摘要:
A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.
摘要:
An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (Tl) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).
摘要:
The present invention pertains to a submount (1) for mechanically and electrically coupling an electronic component (4) to a carrier (6). The submount (1) has a mounting portion (10) for mounting the submount to the carrier and has attachment portions (12a, 12b, 12c, 12d) for holding the electronic component. The submount further has primary electric contacts (14a, 14b) for cooperation with respective electrical conductors (61a, 61b) in the carrier, and secondary electric contacts (16a, 16b, 16c) for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions (18a, 18b, 18c) that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.
摘要:
The present invention pertains to a submount (1) for mechanically and electrically coupling an electronic component (4) to a carrier (6). The submount (1) has a mounting portion (10) for mounting the submount to the carrier and has attachment portions (12a, 12b, 12c, 12d) for holding the electronic component. The submount further has primary electric contacts (14a, 14b) for cooperation with respective electrical conductors (61a, 61b) in the carrier, and secondary electric contacts (16a, 16b, 16c) for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions (18a, 18b, 18c) that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.
摘要:
The present disclosure concerns a flexible electronic circuit (100) and method of manufacturing. A flexible substrate (30) with conductive tracks is provided with a rigid electronic component (10). The component (10) comprises electrical contacts (11,12) on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (11,12).
摘要:
An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.
摘要:
An electronic device (100) is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. A set of electronics (15) comprising a circuit with electronic components (15c) is disposed between a front substrate (11) and a backing layer (19). A front delamination layer (12) is inserted between the electronics (15) and the front substrate (11). A back delamination layer (18,18') is inserted between the electronics (15) and the backing layer (19). The set of electronics (15) is encapsulated between the front and back delamination layers (12,18). The delamination layers (12,18) are encapsulated between the front substrate (11) and the backing layer (19). A set of passages (19p) through one or more of the delamination layers can be filled with material of the backing layer (19) forming a set of interconnections between the backing layer (19) with the front substrate (11).