ELECTRONIC DEVICE WITH MULTILAYER LAMINATE
    2.
    发明公开

    公开(公告)号:EP3787381A1

    公开(公告)日:2021-03-03

    申请号:EP19194775.3

    申请日:2019-08-30

    IPC分类号: H05K1/02 H05K3/28

    摘要: An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (Tl) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).

    RECYCLABLE DESIGN OF AN ELECTRONIC DEVICE
    8.
    发明公开

    公开(公告)号:EP4142438A1

    公开(公告)日:2023-03-01

    申请号:EP21193837.8

    申请日:2021-08-30

    IPC分类号: H05K3/22 H05K3/28

    摘要: An electronic device (100) is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. A set of electronics (15) comprising a circuit with electronic components (15c) is disposed between a front substrate (11) and a backing layer (19). A front delamination layer (12) is inserted between the electronics (15) and the front substrate (11). A back delamination layer (18,18') is inserted between the electronics (15) and the backing layer (19). The set of electronics (15) is encapsulated between the front and back delamination layers (12,18). The delamination layers (12,18) are encapsulated between the front substrate (11) and the backing layer (19). A set of passages (19p) through one or more of the delamination layers can be filled with material of the backing layer (19) forming a set of interconnections between the backing layer (19) with the front substrate (11).