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公开(公告)号:JP2013157565A
公开(公告)日:2013-08-15
申请号:JP2012019076
申请日:2012-01-31
Applicant: Toshiba Corp , 株式会社東芝
Inventor: HAYASHIYAMA SHINYA , TAKIZAWA MINORU , NISHIDA NOBORU , TANAKA MAKOTO
CPC classification number: H05K1/181 , G06F1/1601 , G06F1/1637 , H04N5/64 , H04N5/655 , H05K1/0271 , H05K2201/09027 , H05K2201/09063 , H05K2201/09381 , H05K2201/09781 , H05K2201/10189 , H05K2201/10409 , H05K2201/10446 , H05K2201/2009 , H05K2201/2018 , Y02P70/611
Abstract: PROBLEM TO BE SOLVED: To provide an electronic apparatus which improves impact resistance.SOLUTION: According to one embodiment, an electronic apparatus includes: a housing; a circuit board housed in the housing and provided with a cutout part; and a surface mount component provided on the circuit board and arranged along an edge part of the cutout part.
Abstract translation: 要解决的问题:提供一种提高耐冲击性的电子设备。解决方案:根据一个实施例,电子设备包括:壳体; 电路板,容纳在所述壳体中并设置有切口部; 以及设置在电路板上并沿着切口部分的边缘部分布置的表面安装部件。
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公开(公告)号:JP5265370B2
公开(公告)日:2013-08-14
申请号:JP2008536931
申请日:2006-10-27
Applicant: ピーシービー モーター エイピーエスPcb Motor Aps
Inventor: エレスガード、ヘニング , ヨハンセン、エルヴィンド , オレセン、トム , アンデルセン、ヘンリック , ハートヴィグ ハンセン、モーテン
IPC: H02N2/00
CPC classification number: H05K1/0271 , H02N2/163 , H05K1/181 , H05K2201/09063 , H05K2201/10083 , H05K2201/2045
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公开(公告)号:JP5145314B2
公开(公告)日:2013-02-13
申请号:JP2009265242
申请日:2009-11-20
Inventor: 仁暉 王
IPC: H01L33/48
CPC classification number: H05K1/189 , F21K9/00 , F21Y2107/50 , F21Y2115/10 , H05K2201/09063 , H05K2201/09081 , H05K2201/10106
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公开(公告)号:JP5121783B2
公开(公告)日:2013-01-16
申请号:JP2009155179
申请日:2009-06-30
Applicant: 株式会社日立ハイテクノロジーズ
IPC: H01L33/64 , G03F7/20 , H01L21/027 , H01L33/00
CPC classification number: H01L33/64 , G03F7/7005 , G03F7/70858 , H01L25/13 , H01L33/641 , H01L2224/48091 , H05B3/0038 , H05K1/0204 , H05K1/0206 , H05K3/0061 , H05K2201/0209 , H05K2201/09063 , H05K2201/10106 , H05K2201/10977 , H01L2924/00014
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公开(公告)号:JP2012191078A
公开(公告)日:2012-10-04
申请号:JP2011054796
申请日:2011-03-11
Applicant: Funai Electric Co Ltd , 船井電機株式会社
Inventor: ISHIBASHI HIROYUKI
IPC: H05K1/02
CPC classification number: H05K1/02 , H05K3/3421 , H05K2201/09063 , H05K2201/09854 , H05K2201/10356 , H05K2201/10371
Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board causing no risk of board breakage even when an installation member is laid out toward an end portion of the board, and an insertion hole of a binding band of a wire assembly must be formed between an attachment hole of the installation member and an end side of the board.SOLUTION: In a printed wiring board 1, an attachment hole 5A of an installation member 2 laid out and installed toward an end portion of the board 1 is formed at a location in the vicinity of an end side 1a of the board 1, and an insertion hole 5B configured to insert a binding band of a wire assembly thereinto is integrally formed with the attachment hole 5A between the attachment hole 5A and the end side 1a of the board 1 so that a distance L1 from the insertion hole 5B to the end side 1a of the board 1 is more than a thickness of the board 1. A risk of board breakage is removed by setting the distance L2 to more than the thickness of the board 1 by combining the insertion hole 5B and the attachment hole 5A together in order to prevent cracks from occurring in a board part 1 extending from the insertion hole 5B to the end side 1a of the board.
