公开(公告)号：EP1843650A3

公开(公告)日：2007-11-07

申请号：EP07013524.9

申请日：1999-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Hirose, Naohiro ,  Noda, Kouta ,  Segawa, Hiroshi ,  En, Honjin ,  Tsukada, Kiyotaka ,  Ishida, Naoto ,  Asano, Kouji ,  Shouda, Atsushi

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multilayered printed circuit board comprising: a substrate (330) on which a conductive circuit (334) is formed; an interlayer insulating resin layer (350) formed on the conductive circuit (334); an opening (348) for forming a via hole (360) formed in the interlayer insulating resin layer (350); and another conductive circuit (358) including a via hole (360) and formed on the interlayer insulating resin layer (350), wherein
the surface of the conductive circuit (334) is subjected to a coarsening process using etching solution containing cupric complex and organic acid, and
stripe pits and projections are formed on the inner wall of the opening (348) for forming the via hole (360).

Abstract translation: 一种多层印刷电路板，包括：衬底（330），其上形成有导电电路（334）; 形成在导电电路（334）上的层间绝缘树脂层（350）; 用于形成层间绝缘树脂层（350）中形成的通路孔（360）的开口（348）; 以及形成在层间绝缘树脂层（350）上的包括通路孔（360）的另一导电电路（358），其中导电电路（334）的表面经受使用包含铜络合物和有机化合物的蚀刻溶液的粗化处理 酸，并且在用于形成通孔（360）的开口（348）的内壁上形成条纹凹凸。

公开(公告)号：EP1307075B1

公开(公告)日：2007-01-24

申请号：EP02023716.0

申请日：2002-10-23

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Nakagiri, Yasushi ,  Suzuki, Takeshi ,  Echigo, Fumio

IPC: H05K1/03 ,  H05K3/40 ,  B32B27/04 ,  C08J5/24

CPC classification number: B32B5/26 ,  B32B3/266 ,  B32B5/022 ,  B32B15/14 ,  B32B2250/05 ,  B32B2250/40 ,  H05K1/036 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10378 ,  H05K2203/0759 ,  H05K2203/1461 ,  Y10T428/24917 ,  Y10T428/249971

公开(公告)号：EP1273609B1

公开(公告)日：2006-08-09

申请号：EP01999592.7

申请日：2001-12-05

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： SATO, T., c/o MITSUI MINING & SMELTING CO., LTD ,  ASAI, T., c/o MITSUI MINING & SMELTING CO., LTD

IPC: C08G59/62 ,  C08L79/00 ,  B32B15/08 ,  B32B27/38 ,  H05K3/38

CPC classification number: H05K3/4655 ,  C08G59/4042 ,  C08L63/00 ,  H05K3/4652 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/16

Abstract: A resin compound for forming an interlayer insulating layer of a printed wiring board, characterized in that it comprises an epoxy resin containing as an epoxy resin curing agent having a nitrogen content of 5 to 25 wt % and a maleimide compound being curable with heat and contains no halogen elements. The resin compound can be used for producing a copper foil with a resin which is free of a halogen element and has high flame retardancy, and further exhibits excellent resistance to water and heat and good strength against peeling between the copper foil and a substrate.

公开(公告)号：EP1473328A4

公开(公告)日：2006-07-05

申请号：EP03737473

申请日：2003-02-04

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： FUJIWARA AKIHIKO ,  SHIBAYAMA KOICHI ,  DEGUCHI HIDENOBU

IPC: C08K3/00 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  C08L101/00 ,  B32B15/08

CPC classification number: H05K1/0373 ,  C08K3/01 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient ( alpha 2) of 1.0x10 Ä DEG C Ü or below over the temperature range from a temperature 10 DEG C higher than a glass transition temperature of the resin composition to a temperature 50 DEG C higher than the glass transition temperature of the resin composition.

