公开(公告)号：EP2220678A4

公开(公告)日：2012-04-25

申请号：EP08756454

申请日：2008-05-29

申请人： OCCAM PORTFOLIO LLC

发明人： FJELSTAD JOSEPH C

IPC分类号： H05K1/18 ,  H05K1/14

CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2263433A2

公开(公告)日：2010-12-22

申请号：EP09722935.5

申请日：2009-03-18

申请人： Occam Portfolio LLC

发明人： FJELSTAD, Joseph, C.

IPC分类号： H05K13/04

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/0278 ,  H05K3/1241 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2203/1469

摘要： A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

公开(公告)号：EP2220678A2

公开(公告)日：2010-08-25

申请号：EP08756454.8

申请日：2008-05-29

申请人： Occam Portfolio LLC

发明人： FJELSTAD, Joseph C.

IPC分类号： H01L23/48 ,  H05K3/32

CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

公开(公告)号：EP2353179A4

公开(公告)日：2012-10-03

申请号：EP09821348

申请日：2009-10-16

申请人： OCCAM PORTFOLIO LLC

发明人： FJELSTAD JOSEPH C

IPC分类号： H01L21/60

CPC分类号： H05K1/189 ,  H01L21/568 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09481 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T156/10 ,  Y10T156/1057 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2208223A4

公开(公告)日：2012-05-30

申请号：EP08781591

申请日：2008-07-10

申请人： OCCAM PORTFOLIO LLC

发明人： FJELSTAD JOSEPH C

IPC分类号： H05K1/18 ,  H01L23/538

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K1/185 ,  H05K3/06 ,  H05K3/061 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0355 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T428/24612 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.

摘要翻译： 一种用于制造电子部件和组件的组件的方法，其中电子部件具有部件端子。 提供具有第一侧和第二侧的导电孔。 然后使用各向异性导体将元件端子连接到穹顶的第一侧。 一种模式适用于所述穹隆的第二面。 并且基于图案去除穹隆的部分，使得所述穹形的剩余部分形成将元件端子互连的电路。

公开(公告)号：EP2353179A2

公开(公告)日：2011-08-10

申请号：EP09821348.1

申请日：2009-10-16

申请人： Occam Portfolio LLC

发明人： FJELSTAD, Joseph C.

IPC分类号： H01L21/60

CPC分类号： H05K1/189 ,  H01L21/568 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09481 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T156/10 ,  Y10T156/1057 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides an electronic assembly (400) and a method for its manufacture (800), (900, 1000 1200, 1400, 1500, and 1700). The assembly (400) uses no solder. Components (406) or component packages (402, 802, 804, 806) with I/O leads (412) are placed (800) onto a planar substrate (808). The assembly is encapsulated (900) with electrically insulating material (908) with vias (420, 1002) formed or drilled (1000) through the substrate (808) to the components' leads (412). Then the assembly is plated (1200) and the encapsulation and drilling process (1500) repeated to build up desired layers (422, 1502, 1702). The planar substrate (808) may be a flexible substrate (2016) allowing bending of an assembly (2000) to fit into various enclosures.

公开(公告)号：EP2208223A2

公开(公告)日：2010-07-21

申请号：EP08781591.6

申请日：2008-07-10

申请人： Occam Portfolio LLC

发明人： FJELSTAD, Joseph C.

IPC分类号： H01L21/60 ,  H05K3/32

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/06 ,  H05K3/061 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0355 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T428/24612 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.