中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

303 records (took 0.022 seconds)

    Electronic component manufacturing method
    13.
    发明专利
    Electronic component manufacturing method 有权
    电子元件制造方法

    公开(公告)号：JP2013197273A

    公开(公告)日：2013-09-30

    申请号：JP2012062054

    申请日：2012-03-19

    Applicant: Nisshinbo Holdings Inc ,  日清紡ホールディングス株式会社

    Inventor： TSUNODA YOSHIHISA ,  TOMITA HIDEJI ,  SUZUKI TAKASHI ,  NATSUME HIROMICHI

    IPC: H05K3/34

    CPC classification number: H05K1/111 ,  H01L2224/81224 ,  H05K3/3494 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2203/107 ,  H05K2203/1581 ,  Y02P70/611

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method which can restrain all of damage to boards, residuals of solder balls, and poor fillet formation even when electronic elements are mounted on a printed wiring board built with a low melting point board such as a PET or PEN by irradiating it with near-infrared laser light from the reverse side of the board.SOLUTION: An electronic component manufacturing method of the present invention involves mounting electronic elements on a printed wiring board built with a board made of resin whose melting point is 280°C or less and having a wiring pattern thereon. The manufacturing method includes a step of supplying solder, a placement step of placing terminals for the electronic elements into position, and a step of soldering the electronic elements to the printed wiring board by irradiating it with near-infrared laser light. In the placement step, the wiring pattern is restricted in width to 2 mm or less within at least 2 mm on both sides in the extension direction of the wiring pattern from the center in width of the terminal, and the shortest distance from an end portion in the width direction on one side of the wiring pattern to the terminal is defined to be 0.5 mm to 1.6 mm.

    Abstract translation: 要解决的问题：提供一种电子部件制造方法，即使将电子元件安装在由低熔点板构成的印刷线路板上时也能够抑制板的全部损伤，焊球的残留物和差的圆角形状， PET或PEN通过从板的背面用近红外激光照射PET或PEN。解决方案：本发明的电子元件制造方法涉及将电子元件安装在由树脂制成的印刷电路板上，该印刷电路板熔化 点为280℃以下，并具有布线图案。 该制造方法包括提供焊料的步骤，将电子元件的端子放置就位的放置步骤以及通过用近红外激光照射将电子元件焊接到印刷线路板的步骤。 在布置步骤中，布线图案从端子的宽度方向的中心在布线图案的延伸方向两侧至少2mm以内的宽度限制为2mm以下，并且与端部的最短距离 在与端子的布线图形的一侧的宽度方向上的距离为0.5mm〜1.6mm。

    Suppress the component mounting failure of due to the excess solder printed wiring board
    14.
    实用新型
    Suppress the component mounting failure of due to the excess solder printed wiring board 有权

    公开(公告)号：JP3185456U

    公开(公告)日：2013-08-15

    申请号：JP2013003219

    申请日：2013-06-06

    Applicant: ファナック株式会社

    Inventor： 大介 三浦

    IPC: H05K3/34

    CPC classification number: H05K1/111 ,  H05K3/3421 ,  H05K2201/09663 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/046 ,  Y02P70/611

    Abstract: 【課題】余剰はんだによる他部品への端子間の短絡など部品の実装不良を抑制するプリント配線板を提供する。
    【解決手段】プリント配線板１０は、リード端子接続用パッド１２、放熱用端子接続用パッド１３と、はんだ吸収パッド１４が設けられ、放熱用端子接続用パッド１３は、表面実装部品の部品パッケージ実装領域の下部になるように配置され、はんだ吸収パッド１４は、リード端子接続用パッド１２と放熱用端子接続用パッド１３の間以外の放熱用端子接続用パッド１３の近傍に設けられ、表面実装部品接続用パッド１１及びはんだ吸収パッド１４が設けられた以外のプリント配線板１０の表面領域は、大部分がソルダレジスト１６により覆われる。 放熱用端子接続用パッド１３の近傍であって、リード端子接続用パッド１２と放熱用端子接続用パッド１３の間以外の場所に、はんだ吸収パッド１４を設けることで、他部品へのはんだボールによる短絡不良を抑制できる。
    【選択図】図１

