公开(公告)号：EP1589069B1

公开(公告)日：2008-12-31

申请号：EP04706840.8

申请日：2004-01-30

Applicant: Tokuyama Corporation ,  Zeon Corporation

Inventor： WATANABE, Kazutaka ,  YATABE, Osamu ,  KARATO, Takeshi ,  CHINO, Yoshihiro ,  FUKAHORI, Takahiko

IPC: C08L9/00 ,  C08K3/36 ,  C08L101/02 ,  C08J3/215 ,  B60C1/00 ,  C08J3/02 ,  C08L9/06 ,  C08L21/00

CPC classification number: C08K3/36 ,  B60C1/00 ,  B60C1/0016 ,  B60C1/0025 ,  B60C15/06 ,  B60C2009/0021 ,  C08J3/215 ,  C08J2321/00 ,  C08L21/00 ,  C08L101/02 ,  C08L2666/02

Abstract: A diene rubber composition with excellent processability which reconciles fuel-saving performance with high road-holding performance and is excellent in tensile strength and wearing resistance; a diene rubber obtained by crosslinking the composition; and a process for producing the composition. The composition is characterized in that it comprises 100 parts by weight of a diene rubber having a molecular-weight distribution, which is represented by the ratio of the weight-average molecular weight to the number-average molecular weight, of 1.1 to 30, 20 to 200 parts by weight of silica, and a cationic polymer and that the amount of rubber components insoluble in toluene is 0.2 to 1 g per g of the silica. The process for producing the composition is characterized by reacting a rubber latex stabilized with an anionic emulsifying agent with an aqueous silica suspension containing a cationic polymer and co-coagulating the rubber contained in the rubber latex and the silica contained in the aqueous suspension in a specific pH range.

公开(公告)号：EP1981319B1

公开(公告)日：2012-03-07

申请号：EP07707203.1

申请日：2007-01-23

Applicant: Tokuyama Corporation

Inventor： YAMAMOTO, Yasuyuki ,  YATABE, Osamu ,  MAEDA, Masakatsu

IPC: H05K3/46 ,  H01L23/10 ,  H01L23/15

CPC classification number: H01L23/15 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/092 ,  H05K3/4667 ,  H05K2201/0266 ,  H05K2201/0352 ,  Y10T428/131 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/31 ,  H01L2924/00

Abstract: A process for producing a metallized ceramic substrate having a first conductive layer and a second conductive layer whose surface roughnesses are different from each other, which process comprises the steps of forming a first conductive paste layer containing metal powder on a substrate of sintered ceramic; forming a second conductive paste layer containing metal powder whose average particle diameter is different from that of the metal powder as constituent of the first conductive paste layer; and firing the first conductive paste layer and the second conductive paste layer to thereby form the first conductive layer and the second conductive layer. By the process, there is provided a metallized ceramic substrate that even when it is a multilayer substrate having multiple metallized layers, is capable of ensuring airtightness.

公开(公告)号：EP2157606A1

公开(公告)日：2010-02-24

申请号：EP08765404.2

申请日：2008-06-10

Applicant: Tokuyama Corporation

Inventor： IMAI, Tetsuo ,  YATABE, Osamu ,  MAEDA, Masakatsu

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/14

CPC classification number: H01L23/498 ,  B22F7/04 ,  B22F2998/00 ,  C22C5/02 ,  C22C5/04 ,  C22C19/03 ,  C22C27/04 ,  C22C32/0047 ,  C23C18/32 ,  C23C18/54 ,  C25D5/48 ,  C25D5/50 ,  H01L21/4853 ,  H01L23/15 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/20752 ,  Y10T428/12889 ,  H01L2924/00014 ,  B22F9/04 ,  H01L2924/00

Abstract: The present invention provides a metallized substrate having a novel structure. The metallized substrate comprising, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer, the base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer, the diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, it can make the connection strength of wire bonding favorable.

Abstract translation: 本发明提供具有新颖结构的金属化基板。 金属化基板包括按照以下顺序设置：陶瓷基板; 高熔点金属层; 基底镀镍层; 层状镍 - 磷电镀层; 扩散抑制镀层; 和镀镍层，所述基底镍镀层是镀镍层，镍 - 硼镀层或镍 - 钴镀层中的任一种，所述扩散抑制镀层是柱状镍 - 磷 镀层，钯 - 磷镀层或钯镀层。 根据上述组成，即使在安装状态下加热半导体芯片之后，也可以使引线接合的连接强度良好。

公开(公告)号：EP1589069A1

公开(公告)日：2005-10-26

申请号：EP04706840.8

申请日：2004-01-30

Applicant: TOKUYAMA CORPORATION ,  ZEON CORPORATION

Inventor： WATANABE, Kazutaka ,  YATABE, Osamu ,  KARATO, Takeshi ,  CHINO, Yoshihiro ,  FUKAHORI, Takahiko

IPC: C08L9/00 ,  C08K3/36 ,  C08L101/02 ,  C08J3/215

CPC classification number: C08K3/36 ,  B60C1/00 ,  B60C1/0016 ,  B60C1/0025 ,  B60C15/06 ,  B60C2009/0021 ,  C08J3/215 ,  C08J2321/00 ,  C08L21/00 ,  C08L101/02 ,  C08L2666/02

