公开(公告)号：JP3829941B2

公开(公告)日：2006-10-04

申请号：JP2003385418

申请日：2003-11-14

Applicant: セイコーエプソン株式会社

Inventor： 宗英 西面

IPC: H01L21/60 ,  H01L23/48 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/0052 ,  H01L24/86 ,  H01L2224/7565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/118 ,  H05K3/005 ,  H05K3/0064 ,  H05K2201/10681 ,  H05K2203/1545 ,  Y10T29/49117 ,  Y10T29/49789 ,  Y10T29/49835

公开(公告)号：JP2006145469A

公开(公告)日：2006-06-08

申请号：JP2004338929

申请日：2004-11-24

Applicant: Canon Inc ,  キヤノン株式会社

Inventor： TAKEDA SHINICHI

IPC: G01T1/20 ,  H01L27/14 ,  H01L27/148 ,  H01L31/09 ,  H04N5/32

CPC classification number: H01L27/14618 ,  H01L27/14663 ,  H01L2924/0002 ,  H05K3/0058 ,  H05K3/225 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/10681 ,  H05K2201/2036 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To solve the problem that when a bonded member 350 is displaced due to heat and pressure in exchanging and connecting, displacement occurs between an electrical component 160 and an electrical connection part of the substrate 100, the electrical connection part can not be pushed uniformly, and the electrical components are not replaced or connected properly, when the bonded member 350 exists between the region of the substrate 100 and a support member 300, when malfunctions and defects occur in the electrical component 150, such as in connected TCP that are arranged in the periphery of the substrate 100. SOLUTION: A semiconductor device or a radiographic imaging apparatus for bonding the substrate, having a semiconductor element or a conversion element and the support member via the bonded member has a gap between the substrate of a region, including the electrical connection part connected to at least the electrical component and the support member and has a buffer member in the gap. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决问题：为了解决当接合部件350由于交换和连接中的热和压力而移位时，在电气部件160和基板100的电连接部分之间发生位移，电连接 当电气部件150发生故障和缺陷时，当接合部件350存在于基板100的区域和支撑部件300之间时，部件不能被均匀地推压，并且电气部件不被正确地更换或连接，例如 在连接的TCP中布置在基板100的外围。解决方案：一种半导体器件或射线照相成像设备，用于通过接合部件将具有半导体元件或转换元件的基板与支撑部件接合，具有 包括与至少电气部件连接的电气连接部件和支撑部件的区域的基板之间的间隙具有 间隙中的缓冲构件。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005217022A

公开(公告)日：2005-08-11

申请号：JP2004019855

申请日：2004-01-28

Applicant: Sharp Corp ,  シャープ株式会社

Inventor： NAITO KATSUYUKI

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01R12/28 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/10681 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a flexible board which is adapted to a standard such as ZIF, for example, and can inexpensively be manufactured. SOLUTION: The edge side of a film is bent rather than the connector of an input outer lead 6 formed in the surface of the film 1 with flexibility, and a bend part 1b is formed. A connection part composed of a part 1a corresponding to the connector of the film 1 and the bend part 1b is inserted into the recessed part 4 of a connector 3 formed in a main body circuit board 2. A stopper 5 in the recessed part 4 depresses the bend part 1b, and the connector of the input outer lead 6 is connected to an electrode terminal 7 through the bend part 1b and the part 1a of the film. Thus, a connection part fitted to the connector 3 in the prescribed standard can easily and inexpensively be formed by only forming the bend part 1b in the film 1. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供例如适合于诸如ZIF的标准的柔性板，并且可以廉价地制造。 解决方案：膜的边缘侧弯曲而不是弯曲形成在膜1的表面中的输入外引线6的连接器，并且形成弯曲部分1b。 将由与薄膜1的连接器相对应的部分1a和弯曲部分1b组成的连接部分插入到形成在主体电路板2中的连接器3的凹进部分4中。凹陷部分4中的止动件5压下 弯曲部分1b和输入外部引线6的连接器通过弯曲部分1b和薄膜的部分1a连接到电极端子7。 因此，通过仅在膜1中形成弯曲部1b，可以容易且廉价地形成以规定标准装配到连接器3的连接部。（C）2005，JPO＆NCIPI

公开(公告)号：JP3630511B2

公开(公告)日：2005-03-16

申请号：JP28349496

申请日：1996-10-25

Applicant: ヒューレット・パッカード・カンパニーHewlett−Packard Company

Inventor： ガッセン・アズダシュト ,  モハマッド・アクハヴェイン

IPC: B23K26/00 ,  B23K26/08 ,  B23K26/20 ,  B23K26/22 ,  B41J2/16 ,  H01L21/60 ,  H01R43/02 ,  H05K3/32

CPC classification number: H01L24/80 ,  B23K26/22 ,  B23K2201/42 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/14 ,  B23K2203/56 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  Y10T29/49083 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401 ,  H01L2924/00

Abstract: In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream-and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead-with the bumps formed on a die or other printhead component, and nozzles formed through the base.