Abstract translation: 优选机械特性，尺寸稳定性，耐热性，阻燃性等特别是高温特性优异的树脂组合物，基材，片材，层压体，带树脂铜箔，覆铜箔层压板，TAB用胶带， 印刷线路板，预浸料和粘合片。 该树脂组合物含有热塑性树脂100重量份和无机化合物0.1〜65重量份，平均线膨胀系数（α2）为1.0×10-3 [℃]以下， 从比树脂组合物的玻璃化转变温度高10℃的温度到比玻璃化转变温度高50℃的温度范围。

公开(公告)号：EP1121008A4

公开(公告)日：2005-02-02

申请号：EP99933214

申请日：1999-07-30

Applicant: IBIDEN CO LTD

Inventor： HIROSE NAOHIRO ,  NODA KOUTA ,  SEGAWA HIROSHI ,  EN HONJIN ,  TSUKADA KIYOTAKA ,  ISHIDA NAOTO ,  ASANO KOUJI ,  SHOUDA ATSUSHI

IPC: B23K26/38 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is made in a resin (20) with a laser to form a viahole. A copper foil (22) etched into a thin film (3 νm) to lower the heat conductivity is used as a conformal mask, thereby making an opening (20a) in the resin (20) by fewer times of irradiation with a pulse laser beam. This prevents formation of any undercut in the resin (20) on which an interlayer resin-insulating layer is to be formed, enabling improvement in the connection reliability of the viahole.

公开(公告)号：EP1035760B1

公开(公告)日：2004-12-22

申请号：EP00104843.8

申请日：2000-03-07

Applicant: SUMITOMO BAKELITE COMPANY LIMITED

Inventor： Komiyatani, Toshio, c/o Sumitomo Bakelite Co. Ltd. ,  Uesaka, Masao, c/o Sumitomo Bakelite Co. Ltd. ,  Arai, Masataka, c/o Sumitomo Bakelite Co. Ltd. ,  Kawaguchi, Hitoshi, c/o Sumitomo Bakelite Co. Ltd.

IPC: H05K3/46 ,  H05K3/38 ,  C09J181/00 ,  C09J163/00

CPC classification number: H05K3/4655 ,  H05K1/0333 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0358 ,  Y10S525/936 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31533

公开(公告)号：EP1432292A1

公开(公告)日：2004-06-23

申请号：EP02760590.6

申请日：2002-08-08

Applicant: Nikko Materials Company, Limited

Inventor： NATSUME, Takashi, c/o Nikko Materials Co., Ltd. ,  AKASE, Fumiaki, c/o Nikko Materials Co., Ltd.

IPC: H05K1/16 ,  H05K1/09 ,  H05K3/46 ,  B32B15/08

CPC classification number: H05K3/4626 ,  H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K3/025 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0152 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/24777 ,  Y10T428/24802 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: The present invention relates to a carrier-added copper foil and a print substrate using such copper foil characterized in comprising a resin layer and a functional material layer at least on a part of the copper foil. A carrier-added copper foil and a print substrate using such copper foil are obtained by forming an insulating layer and functional material layer having an area smaller than the area of the copper foil on the surface of the carrier-added copper foil with the screen printing method, thereby improving the handling of such copper foil, preventing the adhesion of contaminants such as resin powder on the copper foil surface during the cutting procedure, preventing scratches and dimples caused by foreign matter, and effectively preventing the generation of scratches, wrinkles and creases during the cutting, packaging and transportation procedures.

Abstract translation: 本发明涉及使用这种铜箔的载体添加铜箔和印刷基板，其特征在于至少在铜箔的一部分上包括树脂层和功能材料层。 使用这种铜箔的载体添加铜箔和印刷基板通过在载体添加的铜箔的表面上通过丝网印刷形成绝缘层和具有小于铜箔的面积的功能材料层而获得 方法，从而改善这种铜箔的处理，防止在切割过程中在铜箔表面上粘附诸如树脂粉末的污染物，防止由异物引起的刮痕和凹坑，并且有效地防止产生划痕，皱纹和褶皱 在切割，包装和运输过程中。

公开(公告)号：EP1260359A3

公开(公告)日：2003-11-26

申请号：EP02011363.5

申请日：2002-05-23

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Ilda, Takahisa, Sumitomo Bakelite Co. Ltd.

