号：EP05257825.9

    申请日：2005-12-19

    Applicant: STMicroelectronics, Inc.

    Inventor： McAlexander, Joseph Colby

    IPC: B81B3/00 ,  G01P15/00

    CPC classification number: H01H35/14 ,  B81B2201/0235 ,  B81B2201/032 ,  B81C1/0015 ,  B81C2201/019 ,  G01P15/125 ,  G01P15/135 ,  G01P2015/0828 ,  H01H1/0036

    Abstract: An acceleration sensor includes a semiconductor substrate, a first layer formed on the substrate, a first aperture within the first layer, and a beam coupled at a first end to the substrate and suspended above the first layer for a portion of the length thereof. The beam includes a first boss coupled to a lower surface thereof and suspended within the first aperture, and a second boss coupled to an upper surface of the second end of the beam. A second layer is positioned on the first layer over the beam and includes a second aperture within which the second boss is suspended by the beam. Contact surfaces are positioned within the apertures such that acceleration of the substrate exceeding a selected threshold in either direction along a selected axis will cause the beam to flex counter to the direction of acceleration and make contact through one of the bosses with one of the contact surfaces.

    Abstract translation: 加速度传感器包括半导体衬底，形成在衬底上的第一层，第一层内的第一孔，以及在第一端处耦合到衬底并在其长度的一部分上悬挂在第一层上方的梁。 梁包括联接到其下表面并悬挂在第一孔内的第一凸台和联接到梁的第二端的上表面的第二凸台。 第二层位于横梁上的第一层上，并且包括第二孔，第二凸台由梁悬挂在该第二孔内。 接触表面定位在孔内，使得沿着所选择的轴线在任一方向超过选定阈值的基底的加速度将导致梁相对于加速方向弯曲并且通过其中一个凸起与其中一个接触表面 。

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