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公开(公告)号：EP1811556A4
公开(公告)日：2009-08-05
申请号：EP05788208
申请日：2005-09-29
CPC分类号： C22C5/02 , B23K35/3013 , H01L24/11 , H01L24/12 , H01L24/43 , H01L24/45 , H01L24/81 , H01L2224/0401 , H01L2224/05624 , H01L2224/1134 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48624 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00011 , H01L2924/01003 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01063 , H01L2924/01064 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01205 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/19043 , H01L2924/01062 , H01L2924/01004 , H01L2924/01039 , H01L2924/01201 , H01L2924/013 , H01L2924/00013 , H01L2924/00 , H01L2924/01049 , H01L2924/01006
摘要： The present invention was held in order to resolve problems on above-mentioned conventional wire bumping material. This invention has the following purposes; (1) approximating Au-Ag alloy bumping balls to bond Al pads to ideal sphere shape (2) increasing assurance of Au-Ag alloy bump bonding to Al pads (3) shortening tail length of Au-Ag alloy bump (4) improving anti-Au consumption into solder (5) decreasing contamination of capillary tip by bump wire and hole around tip Means for resolution Au-Ag alloy for wire bumping comprising wherein Au, which purity is more than 99.99 mass %, comprising Au matrix and a particle of additive elements, consisting of 1 to 40 mass % Ag, which purity is more than 99.99 mass %.
摘要翻译： 本发明是为了解决上述传统的导线凸块材料的问题而进行的。 本发明具有以下目的： （1）近似Au-Ag合金碰撞球以将Al焊盘结合到理想球形（2）增加Au-Ag合金凸点结合到Al焊盘的保证（3）缩短Au-Ag合金凸点的尾部长度（4） - 消耗到焊料中（5）通过凸点线和尖端周围的孔减少毛细管尖端的污染解决方法用于分解金属线的Au-Ag合金包括其中包含Au基体和颗粒为 由1质量％〜40质量％的Ag构成的添加元素，其纯度超过99.99质量％。
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公开(公告)号：EP2209136A4
公开(公告)日：2013-08-07
申请号：EP08846626
申请日：2008-10-15
发明人： TAKADA MITSUO , TESHIMA SATOSHI , KUWAHARA TAKESHI
CPC分类号： H01L24/85 , C22C5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/78301 , H01L2224/7855 , H01L2224/85045 , H01L2224/85048 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01105 , H01L2924/01203 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/01039 , H01L2924/00014 , H01L2924/01202 , H01L2924/00 , H01L2924/013 , H01L2924/00013 , H01L2924/00015 , H01L2924/01049 , H01L2924/01006
摘要： [Issues to be solved] To provide Au alloy wire for ball bonding, which is superior wire strength, and also is superior at formability of molten ball and roundness of compressed ball, moreover is superior at stitch bondability; is available for high density wiring of semiconductor divices. [Solution means] Au alloy wire for ball bonding comprising: 15 - 50 wt ppm Mg, 10 - 30 wt ppm Ca, 5 - 20 wt ppm Eu, 5 - 20 wt ppm Y, 5 - 20 wt ppm La and residual Au is more than 99.998 wt % purity, moreover, purity of more than 99.98 wt % Au, mass of additive Ca is less than the value of total amount of additive Eu and additive La, and mass of additive Y is less than the value of total amount of additive Ca and additive Eu, and mass of 20 - 40 wt ppm Mg.
摘要翻译： [待解决的问题]为了提供优良的丝强度的球形接合用Au合金丝，并且在熔融球的成形性和压缩球的圆度方面也优异，而且在针迹结合性方面优异; 可用于半导体分区的高密度布线。 [解决方案]用于球接合的Au合金线包括：15-50重量ppm的Mg，10-30重量ppm的Ca，5-20重量ppm的Eu，5-20重量ppm的Y，5-20重量ppm的La和残余的Au是 纯度大于99.998重量％，此外，纯度高于99.98重量％的Au，添加剂Ca的质量小于添加剂Eu和添加剂La的总量的值，添加剂Y的质量小于总量 的添加剂Ca和添加剂Eu，质量为20-40重量ppm的Mg。
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3.发明公开GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY AND HIGH RESIN FLOW RESISTANCE 审中-公开金合金丝用作具有高粘结可靠性的压接球高圆，高的GERADEVORRÜCKEIGENSCHAFT和高树脂流阻焊线
公开(公告)号：EP1901343A4
公开(公告)日：2012-06-20
申请号：EP06766496
申请日：2006-06-08
发明人： MAKI KAZUNARI , NAKATA YUJI
CPC分类号： C22C5/02 , B23K35/3013 , H01B1/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05144 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01028 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01063 , H01L2924/01067 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01205 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/01004 , H01L2924/01026 , H01L2924/01039 , H01L2924/013 , H01L2924/00 , H01L2924/01006
摘要： There is provided a gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: 10 to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.
