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    Design support program, design support method, and semiconductor device
    7.
    发明专利
    Design support program, design support method, and semiconductor device 有权
    设计支持程序，设计支持方法和半导体器件

    公开(公告)号：JP2013257612A

    公开(公告)日：2013-12-26

    申请号：JP2012131624

    申请日：2012-06-11

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： SAITO AKIYOSHI

    IPC: G06F17/50 ,  H05K3/00

    CPC classification number: G06F17/5072 ,  H01L21/4853 ,  H01L23/50 ,  H01L27/02 ,  H01L27/0207 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/0005 ,  H05K2201/09081 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To facilitate countermeasures against noise in design.SOLUTION: A design support device 1 selects a feeding point 3 of a semiconductor integrated circuit that is arranged on a substrate model 2 in which a power supply layer and a grand layer are laminated; determines the arrangement positions of first protrusions 4 that protrude to the outside of the substrate model 2, on sides of the substrate model 2; determines the arrangement positions of second protrusions 5 that protrude to the outside of the substrate model 2, on positions of the sides which are away from the determined arrangement positions of the first protrusions 4 by a predetermined distance; and creates a substrate model 6 in which the first protrusions 4 and second protrusions 5 are arranged at the determined arrangement position.

    Abstract translation: 要解决的问题：为了便于设计中的噪声对策。解决方案：设计支持装置1选择布置在其上层叠有电源层和盛层的基板模型2上的半导体集成电路的馈电点3 ; 确定在基板模型2的侧面上突出到基板模型2的外部的第一突起4的布置位置; 确定突出到基板模型2的外侧的第二突起5的布置位置，在远离所确定的第一突起4的布置位置的边的位置上预定距离; 并且形成基板模型6，其中第一突起4和第二突起5布置在所确定的布置位置。

    Signal transmission wiring with fagot structure
    9.
    发明专利
    Signal transmission wiring with fagot structure 有权
    信号传输与FAGOT结构接线

    公开(公告)号：JP2010263178A

    公开(公告)日：2010-11-18

    申请号：JP2009216663

    申请日：2009-09-18

    Applicant: Itei Kofun Yugenkoshi ,  易鼎股▲ふん▼有限公司

    Inventor： CHUO CHIH-HENG ,  RIN KONSHIN ,  SU KUO-FU

    IPC: H05K1/02

    CPC classification number: H01B7/0892 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/10598

    Abstract: PROBLEM TO BE SOLVED: To provide a signal transmission wiring with a fagot structure, by which faults in a conventional signal transmission wiring can be improved.
    SOLUTION: The signal transmission wiring with the fagot structure is equipped with at least one flexible circuit board 1. The flexible circuit board 1 is provided with a bunch section 11 including plural bunch wirings 111 which are cut and formed along the extension direction of the flexible circuit board 1. Each bunch wiring 111 has a bunch structure which can be freely bent. At least one fagot structure is formed at a side of a predetermined bunch wiring 111 of the bunch section 11 of the flexible circuit board 1. When each of the bunch wirings 111 is folded in the bunch section 11 of the flexible circuit board 1 by a connector 22 of the fagot structure to form the bunch wirings 111 in the shape of the fagot structure, the fagot structure fagots the plural bunch wirings 111 which are coupled by the connector 22 for positioning.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种具有fagot结构的信号传输线，从而可以改善传统信号传输线路中的故障。 解决方案：具有fagot结构的信号传输布线配备有至少一个柔性电路板1.柔性电路板1设置有包括多个束布线111的束部分11，其沿着延伸方向被切割和形成 各束配线111具有可自由弯曲的束结构。 在柔性电路板1的束部11的预定束布线111的一侧形成至少一个格栅结构。当每个束布线111被折叠在柔性电路板1的束束部分11中时 Fagot结构的连接器22，以形成fagot结构形式的束布线111，fagot结构通过连接器22耦合定位的多束布线111。 版权所有（C）2011，JPO＆INPIT

    Suspension board with circuit and manufacturing method thereof
    10.
    发明专利
    Suspension board with circuit and manufacturing method thereof 有权
    具有电路的悬挂板及其制造方法

    公开(公告)号：JP2010118096A

    公开(公告)日：2010-05-27

    申请号：JP2008289047

    申请日：2008-11-11

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： OSAWA TETSUYA ,  NAITO TOSHIKI

    IPC: G11B5/60

    CPC classification number: H05K1/189 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10545 ,  H05K2201/10598 ,  Y10T29/49027 ,  Y10T29/49124

    Abstract: PROBLEM TO BE SOLVED: To provide a compact suspension board with a circuit having low wiring density, and to provide a manufacturing method thereof. SOLUTION: The suspension board with the circuit having a conductor pattern 7 includes: a board body 20 with a magnetic head 38 mounted thereon; and an auxiliary part 30 formed continuously from the board body 20. The conductor pattern 7 includes: a first conductor pattern 13 provided with an external-side terminal 17 and a head-side terminal 16; and a second conductor pattern 19 provided with a supply-side terminal 23 and an element-side terminal 22. The external-side terminal 17, the head-side terminal 16, and the supply-side terminal 23 are arranged on the board body 20, and the element-side terminal 22 is disposed in the auxiliary part 30. After the auxiliary part 30 is folded back with respect to the board body 20, the metal support board 11 of the board body 20 and the metal support board 11 of the auxiliary part 30 which are adjacent to each other in a thickness direction are welded. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有低布线密度的电路的紧凑型悬挂板，并提供其制造方法。 解决方案：具有导体图案7的电路的悬挂板包括：安装有磁头38的板体20; 以及从板体20连续形成的辅助部件30.导体图案7包括：设置有外侧端子17和头侧端子16的第一导体图案13; 以及设置有供电侧端子23和元件侧端子22的第二导体图案19.外侧端子17，头侧端子16以及供电侧端子23配置在基板主体20上 元件侧端子22配置在辅助部30中。辅助部30相对于基板主体20折回后，板主体20的金属支撑板11和金属支撑板11 在厚度方向上彼此相邻的辅助部件30被焊接。 版权所有（C）2010，JPO＆INPIT

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