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公开(公告)号：EP0713358A3
公开(公告)日：1997-11-05
申请号：EP95308110.6
申请日：1995-11-13
发明人： Frankeny, Jerome Albert , Frankeny, Richard Francis , Hayden, Terry Frederick , Imken, Ronald Lann , Rice, Janet Louise , Vanderlee, Keith Allan
CPC分类号： H05K3/462 , H05K1/162 , H05K3/0023 , H05K3/0094 , H05K3/4623 , H05K3/4641 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0307
摘要： A fine pitch pattern multilayer printed circuit board has laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. The board layers may be fabricated by beginning with a metallic core 1, patterning the core, selectively enclosing the core in a dielectric 6, selectively depositing metal 12 to form vias 13, plugs 14 and signal lines 16, and forming dendrites 19 with joining metallurgy on the vias and plugs to provide stackable connections from above or below the plane of the board layer. In addition, a sol-gel process may be used to form a thin high dielectric constant crystalline film 27 onto a metallic sheet 26 followed with a deposition of a metallic layer 29 onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric 40, and has selectively deposited a metallic layer 42 for interconnecting the capacitor and forming vias 37, 38. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.
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公开(公告)号：EP0598522A1
公开(公告)日：1994-05-25
申请号：EP93308798.3
申请日：1993-11-03
发明人： Haj-Ali-Ahmadi, Javad , Farrar, Paul Alden , Frankeny, Jerome Albert , Frankeny, Richard Francis
IPC分类号： H01L25/065 , H01L23/32 , H01L23/433
CPC分类号： H01L25/0657 , H01L25/0652 , H01L2224/16 , H01L2224/16108 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06589 , H01L2225/06596 , H05K3/325
摘要： A memory module 8 includes a power distribution assembly in the form of plates 15, 17 forming a capacitor of low inductance and a flexible circuit substrate 12. The circuit substrate is populated with precisely positioned contact pads for the power, read, write and address lines of memory chips 32 that contact the substrate. Memory chips are fixed to heat spreaders 30 and loaded into a chip holder 18 which positions the chips for contact with the contact pads on the substrate. The substrate contact pads are plated to form dendritic crystals of palladium and the memory chips are provided with solder balls on the contact pads of the memory chip, or vice versa. The solder balls are held in contact with the contact pads by the compressive forces of clamping a heat sink 20 over the heat spreaders.
摘要翻译： 存储器模块8包括形成低电感的电容器的板15,17的形式的功率分配组件和柔性电路衬底12.电路衬底上装有用于功率，读取，写入和写入线的精确定位的接触焊盘 的与衬底接触的存储器芯片32。 存储芯片被固定到散热器30上，并被装载到芯片保持器18中，芯片保持器18定位用于与衬底上的接触焊盘接触的芯片。 将衬底接触垫电镀以形成钯的树枝晶体，并且存储器芯片在存储器芯片的接触焊盘上设置有焊球，反之亦然。 通过将散热器20夹在散热器上方的压缩力，焊球与接触垫保持接触。
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3.发明公开Universal electrical interconnection system and method 失效Universe Anordnungfürelektrische Zwischenverbindungen und Herstellungsverfahrendafür。
公开(公告)号：EP0396522A2
公开(公告)日：1990-11-07
申请号：EP90850153.9
申请日：1990-04-24
CPC分类号： H05K3/321 , H01R4/02 , H05K3/323 , H05K3/3421 , H05K3/3436 , H05K3/3484 , H05K3/361 , H05K3/4069 , H05K13/0465 , H05K2201/09945 , H05K2201/10378 , H05K2201/10424 , H05K2201/10681 , H05K2201/10689 , Y02P70/613
摘要： A carrier preferably in the form of a thin insulative and heat-resistant sheet (14) has a plurality of apertures (26) extending therethrough which are preloaded to carry a reflowable electrically conductive solder (28) or paste. Upon positioning the carrier between lands (18-24) of circuit carriers, printed circuit boards, combinations thereof or the like, predetermined electrical interconnections may be effected between such lands by reflow. The electrical interconnection is completed between given upper and lower such lands through the conductive material in a plurality of apertures disposed between the lands. In a preferred embodiment the aperture density relative to the area of the lands to be interconnected is selected to provide redundancy by permitting plural interconnections through apertures to a given land pair. Aperture diameter and amount of reflowable material present therein is further selected whereby upon such reflowing apertures between adjacent pads act as solder dams to prevent undesirable electrical interconnection between such adjacent pads. A system is provided whereby the carrier need not be precisely aligned relative to the land patterns and whereby necessity for precise screening of conductive material to accommodate fine pitch land/pad configurations is eliminated.