Abstract translation: 要解决的问题:即使当安装构件朝向板的端部布置,并且线组件的装订带的插入孔必须是具有不会发生板断裂风险的印刷线路板 形成在安装构件的安装孔和板的端侧之间。 解决方案:在印刷电路板1中,在板1的端侧1a附近的位置处形成布置在板1的端部上的安装部件2的安装孔5A 以及将导线组合体的装订带插入其中的插入孔5B与安装孔5A和基板1的端侧1a之间的安装孔5A一体地形成,使得从插入孔5B到达的距离L1 板1的端侧1a大于板1的厚度。通过将插入孔5B和安装孔5A组合来将距离L2设定为大于板1的厚度来消除板断裂的风险 一起为了防止从插入孔5B延伸到板的端侧1a的板部1中发生裂纹。 版权所有(C)2013,JPO&INPIT
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公开(公告)号:JP5002574B2
公开(公告)日:2012-08-15
申请号:JP2008289047
申请日:2008-11-11
Applicant: 日東電工株式会社
IPC: G11B5/60
CPC classification number: H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/486 , H05K1/056 , H05K3/305 , H05K3/3442 , H05K2201/055 , H05K2201/09063 , H05K2201/09081 , H05K2201/10545 , H05K2201/10598 , Y10T29/49027 , Y10T29/49124
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公开(公告)号:JP4996727B2
公开(公告)日:2012-08-08
申请号:JP2010194366
申请日:2010-08-31
Applicant: 株式会社東芝
CPC classification number: H05K1/189 , G06F1/1616 , H05K3/0064 , H05K2201/09063 , H05K2201/2009
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公开(公告)号:JP2012142631A
公开(公告)日:2012-07-26
申请号:JP2012102674
申请日:2012-04-27
Applicant: Toyota Industries Corp , 株式会社豊田自動織機
Inventor: SHIMATSU HITOSHI , SAWADA TAKEHIKO , HAYAKAWA TAKAHIRO , ASAI TOMORO , YAMAUCHI RYO
CPC classification number: H05K1/02 , H05K1/144 , H05K3/368 , H05K3/4092 , H05K2201/0397 , H05K2201/042 , H05K2201/09063 , H05K2201/09745 , H05K2201/1031 , H05K2203/0195 , H05K2203/0323 , Y02P70/611
Abstract: PROBLEM TO BE SOLVED: To provide a wiring board capable of being connected to another member without increasing number of components, and capable of being positioned without being restricted in a direction with respect to the other member being a connection destination.SOLUTION: A wiring board 10 comprises: wiring patterns 13, 21; and an insulation layer 11 where the wiring patterns 13, 21 are fixed. The wiring pattern 13 comprises: a pattern joint part 14 for jointing the insulation layer 11; and a pattern extension part 15 which is extended from the pattern joint part 14, and is projected from the end edge of the insulation layer. A connection terminal T is formed, where the distal end of the pattern extension part 15 can be projected from the outermost surface of the pattern joint part 14 by bending the pattern extension part 15.
Abstract translation: 要解决的问题:提供一种能够在不增加部件数量的情况下连接到另一个部件并且能够被定位而不被限制在相对于作为连接目的地的另一个部件的方向上的布线板。 布线板10包括:布线图形13,21; 和布线图案13,21固定的绝缘层11。 布线图案13包括:用于连接绝缘层11的图案接合部14; 以及从图案接合部14延伸并从绝缘层的端部边缘突出的图案延伸部15。 形成连接端子T,其中图案延伸部分15的远端可以通过弯曲图案延伸部分15而从图案接合部分14的最外表面突出。(C)2012年,JPO和INPIT
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公开(公告)号:JP4983387B2
公开(公告)日:2012-07-25
申请号:JP2007130017
申请日:2007-05-16
Applicant: 住友電装株式会社
CPC classification number: H01R12/7047 , H01R12/716 , H01R12/724 , H05K3/306 , H05K2201/09063 , H05K2201/09954 , H05K2201/10189 , H05K2201/10598 , Y10S439/954
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公开(公告)号:JP2012134400A
公开(公告)日:2012-07-12
申请号:JP2010286822
申请日:2010-12-23
Applicant: Denso Corp , 株式会社デンソー
Inventor: NAKANISHI SEIYA , TANABE YASUTO , WATANABE HIDEMITSU
CPC classification number: H05K3/0064 , H05K3/28 , H05K2201/09063 , H05K2201/09909 , H05K2201/09936
Abstract: PROBLEM TO BE SOLVED: To provide a circuit board that can ensure a fastening force of fixing by thermal caulking.SOLUTION: A circuit board 100 is fixed by thermal caulking to a mounting pin 202 of a case body 200. The circuit board 100 has a fixing hole 112 used for thermal caulking, a fixing hole printing region 114 printed around the fixing hole 112, and a component printing region 116 printing respective positions of electronic components 120 to be mounted and at least either a name or symbol identifying them. The fixing hole printing region 114 and the component printing region 116 are formed on a printed board 102 with the electronic components 120 yet to be mounted.
Abstract translation: 要解决的问题:提供可以通过热铆接来确保固定的紧固力的电路板。 解决方案:电路板100通过热铆接固定到壳体200的安装销202上。电路板100具有用于热铆接的固定孔112,打印在固定孔周围的固定孔打印区域114 112和打印要安装的电子部件120的各个位置的部件打印区域116以及标识它们的名称或符号中的至少一个。 固定孔打印区域114和部件印刷区域116形成在印刷电路板102上,电子部件120尚未安装。 版权所有(C)2012,JPO&INPIT
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