IPC: B32B31/08 ,  B32B31/20

CPC classification number: B32B15/14 ,  B32B7/14 ,  B32B15/04 ,  B32B15/20 ,  B32B27/08 ,  B32B37/203 ,  B32B38/0036 ,  B32B2038/0076 ,  B32B2305/076 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0358 ,  H05K2203/1545

Abstract: A method for manufacturing a laminated board having high quality with high productivity is disclosed. In this manufacturing method, a prepreg 2 that has been supplied from a prepreg supply section 1 is fed vertically using feed rolls. Further, metal foils 4 are supplied from a metal foil supply section 3 using feed rolls. The prepreg 2 and the metal foil 4 are heated at a heating section 7, and then they pass through between the rolls 5 so that the metal foils are bonded to the prepreg. Thus obtained laminated board is fed to a rolling section 6 using feed rolls, and the laminated is continuously rolled up at the rolling section 6, thereby continuously manufacturing the laminated board.

公开(公告)号：EP0843509B1

公开(公告)日：2003-08-27

申请号：EP95923582.1

申请日：1995-07-04

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： SATOH, Tetsurou ,  TSUYOSHI, Hiroaki ,  HAYASAKA, Nobuo

IPC: H05K3/46 ,  H05K3/38 ,  C09J163/00 ,  B32B15/08

CPC classification number: H05K3/386 ,  B32B15/08 ,  B32B15/20 ,  B32B27/38 ,  C08L63/00 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/12903 ,  Y10T428/31529 ,  Y10T428/31605 ,  Y10T428/31678 ,  C08L75/04 ,  C08L2666/02 ,  C08L2666/08 ,  C08L2666/04

Abstract: A resin-coated copper foil for multilayer printed wiring boards characterized by having a resin composition applied to one side thereof, wherein the composition comprises 50-90 wt.% of an epoxy resin, 5-20 wt.% of a polyvinyl acetal resin and 0.1-20 wt.% of a urethane resin, and wherein a rubber-modified epoxy resin accounts for 0.5-40 wt.% of the whole epoxy resin.

公开(公告)号：EP1310525A1

公开(公告)日：2003-05-14

申请号：EP02733251.9

申请日：2002-05-30

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： SATO, Tetsuro, MITSUI MINING & SMELTING CO., LTD. ,  ASAI, Tsutomu, MITSUI MINING & SMELTING CO., LTD. ,  MATSUSHIMA, Toshifumi, MITSUI M. & S. CO., LTD.

IPC: C08L63/00 ,  C08L101/00 ,  H05K1/03

CPC classification number: H05K3/4655 ,  B32B15/08 ,  C08L63/00 ,  C09D163/00 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0358 ,  Y10T428/31529 ,  C08L2666/02

Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition:

a. a high polymer having cross-linkable functional groups in the molecule, and a cross-linking agent therefor 5 to 30 parts by weight
b. an epoxy resin that is liquid at room temperature 5 to 30 parts by weight
c. a compound having the structure shown in Formula 1 40 to 90 parts by weight

   where R is H or

Abstract translation: 本发明的目的是提供一种用于制造印刷线路板的树脂涂覆铜箔，其特征在于阻燃性，树脂流动性，耐水性和剥离强度的总体平衡性优异。 树脂被覆铜箔包括在铜箔的一侧上的树脂层，其特征在于，树脂层包含具有以下组成的树脂组合物：a。 分子中具有交联性官能团的高分子，交联剂为5〜30重量份。 室温下为液体的环氧树脂5〜30重量份c。 具有式1所示结构的化合物40至90重量份其中R是H或