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公开(公告)号：EP2208801A4
公开(公告)日：2010-10-20
申请号：EP08846565
申请日：2008-09-11
发明人： MURAI HIROSHI , CHIBA JUN , AMADA FUJIO
CPC分类号： C22C5/02 , B23K35/3013 , H01L24/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05624 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/78301 , H01L2224/78303 , H01L2224/78306 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/859 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/0106 , H01L2924/0107 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01204 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/01071 , H01L2924/00014 , H01L2924/01201 , H01L2924/01202 , H01L2924/01203 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/20752 , H01L2924/00013 , H01L2924/01006
摘要： [Issues to be solved] Second bonding failures caused attached oxide of additive elements on high purity Au bonding wire are to be dissolved. [Solution means] Au alloy bonding wires comprising: 5 - 100 wt ppm Mg, 5 - 20 wt ppm In, 5 - 20 wt ppm Al, 5 - 20 wt ppm Yb, and Au residual is more than 99.995 wt % purity, and adding 5 - 20 wt ppm Ca, and for these alloys adding at least more than one element among 5 - 20 wt ppm La, 5 - 20 wt ppm Lu, 5 - 100 wt ppm Sn, 5 - 100 wt ppm Sr to the alloy, and/or, more over, adding 0.01 - 1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements .do not cause of disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding to attached on tip of capillary, transferring to the wire at second bonding.
摘要翻译： [要解决的问题]第二次键合失败导致高纯度Au键合线上的添加元素的附着氧化物被溶解。 [解决手段] Au合金接合线包括：5-100wt ppm Mg，5-20wt ppm In，5-20wt ppm Al，5-20wt ppm Yb和Au残余物，纯度大于99.995wt％，并且 添加5-20wtppm的Ca，并且对于这些合金，在合金中添加5-20wt ppm La，5-20wt ppm Lu，5-100wt ppm Sn，5-100wt ppm Sr中的至少一种以上元素 ，和/或更重要的是，向这些合金中加入0.01-1.2wt％的Pd。 包含这些微量添加元素的键合线不会由于积聚的污染而造成干扰，这是由于在微球形成时在球形成时和在第一次键合时形成的附着在毛细管尖端上的污染物，在第二键合时转移到线上 。
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公开(公告)号：EP2139032A4
公开(公告)日：2009-12-30
申请号：EP08738890
申请日：2008-03-26
发明人： MURAI HIROSHI , CHIBA JUN , AMADA FUJIO
CPC分类号： C22C5/02 , B23K35/0227 , B23K35/3013 , B23K2201/36 , B23K2203/10 , H01L24/02 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48011 , H01L2224/4845 , H01L2224/48624 , H01L2224/85201 , H01L2224/859 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20755 , H01L2924/20656 , H01L2924/013 , H01L2924/00 , H01L2224/43 , H01L2924/01006
摘要： [Issues to be solved] Providing enhanced bonding reliability of Au alloy bonding wire with low electrical resistivity to Al electrode of semiconductor device, and its application of semiconductor device is bonded with Al electrode pad by the same wire. [Solution means] Au alloy bonding wire comprising: 0.02 - 0.3 mass % Ag, total amount of 10 - 200 mass ppm at least one element of Ge and/or Si, and/or total amount of 10 - 200 mass ppm at least one element of Al and/or Cu, with residual of Au. Moreover, Al and/or Al alloy pad bonded with the above Au alloy bonding wire.
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公开(公告)号：EP2413351A4
公开(公告)日：2012-12-05
申请号：EP09842303
申请日：2009-09-01
CPC分类号： B23K35/302 , B23K35/0261 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48664 , H01L2224/48824 , H01L2224/48839 , H01L2224/48864 , H01L2224/85207 , H01L2224/85439 , H01L2224/85464 , H01L2224/85469 , H01L2924/00011 , H01L2924/00015 , H01L2924/01205 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/01015 , H01L2924/01206 , H01L2924/01029 , H01L2924/01204 , H01L2924/01028 , H01L2924/01027 , H01L2924/0105 , H01L2224/45639 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/01008 , H01L2924/01007 , H01L2924/01006 , H01L2924/01078 , H01L2924/20755 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/01203 , H01L2924/01046 , H01L2924/20309 , H01L2924/013 , H01L2924/00 , H01L2924/00014 , H01L2924/01004 , H01L2924/01033
摘要： To provide a covered Cu wire for ball bonding which can be avoid inconvenience oxidation of core material of Cu and/or Cu alloy on ball forming after pulling and cutting away. A covered Cu wire comprising: core material of Cu-P alloy, and intermediate layer of Pd or Pt on the core material and surface layer of Au on the intermediate layer.