    Grooved plate for solder joint
    15.
    发明专利
    Grooved plate for solder joint 有权
    焊接接头板

    公开(公告)号：JP2013084960A

    公开(公告)日：2013-05-09

    申请号：JP2012225711

    申请日：2012-10-11

    Applicant: Led Engin Inc ,  エルイーディエンジン・インコーポレーテッド

    Inventor： YAN XIANTAO ,  DEVO A ADEVIYI ,  MEI ZEQUN

    IPC: H01L23/12 ,  H01L33/00 ,  H05K3/34

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2203/1178 ,  Y02P70/611 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an improved grooved plate for solder joint.SOLUTION: A grooved plate for solder joint comprises a metal plate 208, placed on a metal plate on a multi die LED radiator board or an MCPCB(metal core print circuit board) 200 attached on a radiator board. Either of the metal plates, or both of the metal plates includes many of radial grooves 210 to 215, and at least a part of those radiates to a peripheral end of the metal plate 208. Those grooves 210 to 215 form ducts capable of releasing air at a solder joint process, reduce size and/or gross area of solder void, so that heat transfer between the radiator and the MCPCB is improved.

    Abstract translation: 要解决的问题：提供一种用于焊接接头的改进的槽板。 解决方案：用于焊接接头的开槽板包括放置在多芯片LED散热器板上的金属板上的金属板208，或连接在散热器板上的MCPCB（金属芯印刷电路板）200。 金属板或两个金属板中的任一个包括许多径向槽210至215，并且其中的至少一部分辐射到金属板208的外周端。这些沟槽210至215形成能够释放空气的管道 在焊接过程中，减小焊料空隙的尺寸和/或总面积，从而提高散热器和MCPCB之间的热传递。 版权所有（C）2013，JPO＆INPIT

    Printed wiring board
    20.
    发明专利
    Printed wiring board 有权
    印刷线路板

    公开(公告)号：JP2012069813A

    公开(公告)日：2012-04-05

    申请号：JP2010214393

    申请日：2010-09-24

    Applicant: Canon Inc ,  キヤノン株式会社

    Inventor： HAYASHI YASUJI

    IPC: H05K1/02

    CPC classification number: H05K1/0219 ,  H05K1/0216 ,  H05K1/116 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/0979

    Abstract: PROBLEM TO BE SOLVED: To reduce crosstalk noise without widening a wiring area between a pair of signal wires.SOLUTION: A printed wiring board 101 includes an insulator layer 102, a first wiring layer 121 laminated on one surface of the insulator layer 102, and a second wiring layer 122 laminated on the other surface of the insulator layer 102. The first wiring layer 121 has a pair of signal wires 103, 104 for transmitting a signal varying between a ground potential and a supply potential. The second wiring layer 122 has a ground plane 108 impressed with the ground potential. The first wiring layer 121 further has three guard ground wires 105, 106, 107, which are separated from each other, extended between the pair of signal wires 103, 104 along the pair of signal wires 103, 104 and impressed with the ground potential.

    Abstract translation: 要解决的问题：减少串扰噪声，而不会加宽一对信号线之间的接线面积。 解决方案：印刷电路板101包括绝缘体层102，层叠在绝缘体层102的一个表面上的第一布线层121和层压在绝缘体层102的另一个表面上的第二布线层122。 布线层121具有一对信号线103,104，用于发送在接地电位和电源电位之间变化的信号。 第二布线层122具有被地电位印制的接地平面108。 第一布线层121还具有彼此分离的三个保护接地线105,106,107，沿着该对信号线103,104在一对信号线103,104之间延伸并且被地电势压入。 版权所有（C）2012，JPO＆INPIT

Patent Agency Ranking