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    Multilayer printed circuit board and method of manufacturing the same
    6.
    发明专利
    Multilayer printed circuit board and method of manufacturing the same 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：JP2014107552A

    公开(公告)日：2014-06-09

    申请号：JP2013233798

    申请日：2013-11-12

    Applicant: Zhen Ding Tech Co Ltd ,  臻鼎科技股▲ふん▼有限公司

    Inventor： SHIU SHR-BIN

    IPC: H05K3/46 ,  H05K1/14

    CPC classification number: H05K3/4694 ,  H05K1/111 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09445 ,  H05K2201/09472 ,  Y10T156/1064

    Abstract: PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board and a method of manufacturing the same.SOLUTION: The multilayer printed circuit board includes a multilayer substrate and a first high-density circuit board. The multilayer substrate includes a base layer, a first conductive circuit layer which is formed on one side of the base layer, a plurality of first insulation material layers and a plurality of third conductive circuit layers which are successively and alternately laminated on the first conductive circuit layer. A first housing part is formed within the plurality of first insulation material layers and the plurality of third conductive circuit layers, and the first conductive circuit layer is partially exposed from the first housing part and constitutes a plurality of electric contact pads. The first high-density circuit board includes a plurality of first high-density circuit layers and a plurality of third insulation material layers which are alternately installed on each other. An outermost first high-density circuit layer on one side of the first high-density circuit board includes a plurality of third electric contact pads, the first high-density circuit board is installed in the first housing part, and the plurality of third electric contact pads are respectively electrically connected to the plurality of first electric contact pads.

    Abstract translation: 要解决的问题：提供一种多层印刷电路板及其制造方法。解决方案：多层印刷电路板包括多层基板和第一高密度电路板。 所述多层基板包括基底层，形成在所述基底层一侧的第一导电电路层，多个第一绝缘材料层和多个第三导电电路层，所述多个第三导电电路层依次交替层叠在所述第一导电电路 层。 第一壳体部分形成在多个第一绝缘材料层和多个第三导电电路层内，并且第一导电电路层部分地从第一壳体部分露出并且构成多个电接触焊盘。 第一高密度电路板包括彼此交替地安装的多个第一高密度电路层和多个第三绝缘材料层。 第一高密度电路板一侧的最外面的第一高密度电路层包括多个第三电接触焊盘，第一高密度电路板安装在第一壳体部分中，并且多个第三电接触 焊盘分别电连接到多个第一电接触焊盘。

    Printed circuit board manufacturing method
    7.
    发明专利
    Printed circuit board manufacturing method 有权
    印刷电路板制造方法

    公开(公告)号：JP2014093527A

    公开(公告)日：2014-05-19

    申请号：JP2013225962

    申请日：2013-10-30

    Applicant: Samsung Electro-Mechanics Co Ltd ,  サムソン エレクトロ−メカニックス カンパニーリミテッド.

    Inventor： YOU KWANG SUN ,  LEE SEUNG RYEOL ,  PARK SANG HOON ,  HEO KYUNG JIN ,  SHIN JAE HO ,  JUNG JOONG HYUK

    IPC: H05K3/46 ,  H05K3/00

    CPC classification number: H05K3/007 ,  H05K3/0032 ,  H05K3/4007 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/09472 ,  H05K2203/061 ,  H05K2203/308

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method which can improve reliability of an inner layer pad and preliminarily prevent a problem of the inner layer pad caused by an etchant.SOLUTION: A printed circuit board manufacturing method of the present embodiment comprises: a step of preparing a base substrate on which a circuit layer including an inner layer pad and a circuit pattern is formed on one surface or on the other surface; a step of forming a peeling insulation layer on an exterior surface of the inner layer pad of the circuit layer; a step of forming on a base substrate having the peeling insulation layer and the circuit layer, a first insulation layer having an opening corresponding to the peeling insulation layer; a step of forming a CCL (Copper Clad Laminate) layer on the first insulation layer so as to bring a stopper first metal layer in contact with a top face of the peeling insulation layer exposed through the opening; a step of performing laser processing on the CCL layer to perform cavity fabrication so as to expose an edge part of a top face of the first metal layer; a step of removing the exposed first metal layer in a thickness direction; a step of removing the peeling insulation layer exposed by removal of the first metal layer in a thickness direction; a step of isolating a first metal layer brought into contact with the peeling insulation layer and the peeling insulation layer; and a step of removing the peeling insulation layer.

    Abstract translation: 要解决的问题：提供一种可以提高内层焊盘的可靠性并预先防止由蚀刻剂引起的内层焊盘的问题的印刷电路板的制造方法。本实施方式的印刷电路板的制造方法包括： 制备在其一面或另一表面上形成有内层焊盘和电路图案的电路层的基底基板的步骤; 在电路层的内层焊盘的外表面上形成剥离绝缘层的工序; 在具有剥离绝缘层和电路层的基底基板上形成具有对应于剥离绝缘层的开口的第一绝缘层; 在所述第一绝缘层上形成CCL（铜包覆层叠体）层的步骤，以使所述第一绝缘层与所述剥离绝缘层的通过所述开口暴露的顶面接触; 对所述CCL层进行激光加工以执行腔体制造以暴露所述第一金属层的顶面的边​​缘部分的步骤; 在厚度方向上去除暴露的第一金属层的步骤; 除去通过在厚度方向上移除第一金属层而露出的剥离绝缘层的步骤; 隔离与剥离绝缘层和剥离绝缘层接触的第一金属层的步骤; 以及去除剥离绝缘层的步骤。

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