摘要翻译： 提供一种用于球焊的包覆铜丝，可以避免在拉拔和切割后的球形成时铜和/或铜合金芯材氧化不便。 一种包覆Cu丝，包括：Cu-P合金芯材，以及芯材上的Pd或Pt中间层和中间层Au表面层。
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7.发明公开GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH INITIAL BONDING CAPABILITY, HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY AND HIGH RESIN FLOW RESISTANCE 审中-公开金合金丝用作具有较高的初始结合的能力高粘结可靠性的压接球高圆，高GERADEVORRÜCKEIGENSCHAFT和高树脂流阻焊线
公开(公告)号：EP1901344A4
公开(公告)日：2012-06-20
申请号：EP06766497
申请日：2006-06-08
发明人： MAKI KAZUNARI , NAKATA YUJI
CPC分类号： B23K35/3013 , C22C5/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01063 , H01L2924/01067 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01205 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/01004 , H01L2924/01202 , H01L2924/013 , H01L2924/00 , H01L2924/01006
摘要： There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.
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公开(公告)号：EP2204846A4
公开(公告)日：2014-01-15
申请号：EP08790566
申请日：2008-06-23
发明人： TAKADA MITSUO , TESHIMA SATOSHI , KUWAHARA TAKESHI
CPC分类号： H01L24/85 , B23K35/3013 , B23K2201/36 , C22C5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/05644 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/01105 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20106 , H01L2924/20752 , Y10T428/12 , H01L2924/01012 , H01L2924/01063 , H01L2924/0105 , H01L2924/0102 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/00015 , H01L2924/01205 , H01L2924/01048 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： [PROBLEMS] To provide a gold alloy wire which is excellent in the property of forming a melt ball, suitability for stitch bonding, and wire strength and, despite this, gives a press-bonded ball having excellent circularity, and which is usable in high-density wiring for a semiconductor device. [MEANS FOR SOLVING PROBLEMS] The gold alloy wire for use in ball bonding is made of a gold alloy comprising 10-50 mass ppm magnesium (Mg), 5-20 mass ppm europium (Eu), 2-9 mass ppm calcium (Ca), and gold (Au) having a purity of 99.995 mass% or higher as the remainder, wherein the calcium (Ca) content is up to half the europium (Eu) content by mass.
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公开(公告)号：EP1811555A4
公开(公告)日：2012-06-20
申请号：EP05787491
申请日：2005-09-28
发明人： MURAI HIROSHI , CHIBA JUN , TESHIMA SATOSHI
CPC分类号： C22C5/02 , B23K35/3013 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2224/48639 , H01L2224/85439 , H01L2924/00011 , H01L2924/01105 , H01L2924/01202 , H01L2924/01203 , H01L2924/01205 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1576 , H01L2924/181 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/01046 , H01L2924/01014 , H01L2924/01063 , H01L2924/01004 , H01L2924/01058 , H01L2924/01064 , H01L2924/01012 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01201 , H01L2924/00014 , H01L2924/0102 , H01L2924/01066 , H01L2924/0103 , H01L2924/0105 , H01L2924/013 , H01L2924/00013 , H01L2924/00 , H01L2924/01028 , H01L2924/01404 , H01L2924/01006
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公开(公告)号：EP1830398A4
公开(公告)日：2012-06-06
申请号：EP05809380
申请日：2005-11-22
发明人： TESHIMA SATOSHI , MIKAMI MICHITAKA
CPC分类号： C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/4845 , H01L2224/48624 , H01L2224/85207 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01205 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , Y10T428/12431 , H01L2924/01004 , H01L2924/01204 , H01L2924/01039 , H01L2924/20105 , H01L2924/20106 , H01L2924/2011 , H01L2924/20111 , H01L2924/013 , H01L2924/01062 , H01L2924/01048 , H01L2924/01049 , H01L2924/00013 , H01L2924/00 , H01L2924/01006
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