公开(公告)号：JP2004356339A

公开(公告)日：2004-12-16

申请号：JP2003151556

申请日：2003-05-28

Applicant: Nec Electronics Corp ,  Necエレクトロニクス株式会社

Inventor： TANOKURA MASARU ,  YANAGIDA YUKIO

IPC: H01L21/60 ,  H01R4/02 ,  H01R43/02 ,  H05K1/00 ,  H05K1/02

CPC classification number: H01L24/06 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06153 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R4/027 ,  H01R43/0249 ,  H05K1/0268 ,  H05K1/0393 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/10681 ,  H05K2203/1545 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a technology for reducing an area for installing pads to be used for inputting and outputting of a signal into a semiconductor integrated circuit. SOLUTION: A semiconductor device comprises columns of first pads 3, second pads 4, and third pads 5, which are arranged in a first direction, a plurality of first leads 7, second leads 8, and third leads 9 which are connected to the respective columns of pads, and the semiconductor integrated circuit connected to each lead. The column of the second pads is adjacent to the column of the first pads in a second direction perpendicular to the first one, while the column of the third pads is adjacent to the column of the second pads on the side opposite from the column of first pads. Each of the second pads 4 has a first slanted side 4a which is aslant with respect to the first direction, in one corner thereof on the third pad column side. Each of the third pads 5 has a second slanted side 5a which is aslant with respect to the second direction, and faces the first slanted side 4a in one corner thereof on the second pad column side. Each of the leads 7 has a first slanted portion 7a which is extended aslant with respect to the first direction between the first slanted side 4a and the second slanted side 5a. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004287059A

公开(公告)日：2004-10-14

申请号：JP2003078719

申请日：2003-03-20

Applicant: Fujitsu Display Technologies Corp ,  富士通ディスプレイテクノロジーズ株式会社

Inventor： TAGUCHI YOSHIHISA

IPC: G02F1/13 ,  G02F1/1345 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/0268 ,  G02F1/1309 ,  H05K3/361 ,  H05K2201/09727 ,  H05K2201/10681

Abstract: PROBLEM TO BE SOLVED: To provide a liquid crystal display wherein inspection can be performed by detecting a signal and measuring resistance in a wiring for an input signal even if a board for inputting a signal is not used.
SOLUTION: A plurality of insulation film boards 2B-1 and 2B-2 on which ICs 6-1 and 6-2 for driving gates are mounted, respectively, are connected to a generally quadrangular liquid crystal panel 1 where a liquid crystal display part is formed. Each insulation film board has a through wiring 9 and input signal wiring 10 respectively connecting different terminals 9a, 9b ; 10a 10b among a plurality of terminals arranged along one side of the liquid crystal panel 1. Pads 16 for inspection are respectively formed at a part of the through wiring and the input signal wiring.
COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004127924A

公开(公告)日：2004-04-22

申请号：JP2003275430

申请日：2003-07-16

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： HAYASHI TAKAAKI

IPC: H05B33/06 ,  G09F9/00 ,  G09G3/00 ,  G09G3/10 ,  G09G3/20 ,  G09G3/30 ,  H01L23/495 ,  H01L31/0232 ,  H01L51/50 ,  H05B33/10 ,  H05B33/14 ,  H05B39/00

CPC classification number: H01L27/3276 ,  G02F1/13452 ,  G02F2001/13456 ,  G09G2300/0426 ,  H01L27/3223 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K1/117 ,  H05K3/222 ,  H05K3/361 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10128 ,  H05K2201/10681 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an electronic module having wires arranged to correspond to the EL structure, and to provide a manufacturing method therefor and an electronic apparatus. SOLUTION: The electronic module comprises: an EL section 12; a first substrate 10 on which the EL section 12 is formed; a second substrate 50 attached to the first substrate 10; an integrated circuit chip 52 mounted on the second substrate 50; a plurality of first power supply wires 16, 18, 20 and 22 formed to pass through a pair of regions sandwiching the EL section 12 on the first substrate 10; and a plurality of second power supply wires 54 formed to pass through a pair of regions sandwiching the integrated circuit chip 52 on the second substrate 50. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP3515442B2

公开(公告)日：2004-04-05

申请号：JP24997699

申请日：1999-09-03

Applicant: サンコール株式会社

Inventor： 知 高杉

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K3/24 ,  H05K3/28 ,  H05K3/36

CPC classification number: G11B5/486 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K2201/0367 ,  H05K2201/09245 ,  H05K2201/10681

公开(公告)号：JP3377757B2

公开(公告)日：2003-02-17

申请号：JP12499

申请日：1999-01-04

Applicant: シャープ株式会社

Inventor： 滋樹 玉井

IPC: G02F1/1333 ,  G02F1/13 ,  G02F1/1345 ,  H05K1/00

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K2201/0394 ,  H05K2201/10681

公开(公告)号：JPS57118655A

公开(公告)日：1982-07-23

申请号：JP8876881

申请日：1981-06-09

Applicant: Tektronix Inc

Inventor： UIRIAMU YUUJIN BAAGU

IPC: H01R4/48 ,  H01H1/18 ,  H01H1/24 ,  H01L23/32 ,  H01L23/50 ,  H01P5/00 ,  H01P5/08 ,  H01R9/00 ,  H01R11/01 ,  H01R13/22 ,  H01R33/74 ,  H01R43/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K7/10

CPC classification number: H05K7/1061 ,  H01H1/24 ,  H05K1/0237 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/049 ,  H05K2201/10393 ,  H05K2201/10681 ,  H05K2201/10727