摘要翻译： 优选为薄绝缘耐热片（14）形式的载体具有穿过其中的多个孔（26），其被预加载以承载可回流的导电焊料（28）或糊料。 在将载体定位在电路载体，印刷电路板，其组合等的平台（18-24）之间时，可以通过回流在这些焊盘之间实现预定的电互连。 在布置在焊盘之间的多个孔中，通过导电材料在给定的上部和下部这种焊盘之间完成电互连。 在优选实施例中，通过允许通过孔到给定的岸对对多个互连来选择相对于待互连的焊盘区域的孔径密度以提供冗余。 进一步选择孔径和其中存在的可回流材料的量，由此在这种回流之间，相邻焊盘之间的孔隙用作焊接阻挡层，以防止这种相邻焊盘之间的不期望的电互连。 提供了一种系统，其中载体不需要相对于焊盘图案精确地对准，并且由此消除了导电材料的精确筛选以适应细间距焊盘/焊盘构造的必要性。
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公开(公告)号：EP0495621A3
公开(公告)日：1992-12-09
申请号：EP92300301.6
申请日：1992-01-14
CPC分类号： B30B1/42 , H03K3/57 , Y10T83/162 , Y10T83/8765
摘要： A power management circuit for operating a magnetic repulsion punch comprising a storage capacitor 20 arranged to be connected in parallel with an inductive load 30 serving as an operating coil of the magnetic repulsion punch, a means 240, 440 for selectively and temporarily coupling the inductive load to the storage capacitor for forming a resonant circuit, and a means 100 for charging the storage capacitor after each operation.
摘要翻译： 一种用于操作磁性斥力冲击器的电源管理电路，其包括设置成与用作磁性斥力冲头的操作线圈的感性负载30并联连接的存储电容器20，用于选择性地和暂时地耦合感性负载的装置240,440 到用于形成谐振电路的存储电容器，以及用于在每次操作之后对存储电容器充电的装置100。
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5.发明公开A system and method for manufacture of micro-panels 失效Vorrichtung und Verfahren zur Herstellung von Mikroplatten。
公开(公告)号：EP0396524A1
公开(公告)日：1990-11-07
申请号：EP90850155.4
申请日：1990-04-24
CPC分类号： H05K3/0052 , H05K3/005 , H05K3/0061 , H05K2201/09063 , H05K2201/0909
摘要： A multilayer board (10) is comprised of upper (14) and lower (16) conductive layers with an insulative layer (12) sandwiched therebetween. Geometric patterns are defined in the upper layer alternately by slots (32) extending therethrough and material sections (36) between the ends of adjacent slots. Identical geometric patterns are defined in the lower conductive layer in vertical registry with the upper patterns with slots and material sections in the lower layer corresponding to material sections and slots of identical length and orientation vertically thereabove respectively in the upper section. All material sections in either the upper or lower layer thereby have a correlative slot therebelow or thereabove in vertical registry in the lower or upper layer, respectively. With respect to a given preselected pattern, by punching through the slots in the upper and lower layers partially defining the pattern and continuing therethrough to penetrate through the opposing correlative vertically aligned material section of the lower or upper layer, a micro-panel is thereby formed in the shape of the pattern upon severance from the board. Due to slot-material section configuration so that no conductive material is directly in vertical alignment with a slot, upon severance conductive material of one layer is prevented from smearing and thereby shorting out to the other conductive layer.
摘要翻译： 多层板（10）由上（14）和下（16）导电层构成，绝缘层（12）夹在其间。 几何图案通过在其中延伸的槽（32）和相邻槽的端部之间的材料部分（36）交替地在上层中限定。 在与上部图案垂直对准的下部导电层中限定相同的几何图案，其中下部层中的缝隙和材料部分对应于上部分别垂直于上方的材料部分和相同长度和方向的缝隙。 上层或下层中的所有材料部分分别在下层或上层中具有垂直注册表中的下方或上方的相关槽。 对于给定的预选图案，通过穿过部分地限定图案并继续穿过其的上部和下部的槽穿过下层或上层的相对的相对垂直对齐的材料部分，由此形成微面板 形式从板上分离。 由于狭缝材料部分构造，使得没有导电材料与槽直接垂直对准，一旦分离，就可以防止一层的导电材料被污染，从而短路到另一导电层。
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公开(公告)号：EP0396523A2
公开(公告)日：1990-11-07
申请号：EP90850154.7
申请日：1990-04-24
发明人： Frankeny, Jerome Albert , Frankeny, Richard Francis , Haj-Ali-Ahmadi, Javad , Hermann, Karl , Imken, Ronald Lann
CPC分类号： H01R13/2435 , H01R12/714 , H05K1/145 , H05K3/325 , H05K3/365 , H05K3/366 , H05K3/368 , H05K2201/0311 , H05K2201/0397 , H05K2201/10424 , H05K2203/167
摘要： An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier (10,30) having laminated thereon a metal foil with preselected spring properties. After lamination, lithographic techniques form a series of electrically isolated metallic beams (20) on the carrier. Additional chemical processing removes portions of the carrier at opposing sides of the strip to expose opposing ends of the beams which extend beyond the carrier parallel to one another in opposing directions outwards from the carrier. By urging the pads towards respective beam ends of the strip disposed between the pads until mating engagement therewith, a plurality of electrical interconnections are established through the beams. Flexural properties of the strip provide a low insertion force connection for a high density of conductors wherein the spring action of the strip assures favorable contact forces to the pads. The exposed film side of the strip may also be metalized and provided with beams or interconnected to beams on opposing side of the film by vias thereby providing a ground plane.