Abstract: The present invention is to provide a diene rubber composition and a cross-linked diene rubber thereof excellent in tensile strength, wear resistance and processability, keeping compatibility of both good fuel efficiency and high gripping property, and a production method thereof.
What is characterized in the composition is that the composition is comprised of 100 parts by weight of a diene rubber having a molecular weight distribution expressed in terms of the ratio of the weight-average molecular weight to the number-average molecular weight of 1.1 to 30, 20 to 200 parts by weight of silica and a cationic polymer, and that a toluene-insoluble rubber content per gram of the silica within the range from 0.2 to 1g, and diene cross-linked rubber thereof. What is characterized in the production method is that the method comprises steps of allowing rubber latex stabilized by an anionic emulsifying agent to react with an aqueous suspension of silica containing a cationic polymer and effecting co-coagulation of rubber in the rubber latex with the silica in the aqueous suspension within a specific pH range.

Abstract translation: 本发明提供一种二烯橡胶组合物及其抗拉强度，耐磨性和加工性优异的交联二烯橡胶，保持良好的燃料效率和高抓地性的兼容性及其制造方法。 组合物的特征在于该组合物由100重量份的二烯橡胶组成，二烯橡胶具有以重均分子量与数均分子量的比率表示的分子量分布 为0.1〜30,20〜200重量份的二氧化硅和阳离子聚合物，每克二氧化硅的甲苯不溶性橡胶含量在0.2〜1g范围内，和二烯交联橡胶。 制造方法的特征在于该方法包括以下步骤：使通过阴离子乳化剂稳定的橡胶胶乳与含有阳离子聚合物的二氧化硅的含水悬浮液反应，并使橡胶胶乳中的橡胶与二氧化硅共混 水性悬浮液在特定pH范围内。

公开(公告)号：EP2099068A1

公开(公告)日：2009-09-09

申请号：EP07851092.2

申请日：2007-12-21

Applicant: Tokuyama Corporation

Inventor： YAMAMOTO, Yasuyuki ,  MAEDA, Masakatsu ,  YATABE, Osamu

IPC: H01L23/12 ,  C04B35/581 ,  H01B5/14 ,  H01L23/15

CPC classification number: H05K3/38 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01L21/4867 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/0347 ,  H05K2201/035 ,  Y10T428/12576 ,  C04B35/581 ,  C04B41/4517 ,  C04B41/4539 ,  C04B41/5133 ,  C04B41/4541 ,  C04B41/5144 ,  C04B41/5127 ,  C04B41/522 ,  C04B41/5116 ,  H01L2924/00

Abstract: The present invention provides a method for manufacturing metallized aluminum nitride substrate, the method comprising: Step A for forming a high-melting point metal layer over a sintered aluminum nitride substrate; Step B for forming over the high-melting point metal layer an intermediate metal layer of at least one selected from the group consisting of: nickel, copper, copper-silver, copper-tin, and gold by plate processing; and Step C for forming a surface metal layer containing silver as a main component over the intermediate metal layer by coating a silver paste whose glass component content is 1 mass % or less and firing under nonoxidizing atmosphere. By this method, it is capable of forming a glass component-free silver layer which is adhered at a high degree of adhesion strength onto the high-melting point metal layer formed over the aluminum nitride substrate as a top face by thick-film method using a silver paste which makes thick-membrane forming easier.

Abstract translation: 本发明提供一种金属化氮化铝基板的制造方法，其特征在于，包括：在氮化铝烧结体基板上形成高熔点金属层的工序A， 步骤B，通过板加工在高熔点金属层上形成选自镍，铜，铜 - 银，铜 - 锡和金中的至少一种的中间金属层; 以及步骤C，通过涂覆玻璃成分含量为1质量％以下的银膏，在非氧化性气氛下进行烧成，在中间金属层上形成含有银为主要成分的表面金属层。 通过该方法，能够通过厚膜法以高膜方式形成粘合强度高的氮化铝基板上形成的高熔点金属层上的无玻璃成分的银层， 使厚膜形成更容易的银糊。

公开(公告)号：EP1981319A1

公开(公告)日：2008-10-15

申请号：EP07707203.1

申请日：2007-01-23

Applicant: Tokuyama Corporation

Inventor： YAMAMOTO, Yasuyuki ,  YATABE, Osamu ,  MAEDA, Masakatsu

IPC: H05K3/24 ,  H01L23/12 ,  H05K3/12

CPC classification number: H01L23/15 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/092 ,  H05K3/4667 ,  H05K2201/0266 ,  H05K2201/0352 ,  Y10T428/131 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/31 ,  H01L2924/00

Abstract: The present invention is to provide a fabrication method for metallized ceramics substrate comprising the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive layer by firing the first conductive paste layer and the second conductive paste layer, wherein surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.

Abstract translation: 本发明是提供一种用于包括以下步骤的金属化陶瓷基片的制造方法：形成第一层的导电膏包含在烧结陶瓷基片的金属粉末; 形成第二层的导电糊含有平均粒径的金属粉末是从构成金属粉末不同做的第一导电性糊剂层; 和形成第一层和通过烧制所述第一导电膏层和第二层的导电膏中，第一层的worin表面粗糙度和第二导电导电层的第二导电层的导电是不同的。 通过该方法，能够确保金属化陶瓷基片的气密性，即使它是具有金属化层上的多个多层基板。