Abstract:
PROBLEM TO BE SOLVED: To provide a compact vehicular lamp by miniaturizing a control circuit part and miniaturizing a unit by close arrangement to an LED light source assembly part. SOLUTION: This vehicular lamp is provided with: the LED light source assembly part 55 having a plurality of LEDs 10 in a lamp chamber 3 comprising a lamp body 1 and a front cover 2 located in front of the lamp body 1; and the control circuit part 56 located behind the LED light source assembly part 55. The LEDs 10 are electrically connected to a conductive bus bar, and have a light emitting surface formed at a position facing to the front cover 2; the control circuit part 56 has circuit elements electrically connected to a conductive bus bar and is formed on the back side of the light emitting surface of the LED light source assembly part 55 with respect to the front cover 2; and the bus bar with the LEDs fixed thereto and the bus bar with the circuit elements fixed thereto are electrically connected to each other. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component holder of advantage for manufacturability and economical efficiency without the increase in parts count or assembly man-day, and also without substantial increase in manufacturing cost, which can prevent the electronic component from omission by securing simply and firmly the lead of the electronic component. SOLUTION: The electronic component holder made of synthetic resin is constituted such that: two or more horizontal grooves 3 making the electronic component leads pass from an opening 6 in front of the holder are formed in an upper surface 7 of the holder, and two or more vertical grooves 4 making the electronic component leads pass by bending them almost at right angles are formed in a rear surface 8 of the holder. As a lead fixing means for carrying out pinch pressure fixing of the lead by using the resiliency of the synthetic resin, an electronic component holder H is used wherein synthetic resin ribs 13a and 13b are formed integrally along the vertical grooves 4 so that the width of the upper end of the vertical groove 4 may be made larger than the diameter of the lead, and the groove width of the lower end may be narrower than the diameter of the lead. Thus, the lead is fixed by pinch pressure fixing by using the resiliency of the synthetic resin ribs 13a and 13b so as to prevent the electronic component from omission. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board assembly and an electronic device utilizing the printed circuit board assembly. SOLUTION: A printed circuit board assembly is used for providing electrical connection between multiple electronic elements, and comprises a first printed circuit board having a first conductor pattern and a second printed circuit board having a second conductor pattern. The first printed circuit board is positioned horizontally above the second printed circuit board, and has an area that is smaller than that of the second printed circuit board. The first conductor pattern of the first printed circuit board is electrically connected to the second conductor pattern of the second printed circuit board. The printed circuit board assembly can replace a conventional multilayer wiring board, and is manufactured at a lower cost. An electronic device utilizing the printed circuit board assembly is manufactured at a lower cost. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To prevent a poor soldering caused by a gas which occurs at the time of soldering electronic parts to a circuit board. SOLUTION: A pair of through-holes 10 are formed on a circuit board 1, and a formed land 11 is connected to both sides of the circuit board 1 with a silver paste 12 filled in the through-holes 10. When the silver paste 12 is solidified, the silver paste 12 becomes a projection 15 which upheaves in the curved shape from the both sides of the circuit board 1. The front surface of the projection 15 is coated with an overcoat 13, and electronic parts 5 are contacted with the projection 15 to form an air gap S for degassing between the electronic parts 5 and the circuit board 1. The gas occurring at the time of soldering passes through the air gap S between the electronic parts 5 and the circuit board 1, from a pierced hole 4 threading a lead terminal 5A, and escapes outside. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a light emitting diode module in which heat resistance and endurance are improved and, at the same time, heat dissipation efficiency is also improved, and to provide a backlight assembly equipped with it and a display device equipped with it. SOLUTION: The light emitting diode module has a printed-circuit board (PCB) which has a plurality of bonding holes; a plurality of light emitting diodes (LED) which have a light emitter which generates light, and a lead in which one side is electrically connected to the light emitter and the other side is located in the bonding hole; and a cement which is filled with the bonding hole in which the lead is located. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-mount electronic device with a lead capable of preventing a soldered part from being broken resulting from a difference in thermal expansion coefficients between a printed circuit board and a ceramic package, in a surface-mount electronic component with a mounting terminal provided to the bottom of an insulating package, such as the ceramic package. SOLUTION: In this piezoelectric vibrator provided with the insulating package 2 having a recessed part 3 at the bottom surface, a piezoelectric vibration element 5 arranged in the recessed part, a metal lid 7 for sealing the lower opening of the recessed part, and metal lead terminals 15 whose top parts are electrically and mechanically connected and fixed to external terminals 10 and 12 provided to the outer surface of the insulating package and whose lower parts are made to project below the metal lid, a metal lead terminal is composed of a drooping part 15b extending along the side face of the insulating package and a connection part 15c extending from the lower part of the drooping part, wherein the drooping part and the connection part are freely and elastically deformable in an unconfined state. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a fixing structure of electronic elements in which less number of constituting components is required and an electronic element such as LED is attached to or detached from a wiring such as bus bar by one step. SOLUTION: The fixing structure 13 provided with bus bars 11P and 11N made from a conducting plate material connected to a power source, and an LED3 in which electrodes 33P and 33N are fixed to the bus bar for power supply. Further, fixing parts 12P and 12N of the bus bar comprise positioning members 132-134 for positioning the lead electrodes and an elastic contact member 131 which elastically holds the lead electrode. The positioning member and elastic contact member are formed by bending a part of the bus bar. No separate component is required besides the bus bar, allowing constitution with minimum components. At attaching/detaching, only the LED is pressed down or pulled up from the fixing part of the bus bar in the direction perpendicular to the surface of bus bar, for easy operation. COPYRIGHT: (C)2006,JPO&NCIPI