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公开(公告)号：JP5931784B2
公开(公告)日：2016-06-08
申请号：JP2013059151
申请日：2013-03-21
Applicant: シャープ株式会社
Inventor： 入山 明浩
CPC classification number: H01Q1/243 , H05K1/0296 , H05K1/165 , H05K2201/09045 , H05K2201/09263 , H05K2201/0999 , H05K2201/10098 , H05K2201/10265 , H05K2201/2072
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62.发明专利
公开(公告)号：JP2014187549A
公开(公告)日：2014-10-02
申请号：JP2013061034
申请日：2013-03-22
Applicant: Sharp Corp , シャープ株式会社
Inventor： HIKINO NOZOMI , TAKEBE HIROYUKI
CPC classification number: H05K3/0014 , B29C45/14 , B29C45/16 , B29C45/1671 , B29C2045/0079 , B29C2045/1687 , B29K2055/02 , B29K2069/00 , B29L2009/00 , B29L2031/3456 , B29L2031/3481 , H01Q1/243 , H04M1/0202 , H04M1/0249 , H05K1/0284 , H05K1/032 , H05K1/119 , H05K1/165 , H05K3/36 , H05K2201/09018 , H05K2201/09045 , H05K2201/09118 , H05K2201/09472 , H05K2201/09827 , H05K2201/09845 , H05K2201/0999 , H05K2201/10098 , H05K2201/10265 , H05K2201/2036 , H05K2203/1322 , H05K2203/1476
Abstract: PROBLEM TO BE SOLVED: To suppress a conduction defect at the contact point of a conductive pattern to electrically contact to another member, in a structure having the conductive pattern formed on a first resin layer and a second resin layer molded thereon.SOLUTION: A first resin layer (1) includes a covered area covered with a second resin layer (2) and an exposed area (1a). A contact point part (1b) is disposed on the exposed area (1a). Further, a bent part (1c) is disposed between the boundary of the covered area and the exposed area (1a) and the contact point part (1b).
Abstract translation: 要解决的问题：为了抑制导电图案的接触点处的导电缺陷以与其他部件电接触，在具有在第一树脂层上形成的导电图案和在其上模制的第二树脂层的结构中。解决方案：第一 树脂层（1）包括覆盖有第二树脂层（2）和暴露区域（1a）的覆盖区域。 接触点部分（1b）设置在暴露区域（1a）上。 此外，在覆盖区域的边界与露出区域（1a）和接触点部分（1b）之间设置弯曲部分（1c）。
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公开(公告)号：JP2014187431A
公开(公告)日：2014-10-02
申请号：JP2013059151
申请日：2013-03-21
Applicant: Sharp Corp , シャープ株式会社
Inventor： IRIYAMA AKIHIRO
IPC: H01Q1/40
CPC classification number: H01Q1/243 , H05K1/0296 , H05K1/165 , H05K2201/09045 , H05K2201/09263 , H05K2201/0999 , H05K2201/10098 , H05K2201/10265 , H05K2201/2072
Abstract: PROBLEM TO BE SOLVED: To prevent exfoliation between the boundary surfaces of a conductive pattern and a second resin layer in a structure having the second resin layer molded on a first resin layer having the formed conductive pattern.SOLUTION: A step difference part (5) is provided on a first resin layer (3) along the shape of at least a part of a conduction pattern (2). The first resin layer (3) closely adheres to a second resin layer (4) at the step difference part (5).
Abstract translation: 要解决的问题：为了防止在具有形成的导电图案的第一树脂层上模制有第二树脂层的结构中的导电图案和第二树脂层的边界面之间的剥离。解决方案：步进差异部分（5） 沿着导电图案（2）的至少一部分的形状设置在第一树脂层（3）上。 第一树脂层（3）在台阶差部分（5）处与第二树脂层（4）紧密结合。
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公开(公告)号：JP5591276B2
公开(公告)日：2014-09-17
申请号：JP2012085980
申请日：2012-04-05
Applicant: 三菱電機株式会社
CPC classification number: H05K1/182 , H01F27/22 , H01F27/2852 , H01F27/306 , H05K2201/086 , H05K2201/09063 , H05K2201/10265 , H05K2203/1572
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公开(公告)号：JP5577161B2
公开(公告)日：2014-08-20
申请号：JP2010131596
申请日：2010-06-09
Applicant: 日立オートモティブシステムズ株式会社
IPC: H05K3/32 , H01L21/607 , H01R4/02 , H01R43/02 , H05K1/18
CPC classification number: H01R43/0207 , H01R4/029 , H01R12/57 , H05K3/328 , H05K2201/10265 , H05K2203/0285
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Patent Agency Ranking
公开(公告)号：JP5533881B2
公开(公告)日：2014-06-25
申请号：JP2011540398
申请日：2010-10-20
Applicant: 日本電気株式会社
Inventor： 尚志 石田
CPC classification number: H05K1/0236 , H05K1/0233 , H05K1/141 , H05K2201/09727 , H05K2201/10265 , H05K2201/10704 , H05K2201/10734 , Y10T29/49155
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公开(公告)号：JP2012054605A
公开(公告)日：2012-03-15
申请号：JP2011247846
申请日：2011-11-11
Applicant: Michelin Recherche & Technique Sa , Soc De Technol Michelin , ソシエテ ド テクノロジー ミシュラン , ミシュラン ルシェルシュ エ テクニーク ソシエテ アノニム
Inventor： JC SINETO , ARTHUR R METCALF
IPC: H05K7/00 , B60C23/04 , H01R4/02 , H01R4/20 , H01R13/58 , H01R43/02 , H02G11/00 , H05K3/30 , H05K3/34
CPC classification number: H01R43/0256 , B29D2030/0072 , B29D2030/0083 , B60C23/0452 , B60C23/0493 , H01R4/02 , H01R4/20 , H01R13/58 , H01R13/5808 , H01R13/5845 , H01R2201/02 , H01R2201/26 , H05K3/301 , H05K3/305 , H05K3/3421 , H05K2201/0133 , H05K2201/10265 , H05K2201/10287 , H05K2203/1194 , Y10S439/947
Abstract: PROBLEM TO BE SOLVED: To provide a strain tolerance electrical connection structure, and to provide a forming method of the same.SOLUTION: Wire and other conductive lead wires 30 are connected to an electric circuit 40 in a manner as forming a connection superior in tolerance for mechanical stresses, such as movement or rotation of the lead wire 30 with respect to the electric circuit 40. A material for generating an area which reduces the deflection property or improves the rigidity near a connecting point is formed around the lead wire 30 and near the connecting point to the electric circuit 40. The lead wire can be formed into a coil shape or into a shape which gives the capability of enduring the mechanical stresses.