摘要翻译： 提供互连条，用于以高密度配置实现布置在电路板等上的多个导体焊盘之间的电互连。 带材由聚合物薄膜载体（10,30）制成，该聚合物薄膜载体（10,30）层压有预选弹簧性质的金属薄片。 层压后，光刻技术在载体上形成一系列电隔离的金属梁（20）。 附加的化学处理在条带的相对侧移除载体的部分，以暴露横梁的相对端部，其相对于载体平行于相反的方向延伸超出载体。 通过将焊盘推向设置在焊盘之间的条带的相应的光束端，直到与其配合接合，通过光束建立多个电互连。 带材的弯曲性能为高密度导体提供低插入力连接，其中带材的弹簧作用确保了对垫的有利接触力。 条带的曝光膜侧也可以被金属化并且设置有光束或者通过通孔与膜的相对侧上的光束互连，从而提供接地平面。
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公开(公告)号：EP0396524B1
公开(公告)日：1996-01-03
申请号：EP90850155.4
申请日：1990-04-24
CPC分类号： H05K3/0052 , H05K3/005 , H05K3/0061 , H05K2201/09063 , H05K2201/0909
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公开(公告)号：EP0396523B1
公开(公告)日：1995-06-28
申请号：EP90850154.7
申请日：1990-04-24
发明人： Frankeny, Jerome Albert , Frankeny, Richard Francis , Haj-Ali-Ahmadi, Javad , Hermann, Karl , Imken, Ronald Lann
CPC分类号： H01R13/2435 , H01R12/714 , H05K1/145 , H05K3/325 , H05K3/365 , H05K3/366 , H05K3/368 , H05K2201/0311 , H05K2201/0397 , H05K2201/10424 , H05K2203/167
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9.发明公开Method and apparatus for punching holes in a substrate 失效Vorrichtung und Verfahren zum Stanzen vonÖffnungenin einem Substrat。
公开(公告)号：EP0490586A1
公开(公告)日：1992-06-17
申请号：EP91311360.1
申请日：1991-12-05
CPC分类号： H05K3/005 , B26F1/04 , B26F2210/08 , H05K1/0306 , H05K2203/104 , Y10T83/0524 , Y10T83/0577 , Y10T83/0586 , Y10T83/8759 , Y10T83/8834
摘要： A plurality of sequential controlled magnetic repulsion punches (16) arranged in a variable array are disposed adjacent a constant velocity substrate (4). The array of punches is placed at an angle with respect to the perpendicular of the movement of the substrate and straight rows of holes along the perpendicular are formed as the punches are sequentially fired.
Due to the angle of the array, there is a time delay between the first and each subsequent punch being energised. Therefore, a single power supply is capable of providing energy to a group of punches.
It is further possible to punch straight rows of holes perpendicular to the direction of movement of the substrate and having different centre to centre distance on the same substrate, without the necessity of rearranging the array of punches and performing and additional punching operation.摘要翻译： 布置在可变阵列中的多个顺序控制的磁性排斥冲头（16）设置在等速衬底（4）附近。 冲头阵列相对于基底的运动的垂直方向成一定角度，并且随着冲头顺序地被点燃，形成沿着垂直线的直排孔。 由于阵列的角度，在第一个和每个后续的冲头被激励之间存在时间延迟。 因此，单个电源能够为一组冲头提供能量。 还可以在相同的基板上冲压垂直于基板的移动方向的直线孔，并且在同一基板上具有不同的中心到中心的距离，而不需要重新排列冲头阵列并执行和附加的冲压操作。
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公开(公告)号：EP0396522A3
公开(公告)日：1992-01-22
申请号：EP90850153.9
申请日：1990-04-24
CPC分类号： H05K3/321 , H01R4/02 , H05K3/323 , H05K3/3421 , H05K3/3436 , H05K3/3484 , H05K3/361 , H05K3/4069 , H05K13/0465 , H05K2201/09945 , H05K2201/10378 , H05K2201/10424 , H05K2201/10681 , H05K2201/10689 , Y02P70/613
摘要： A carrier preferably in the form of a thin insulative and heat-resistant sheet (14) has a plurality of apertures (26) extending therethrough which are preloaded to carry a reflowable electrically conductive solder (28) or paste. Upon positioning the carrier between lands (18-24) of circuit carriers, printed circuit boards, combinations thereof or the like, predetermined electrical interconnections may be effected between such lands by reflow. The electrical interconnection is completed between given upper and lower such lands through the conductive material in a plurality of apertures disposed between the lands. In a preferred embodiment the aperture density relative to the area of the lands to be interconnected is selected to provide redundancy by permitting plural interconnections through apertures to a given land pair. Aperture diameter and amount of reflowable material present therein is further selected whereby upon such reflowing apertures between adjacent pads act as solder dams to prevent undesirable electrical interconnection between such adjacent pads. A system is provided whereby the carrier need not be precisely aligned relative to the land patterns and whereby necessity for precise screening of conductive material to accommodate fine pitch land/pad configurations is eliminated.
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