Abstract translation: 要解决的问题：提供应变公差电连接结构，并提供其形成方法。 电线和其他导电引线30以形成对机械应力公差优良的连接的方式连接到电路40，例如引线30相对于电路40的移动或旋转 在引线30周围和靠近电路40的连接点附近形成用于产生减小偏转特性或提高连接点附近的刚性的区域的材料。引线可以形成为线圈形状或 具有承受机械应力的能力的形状。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2011124200A
公开(公告)日：2011-06-23
申请号：JP2010051832
申请日：2010-03-09
Applicant: Kitagawa Ind Co Ltd , 北川工業株式会社
Inventor： KURITA TOMOHISA , YUMI HIDEO , NAKAMURA TATSUYA , CHIKADA KENJI , KITANO HIROKI
CPC classification number: H01R12/57 , H01R13/2442 , H01R13/245 , H01R43/205 , H05K1/0215 , H05K9/0016 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/0195 , Y02P70/611
Abstract: PROBLEM TO BE SOLVED: To provide a connecting element capable of automatic mounting by using a suction nozzle without changing product characteristics and suitably securing a stroke. SOLUTION: An elastic contact section 3 pressed against a grounding conductor by deforming elastically is connected with one end 2B of a solder-connecting section 2 of the connecting element 1 where a lower surface 2A is to be a solder joint surface. A rectangular hole 3C is formed between a folded section 3A and a tip 3B of the elastic contact section 3. A suction section 4 is connected to the other end 2C of the solder-connecting section 2, and the tip 4B of the suction section 4 is bent in a direction parallel to the solder-connecting section 2, and exposed at an upper surface side of the elastic contact section 3 by penetrating the hole 3C of the elastic contact section 3. The elastic contact section 3 can be restrained from generating distortion even if the suction nozzle is pushed to an upper surface of the suction section 4 since the tip 4B of the suction section 4 is sucked with the suction nozzle of an automatic mounting machine, and product characteristics of the connecting element 1 can be stably maintained. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供一种能够通过使用吸嘴自动安装而不改变产品特性并适当地确保冲程的连接元件。 解决方案：弹性接触部分3通过弹性变形而压靠接地导体与连接元件1的焊接连接部分2的一端2B连接，其中下表面2A将作为焊接表面。 在弹性接触部分3的折叠部分3A和尖端3B之间形成矩形孔3C。抽吸部分4连接到焊料连接部分2的另一端2C，并且抽吸部分4的尖端4B 在平行于焊料连接部2的方向上弯曲，并且通过穿过弹性接触部3的孔3C而暴露在弹性接触部3的上表面侧。弹性接触部3可以被抑制而产生变形 由于吸引部4的前端部4B被自动安装机的吸嘴吸引，所以即使将吸嘴推到吸引部4的上表面，也能够稳定地维持连接体1的产品特性。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JPWO2009001944A1
公开(公告)日：2010-08-26
申请号：JP2009520655
申请日：2008-06-27
IPC: H01F41/04
CPC classification number: H01F41/0246 , H01F17/04 , H01F27/255 , H01F2017/048 , H05K1/0373 , H05K1/165 , H05K3/103 , H05K3/20 , H05K2201/0215 , H05K2201/083 , H05K2201/09118 , H05K2201/10265 , H05K2201/10287
Abstract: 本発明の磁性体の製造方法は、成形空間中に絶縁磁性粉末を堆積して押圧成形し、該押圧成形によって固化される表面に配線を形成する磁性体の製造方法であって、シート状の基材と、当該基材上に形成され当該基材から離脱可能な配線とを有する配線基材を準備する第1工程S10と、前記成形空間中に前記絶縁磁性粉末を堆積した後、前記絶縁磁性粉末の表面に、前記配線が対向するように当該配線基材を配置し、これらを押圧成形する第2工程S20と、固化した前記絶縁磁性粉末の表面から前記配線を残して前記基材を取除く第3工程S30とをこの順序で含む。本発明の磁性体の製造方法によれば、絶縁磁性粉末が腐食することが防止され、信頼性の高い磁性体を製造することが可能となる。
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公开(公告)号：JP4456149B2
公开(公告)日：2010-04-28
申请号：JP2007513492
申请日：2005-05-27
Applicant: モレックス インコーポレイテドMolex Incorporated
CPC classification number: H01R4/028 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/81012 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01R12/52 , H01R12/57 , H01R12/714 , H01R13/2407 , H01R13/2464 , H05K3/325 , H05K2201/0311 , H05K2201/10265 , H05K2201/10719 , H05K2201/10946 , H01L2224/29099 , H01L2224/05599
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